PIC32MX130F256D-V/TL - 40MHz 32-bit MCU 256KB Flash 44-VTLA | Microchip
Teilenummer: PIC32MX130F256D-V/TL ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.77 | $3,77 |
| 10 | $3.4 | $34,00 |
| 100 | $2.85 | $285,00 |
| 500 | $2.45 | $1.225,00 |
| 1.000 | $2.1 | $2.100,00 |
PIC32MX130F256D-V/TL Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory, working RAM, and a rich set of peripherals on one die. PIC32MX devices are positioned in Microchip's 32-bit MCU hierarchy: PIC32MX -> MIPS M4K core -> 32-bit microcontroller -> embedded processor -> semiconductor IC. Within the broader PIC32 family the PIC32MX1XX/2XX 28/36/44-pin sub-family targets cost-sensitive general-purpose designs, sitting below the higher-pin-count PIC32MX3/4/5/6/7 series and above the 16-bit PIC24/dsPIC families.
Key features include 256 KB Flash and 16 KB SRAM, 40 MHz core with 1.55 DMIPS/MHz efficiency, Peripheral Pin Select for flexible signal routing, two I2S/SPI modules targeting audio codecs, a 16-bit Parallel Master Port for graphics, 10-bit 1 Msps ADC with on-chip temperature diode, mTouch capacitive-touch support, RTCC, CTMU, USB 2.0 full-speed OTG, and 5 CCP/IC/OC/PWM timers. The MIPS M4K pipeline issues one instruction per cycle and integrates hardware multiply/divide, supporting C compiled code at usable clock rates without wait states from Flash. The 16-bit PMP can address external memories or drive parallel displays, while PPS remaps most digital peripherals to almost any I/O - eliminating the pin-fix limitations of older PIC designs.
Typical applications include automotive body and infotainment modules, industrial HMI panels, USBN-over-IP peripherals, mTouch user interfaces, audio playback and codec interfacing, and battery-powered sensing. The exposed pad aids thermal dissipation at 40 MHz; designers should solder the EP to a continuous ground plane for rated electrical and thermal performance.
When designing with this part, observe the 2.3 V-3.6 V supply range and provide adequate decoupling per the family datasheet. The V/TL suffix indicates the automotive (-V) temperature grade and tape-and-reel packaging.
Drop-in-Alternativen für PIC32MX130F256D-V/TL – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MX130F256D-V/TL (gleiche Bauform und Footprint) – abweichend in Package, ADC, Operating Temperature, Core Architecture, Timers.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MX130F256DT-V/TL
✅ Drop-In✓ Auf Lager
$4.61 / Stück
Datenblatt ansehen →PIC32MX130F256D-50I/TL
✅ Drop-In✓ Auf Lager
$3.42 / Stück
Datenblatt ansehen →PIC32MX230F256D-V/TL
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX130F064D-V/ML
✅ Drop-In✓ Auf Lager
$2.15 / Stück
Datenblatt ansehen →PIC32MX130F256B-V/SS
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.1 / Stück
Datenblatt ansehen →PIC32MX130F256D-V/TL Grenzwerte & elektrische Eigenschaften
| Core | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 40 MHz (83 DMIPS) |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Data SRAM | 16 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| Gehäuse | 44-VTLA (6x6 mm) with exposed pad |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +105C (automotive -V grade) |
| Active Current Consumption | 0.5 mA/MHz (typical) |
| Peripheral Pin Select (PPS) | Yes |
| I2S / SPI Modules | 2 |
| Parallel Master Port (PMP) | 16-bit, for graphics interfaces |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| ADC | 10-bit, 1 Msps, with on-chip temperature sensor |
| CTMU / mTouch | Yes - Capacitive touch buttons and sliders |
| Timers | 5 x 16-bit (Capture/Compare/PWM) |
| Connectivity | I2C, SPI, UART, IrDA, LINbus, PMP |
| Automotive Qualification | AEC-Q100 |
| RoHS-Status | Compliant |
PIC32MX130F256D-V/TL Pin-Konfiguration
| Pin 1 | RPB0 — Remappable I/O / AN0 / PGED1 |
| Pin 2 | RPB1 — Remappable I/O / AN1 / PGEC1 |
| Pin 3 | RPB2 — Remappable I/O / AN2 / CVREF- / VBUS |
| Pin 4 | RPB3 — Remappable I/O / AN3 / CVREF+ |
| Pin 5 | VSS — Ground |
| Pin 6 | VDD |
Typische Anwendungen
PIC32MX130F256D-V/TL ist geeignet für 6 Anwendungs: Automotive Body Electronics Modules, Industrial HMI with mTouch, USB Audio / Codec Peripheral, Battery-Powered IoT Sensor Node, Medical Patient Monitoring (Non-Critical), Smart Home / Consumer IoT Bridge.
Automotive Body Electronics Modules
The PIC32MX130F256D-V/TL suits BCM, lighting controllers, and door/window node modules because of its AEC-Q100 qualification (-40C to +105C), 256 KB Flash for CAN/LIN stacks plus bootloader overhead, and integrated CTMU/mTouch for capacitive switch panels. At 0.5 mA/MHz active current and 40 MHz, the part delivers 83 DMIPS - enough for low-rate signal processing while staying within automotive quiescent budgets. The 16 KB SRAM accommodates CANopen/LIN buffering plus diagnostic logs, while Peripheral Pin Select allows flexible PCB routing when pin assignments change during design iterations.
Empfohlen
Industrial HMI with mTouch
For human-machine interface panels with capacitive touch buttons/sliders, the PIC32MX130F256D-V/TL provides on-chip CTMU + mTouch hardware for up to ~32 touch channels without external ICs. The 16-bit Parallel Master Port (PMP) drives small monochrome or low-color LCDs directly, while 256 KB Flash holds full MPLAB Harmony v3 USB + GUI libraries. At 40 MHz the part refreshes 320x240 QVGA panels comfortably; PPS re-assigns touch channels to any spare pin when the PCB layout evolves late in development.
Empfohlen
USB Audio / Codec Peripheral
USB 2.0 Full-Speed OTG combined with two I2S/SPI modules makes PIC32MX130F256D-V/TL a good fit for USB audio DACs/ADCs, headsets, and conferencing speakerphones. The 256 KB Flash fits USB Audio Class 1.0/2.0 stacks plus DSP algorithms; 16 KB SRAM ping-pongs 16-bit/48 kHz stereo streams. The 40 MHz MIPS M4K core executes biquad filters with ample margin, while the 10-bit ADC supports sidetone and button-press sensing on the same chip.
Empfohlen
Battery-Powered IoT Sensor Node
With 0.5 mA/MHz active current plus low-power sleep modes, PIC32MX130F256D-V/TL powers battery-driven sensors, BLE bridges, and remote telemetry nodes from a Li-ion cell. The 10-bit ADC with on-chip temperature diode simplifies thermistor/battery monitoring without external sensors, and 256 KB Flash holds full wireless stacks. PPS re-routes peripheral pins when the schematic changes, while the compact 44-VTLA 6x6 mm package fits miniature enclosures.
Empfohlen
Medical Patient Monitoring (Non-Critical)
For non-life-critical patient monitors (fitness, wearables, telehealth peripherals), the PIC32MX130F256D-V/TL provides 40 MIPS for SpO2/ECG signal preprocessing, USB for PC data transfer, and mTouch for button/slider input. AEC-Q100 qualification, while automotive, also signals high reliability for medical-adjacent applications. The 16 KB SRAM buffers 1 kHz ECG samples without DMA starvation, while 256 KB Flash stores RTOS plus DSP routines.
Empfohlen
Smart Home / Consumer IoT Bridge
The PIC32MX130F256D-V/TL bridges ZigBee/Wi-Fi/Sub-GHz radios to USB or cloud uplinks in smart-home gateways, with USB OTG handling local PC sync. 256 KB Flash holds multi-protocol stacks (Zigbee 3.0, Matter, BLE), 16 KB SRAM manages mesh routing tables, and PMP/QSPI drive status LCDs. PPS allows re-tasking UART/SPI/I2C peripherals when reference designs evolve.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MX130F256D-V/TL – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MX130F256DT-V/TL | PIC32MX130F256D-50I/TL | PIC32MX230F256D-V/TL | PIC32MX130F064D-V/ML | PIC32MX130F256B-V/SS |
|---|---|---|---|---|---|---|
| Package | 44-VTLA (6x6 mm) | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA (6x6 mm) - same | 44-VTLA sibling - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Maximum CPU Frequency | 40 MHz (83 DMIPS) | 40 MHz (83 DMIPS) | 50 MHz | 50 MHz | 40 MHz (83 DMIPS) | 40 MHz (83 DMIPS) |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 64 KB (-75%) | 256 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 8 KB (-50%) | 16 KB |
| Temperature Grade | -40C to +105C (AEC-Q100) | -40C to +105C (AEC-Q100) | -40C to +85C (industrial) | -40C to +105C (AEC-Q100) | -40C to +105C (AEC-Q100) | -40C to +105C (AEC-Q100) |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
Wichtigste Unterscheidungsmerkmale
- AEC-Q100 automotive grade in compact 44-VTLA 6x6 mm (vs. PIC32MX130F256D-I/PT (industrial grade, TQFP))
- Integrated mTouch CTMU on-chip - no external touch IC (vs. PIC32MX230F256D-V/TL)
- 256 KB Flash + 16 KB SRAM for full USB + GUI stacks (vs. PIC32MX130F064D-V/ML)
Designhinweise
Decouple each VDD/VSS pair with 0.1 uF ceramic placed within 3 mm of the pin, plus a single 10 uF bulk capacitor near the supply pin. Power the analog and digital VDD pins from the same 3.3 V LDO rail; the device does not require separate AVDD/AVSS. For USB applications provide 0.1 uF on VBUS plus a current-limiting series resistor per the family reference schematic. Estimated: total decoupling budget is 5x 0.1 uF + 1x 10 uF for a 44-VTLA part.
The 44-VTLA exposed pad is the primary heat-dissipation path. Solder the EP to a continuous ground copper pour of at least 25 mm^2 with thermal vias to an inner ground plane. Estimated: theta_JA drops from ~50 C/W (no EP solder) to ~25 C/W with proper EP soldering, allowing 40 MHz operation in -40C to +105C ambient. Always confirm EP solder joint integrity via X-ray or cross-section on first prototypes.
Route the 40 MHz clock traces first, keeping them short and adjacent to a ground pour. USB DP/DM traces must be 90-ohm differential, length-matched within 150 mil, and free of stubs. The 2-wire ICSP pins (PGECx/PGEDx) must be brought to a test header for in-circuit programming. Use Microchip's 'Pin Manager' plugin in MPLAB X to remap peripherals via PPS instead of rewiring the PCB.
Do NOT leave any VDD pin floating - each VDD/VSS pair must be powered and grounded even if internal logic is unused. Configuration bits must be set for proper clock source and watchdog state at programming time; otherwise the part may lock up. The -V suffix indicates automotive temperature grade - do not substitute -I industrial grade into AEC-Q100 production.
Compliance-Informationen
AEC-Q100 automotive grade per Microchip product page. RoHS and REACH compliant per DigiKey listing. Conflict minerals reporting compliant per Microchip corporate disclosures.
