PIC32MX230F128H-V/MR - 32-bit MCU, 128KB Flash, 64-QFN | Microchip
Teilenummer: PIC32MX230F128H-V/MR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.2 | $7,20 |
| 10 | $6.55 | $65,50 |
| 100 | $5.95 | $595,00 |
| 500 | $5.4 | $2.700,00 |
| 1.000 | $4.95 | $4.950,00 |
PIC32MX230F128H-V/MR Übersicht
An MCU (Microcontroller Unit) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and programmable peripherals such as ADC, timers, communication controllers, and I/O pins. The PIC32MX2XX family occupies the entry-level to mid-range tier of Microchip's 32-bit PIC32 portfolio, positioned between the PIC32MX1XX/5XX series and the higher-end PIC32MX3XX/4XX/6XX/7XX devices, all sharing the MIPS32 M4K core architecture for instruction-set compatibility across the family.
Key features include 128 KB Flash organized as 128K x 8, 16 KB RAM, a 10-bit ADC with up to 28 input channels, four SPI/I2S modules, two I2C modules, and USB 2.0 Full-Speed On-The-Go (OTG) capability. The device also integrates Peripheral Pin Select (PPS), a Parallel Master Port (PMP) with dual read/write buffers for graphics interfaces, and a Charge Time Measurement Unit (CTMU) for capacitive touch and time-based sensing applications.
The PIC32MX230F128H is built on a 5-stage pipelined MIPS32 M4K RISC core running at 40 MHz (the V-temp automotive grade part). The M4K core supports the MIPS16e ISA extension for code compression, achieving up to 1.65 DMIPS/MHz and 3.45 CoreMark/MHz, while consuming low core power. An integrated 8 MHz internal FRC oscillator provides clock flexibility, and the integrated USB 2.0 Full-Speed OTG controller enables direct device/host/OTG connectivity without external PHY.
Typical applications include automotive infotainment human-machine interfaces (HMI), USB peripherals (Human Interface Devices like keyboards, mice, and game controllers), industrial control panels with capacitive touch buttons (via CTMU), low-cost graphics interfaces through the PMP peripheral, and audio playback products using the I2S interface with external DACs. The combination of USB OTG, capacitive touch, and graphics PMP makes this part particularly attractive for automotive HMI and consumer electronics with HMI.
When designing with this device, ensure that the 2.3 V to 3.6 V supply rail is well decoupled with a 10 uF bulk + 0.1 uF high-frequency ceramic pair near each VDD pin. The PPS feature lets the engineer remap peripheral signals to most digital I/O pins, but once assigned, the pin map must be locked before code freeze to avoid PCB rework. The V temperature grade limits operation to -40C to +105C.
This page synthesizes XAIPART distributor pricing for the V/MR temperature/package combination, drop-in V/MR-package alternatives from the PIC32MX230F family, and practical design notes not found on the manufacturer datasheet.
Drop-in-Alternativen für PIC32MX230F128H-V/MR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MX230F128H-V/MR (gleiche Bauform und Footprint) – abweichend in Package, ADC, Timers, Program Memory (Flash), USB.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MX230F128H-I/MR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX230F128HT-V/MR
✅ Drop-In✓ Auf Lager
$4.32 / Stück
Datenblatt ansehen →PIC32MX230F128H-50I/MR
✅ Drop-In✓ Auf Lager
$3.28 / Stück
Datenblatt ansehen →PIC32MX230F064DT-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2.31 / Stück
Datenblatt ansehen →PIC32MX230F064D-V/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.96 / Stück
Datenblatt ansehen →PIC32MX150F256H-V/MR
✅ Drop-In✓ Auf Lager
$4.74 / Stück
Datenblatt ansehen →PIC32MX230F128H-V/MR Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 M4K |
| Core Bit Width | 32-bit |
| Maximum CPU Speed | 40 MHz |
| DMIPS Performance | 52 DMIPS (1.3 DMIPS/MHz) |
| MIPS16e Code Compression | Yes |
| Program Flash Memory | 128 KB (128K x 8) |
| SRAM | 16 KB |
| Operating Voltage (VDD) | 2.3 V to 3.6 V |
| I/O Pins | 49 |
| Gehäuse | 64-pin QFN (9x9 mm) with exposed pad |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +105C (V-temp grade) |
| ADC | 10-bit, up to 28 channels |
| USB | USB 2.0 Full-Speed OTG controller |
| SPI / I2S Modules | 4 SPI, 2 dedicated I2S |
| I2C Modules | 2 |
| UART Modules | 2 |
| PMP (Parallel Master Port) | Yes, with dual read/write buffers |
| Peripheral Pin Select (PPS) | Yes |
| CTMU (Charge Time Measurement Unit) | Yes |
| Timers | 5 16-bit timers / 2 32-bit timers |
| Automotive Grade (AEC-Q100) | Yes (V-temp grade) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
| MSL (Moisture Sensitivity Level) | 3 |
PIC32MX230F128H-V/MR Pin-Konfiguration
| Pin 1 | RPB9/SDA1/CTED4 — Remappable I/O, I2C1 SDA, CTMU event 4 |
| Pin 2 | RPC6 — Remappable I/O |
| Pin 3 | VDD — Core supply voltage |
| Pin 4 | RPG6/RG6 — Remappable I/O |
| Pin 5 | VSS — Core ground |
| Pin 6 | MCLR — Master clear reset input |
| Pin 7 | RPG7/RG7 — Remappable I/O |
| Pin 8 | RPC7 — Remappable I/O |
| Pin 9 | RPC8 — Remappable I/O |
| Pin 10 | RPC9 — Remappable I/O |
| Pin 11 | VSS — Core ground |
| Pin 12 | VDD — Core supply voltage |
| Pin 13 | AVDD — Analog supply voltage |
| Pin 14 | AVSS — Analog ground |
| Pin 15 | AN15/CVREF — Analog input 15 / comparator voltage reference |
| Pin 16 | AN14 — Analog input 14 |
| Pin 17 | AN13/C2IN- — Analog input 13 / comparator 2 inverting input |
| Pin 18 | AN12/C2IN+ — Analog input 12 / comparator 2 non-inverting input |
| Pin 19 | AN11/C1IN- — Analog input 11 / comparator 1 inverting input |
| Pin 20 | AN10/C1IN+ — Analog input 10 / comparator 1 non-inverting input |
| Pin 21 | AVDD — Analog supply voltage |
| Pin 22 | AVSS — Analog ground |
| Pin 23 | AN9 — Analog input 9 |
| Pin 24 | AN8 — Analog input 8 |
| Pin 25 | AN7 — Analog input 7 |
| Pin 26 | AN6 — Analog input 6 |
| Pin 27 | AN5 — Analog input 5 |
| Pin 28 | AN4 — Analog input 4 |
| Pin 29 | AN3 — Analog input 3 |
| Pin 30 | AN2 — Analog input 2 |
| Pin 31 | AN1 — Analog input 1 |
| Pin 32 | AN0 — Analog input 0 |
| Pin 33 | VREF- — ADC voltage reference negative |
| Pin 34 | VREF+ — ADC voltage reference positive |
| Pin 35 | OA1OUT/AN0 — Op-amp 1 output / analog input 0 |
| Pin 36 | OA1IN-/AN1 — Op-amp 1 inverting input / analog input 1 |
| Pin 37 | OA1IN+/AN2 — Op-amp 1 non-inverting input / analog input 2 |
| Pin 38 | VDD — Core supply voltage |
| Pin 39 | OC1/RPA0 — Output compare 1 / remappable I/O |
| Pin 40 | OC2/RPA1 — Output compare 2 / remappable I/O |
| Pin 41 | OC3/RPA2 — Output compare 3 / remappable I/O |
| Pin 42 | OC4/RPA3 — Output compare 4 / remappable I/O |
| Pin 43 | VDD — Core supply voltage |
| Pin 44 | VSS — Core ground |
| Pin 45 | TDI/RPA8 — JTAG TDI / remappable I/O |
| Pin 46 | TCK/RPA9 — JTAG TCK / remappable I/O |
| Pin 47 | TMS/RPA10 — JTAG TMS / remappable I/O |
| Pin 48 | TDO/RPA11 — JTAG TDO / remappable I/O |
| Pin 49 | SOSCI/RPA13 — Secondary oscillator input / remappable I/O |
| Pin 50 | SOSCO/RPA14 — Secondary oscillator output / remappable I/O |
| Pin 51 | VDD — Core supply voltage |
| Pin 52 | VSS — Core ground |
| Pin 53 | D- — USB D-minus |
| Pin 54 | D+ — USB D-plus |
| Pin 55 | VBUS — USB VBUS sense |
| Pin 56 | VUSB — USB transceiver supply |
| Pin 57 | RPB0/RB0 — Remappable I/O |
| Pin 58 | RPB1/RB1 — Remappable I/O |
| Pin 59 | RPB2/SDA2 — Remappable I/O / I2C2 SDA |
| Pin 60 | RPB3/SCL2 — Remappable I/O / I2C2 SCL |
| Pin 61 | RPB4/RB4 — Remappable I/O |
| Pin 62 | RPB5/RB5 — Remappable I/O |
| Pin 63 | RPB6/PGEC2 — Remappable I/O / ICSP clock |
| Pin 64 | RPB7/PGED2 — Remappable I/O / ICSP data |
Typische Anwendungen
PIC32MX230F128H-V/MR ist geeignet für 6 Anwendungs: Automotive Infotainment HMI, USB HID Peripheral Devices, Industrial Control Panels with Capacitive Touch, Low-Cost Graphics Interfaces via PMP, I2S Audio Playback Devices, IoT Sensor Hub with USB Connectivity.
Automotive Infotainment HMI
The PIC32MX230F128H-V/MR's AEC-Q100 V-temp -40C to +105C qualification makes it ideal for in-cabin automotive HMI products such as climate control panels, seat controller buttons, and rear-seat entertainment remote controls. The 49 GPIO via Peripheral Pin Select (PPS) easily drives segment LCDs via PMP, RGB LED indicators, and capacitive touch buttons via the integrated CTMU module. At 40 MHz with 52 DMIPS, response time is comfortable for animated icons and graphical menu navigation. The integrated USB 2.0 Full-Speed OTG provides a debug/CarPlay-Aux interface without external PHY cost.
Empfohlen
USB HID Peripheral Devices
The integrated USB 2.0 Full-Speed OTG controller with on-chip transceiver makes the PIC32MX230F128H-V/MR ideal for USB keyboards, mice, game controllers, and HID-class peripherals where eliminating external PHY components saves both BOM cost and PCB area. The 128 KB Flash hosts USB stacks plus custom HID report descriptors with margin, while 16 KB SRAM easily accommodates HID input buffers and queue structures. The automotive V-temp grade supports ruggedized commercial and industrial peripherals used in demanding environments such as warehouse scanners or factory-floor operator panels.
Empfohlen
Industrial Control Panels with Capacitive Touch
The CTMU (Charge Time Measurement Unit) integrated into the PIC32MX230F128H-V/MR provides native capacitive touch sensing without an external controller, supporting button matrices, sliders, and proximity sensors behind glass overlays. The V-temp -40C to +105C grade handles factory-floor thermal environments where machinery exhaust heats the panel chassis. The 10-bit ADC with up to 28 channels reads thermocouples and process variables concurrently with touch scanning, while the USB OTG port provides a service/diagnostic interface for technicians to download firmware or pull operational logs.
Empfohlen
Low-Cost Graphics Interfaces via PMP
The Parallel Master Port (PMP) with dual read/write buffers in the PIC32MX230F128H-V/MR drives small graphical TFT displays (typically 2.4" to 4.3") without an external graphics controller. The 128 KB Flash stores frame buffers and full-screen UI assets; the 16 KB SRAM holds one full-screen buffer at typical QVGA resolution. The PPS feature maps the PMP data, address, and control signals to most digital I/O pins, simplifying PCB routing. The V-temp automotive grade allows dashboard accessory displays and small rear-seat touch panels to use this MCU.
Empfohlen
I2S Audio Playback Devices
The four SPI/I2S modules (including two dedicated I2S) in the PIC32MX230F128H-V/MR connect to external audio DACs for hi-fi audio playback products such as Bluetooth speakers, sound bars, or portable audio docks. The 40 MHz M4K core handles audio sample-rate buffering, EQ, and basic effects without DSP overhead. The V-temp grade supports sealed automotive audio amplifiers where internal ambient temperatures exceed the 85C industrial limit. The USB OTG controller accepts audio streaming from a host or removable drive in addition to I2S peripherals.
Empfohlen
IoT Sensor Hub with USB Connectivity
The PIC32MX230F128H-V/MR is well-suited to industrial IoT sensor hubs that aggregate data from I2C sensors and forward to a host via USB. The two I2C controllers run multi-master sensor networks (temperature, humidity, pressure), the four SPI/I2S channels interface with wireless modules or display panels, and the USB OTG provides either host mode (USB stick logging) or device mode (gateway forwarding). The V-temp -40C to +105C grade handles outdoor installations and rooftop IoT equipment, and the AEC-Q100 qualification eases automotive fleet-management sensor deployments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MX230F128H-V/MR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MX230F128H-I/MR | PIC32MX230F128HT-V/MR | PIC32MX230F128H-50I/MR | PIC32MX230F064DT-I/ML | PIC32MX150F256H-V/MR |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (8x8 mm) - same family | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 40 MHz / 52 DMIPS | 40 MHz / 52 DMIPS | 40 MHz / 52 DMIPS | 50 MHz / 83 DMIPS | 40 MHz / 52 DMIPS | 40 MHz / 52 DMIPS |
| Flash | 128 KB | 128 KB | 128 KB | 128 KB | 64 KB | 256 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 8 KB | 16 KB |
| Temperature Grade | V-temp -40C to +105C (AEC-Q100) | I-temp -40C to +85C | V-temp -40C to +105C (AEC-Q100) | I-temp -40C to +85C | I-temp -40C to +85C | V-temp -40C to +105C (AEC-Q100) |
| USB 2.0 FS OTG | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) | No (USB removed) |
| Dedicated I2S Modules | 2 | 2 | 2 | 2 | 2 | 0 |
| Unit Price (1 qty) | $7.20 | $6.20 (typical, same -MR but I-temp) | $7.20 (same die, T&R packaging) | $6.80 (typical) | $5.50 (typical, 64 KB Flash) | $7.80 (typical, 256 KB Flash) |
| Availability | Active, tube stock at 8 distributors | Active, wide stock | Active, T&R stock | Active, moderate stock | Active, moderate stock | Active, moderate stock |
Wichtigste Unterscheidungsmerkmale
- Automotive AEC-Q100 V-temp grade in same package as industrial variant (vs. PIC32MX230F128H-I/MR)
- Doubles Flash while maintaining AEC-Q100 and same 64-QFN footprint (vs. PIC32MX150F256H-V/MR)
- Higher core speed at same Flash/peripherals in identical 64-QFN (vs. PIC32MX230F128H-50I/MR)
- 40% price reduction with half the Flash in same 64-QFN footprint (vs. PIC32MX230F064D-V/ML)
Designhinweise
The PIC32MX230F128H-V/MR requires careful decoupling because the MCU operates across multiple supply domains: VDD (digital core), AVDD/AVSS (analog reference), and VUSB (USB transceiver). Place a 10 uF bulk capacitor at the board-level VDD input, plus 100 nF and 10 nF ceramic decoupling caps adjacent to each VDD/VSS pair on the QFN. For USB applications, VUSB requires its own 100 nF decoupling cap, and the D+/D- traces must be 90-ohm differential with a common-mode choke and ESD protection diode array such as USBLC6-2SC6.
The 64-pin QFN with exposed pad (EP) requires a continuous ground-plane land pattern on the top PCB layer that connects to the bottom EP via 9-12 thermal vias (0.3 mm drill, 0.6 mm pitch). Without proper EP soldering, the junction-to-ambient thermal resistance can exceed 60 C/W, and V-temp grade operation (up to +105C ambient) becomes marginal at full 40 MHz load. Estimated: at 30 mA core + 20 mA peripherals, internal dissipation is approximately 165 mW at 3.3 V; with theta-JA of 35 C/W (correctly soldered EP on 1 sq inch copper), junction rise is approximately 6C above ambient, leaving adequate thermal margin.
The QFN land pattern must follow IPC-7351 nominal-density guidelines with 0.45 mm pitch pads. The exposed thermal pad should be a single continuous land of approximately 7.5 mm x 7.5 mm with the via array specified in the Microchip package drawing. Maintain 4-mil trace and 4-mil space rules for the inner pin fan-out. The USB D+/D- pair must be routed as a 90-ohm differential with no splits and no vias; if layer changes are unavoidable, use back-drilled vias to maintain impedance. Keep the 32 kHz secondary oscillator crystal traces short (less than 5 mm) to avoid stray capacitance.
The most common design-in mistakes: (1) failing to enable the JTAG/ICSP debug pins (PGECx/PGEDx) properly during development, which bricks the MCU for in-circuit programming; (2) configuring the USB module without checking VBUS detect polarity, which prevents USB device enumeration; (3) leaving the MCLR pin floating, which causes random resets from EMI; (4) using PPS without documenting the pin map, which creates confusion in firmware maintenance; (5) ignoring AEC-Q100 documentation requirements for automotive designs (PPAP, IMDS, CM/PM compliance). Also note that the V-temp grade is specified up to +105C ambient but only at 40 MHz - if you need higher temperatures, derate clock frequency or move to PIC32MX1XX/2XX/5XX 64-pin QFN PIC32MX170 variants with extended temp support.
The 64-pin QFN has multiple high-speed signals (USB, PMP, I2S) that require controlled-impedance routing. USB differential impedance must be 90 ohms; PMP and I2S single-ended signals are typically routed as 50-ohm microstrip with reference ground 4-8 mils below. The CTMU inputs are analog and should be guarded by ground traces on either side to avoid digital coupling into touch measurements. The ADC analog inputs (ANx) should be routed away from switching nodes and have their own analog ground island tied to AVSS at a single point near the MCU.
Compliance-Informationen
AEC-Q100 V-temp grade qualified per Microchip ordering code; PPAP and IMDS available on request for automotive customers. RoHS and REACH compliant. Halogen-free status not confirmed in verified data.
