PIC32MX695F512L-80V/BG - 80MHz 32-bit MCU, 512KB Flash | Microchip
Teilenummer: PIC32MX695F512L-80V/BG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8.42 | $8,42 |
| 10 | $7.62 | $76,20 |
| 100 | $6.8 | $680,00 |
| 500 | $6.05 | $3.025,00 |
| 1.000 | $5.5 | $5.500,00 |
PIC32MX695F512L-80V/BG Übersicht
A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory, data RAM, and configurable peripherals. The PIC32MX uses the MIPS M4K 32-bit RISC architecture with hardware multiply/divide, delivering 1.56 DMIPS/MHz and supporting DSP-style instructions. It belongs to the PIC32 family, classified as an embedded microcontroller (MCU) within the broader category of microcontrollers and microprocessors. The 80 MHz clock is sourced from an internal 8 MHz oscillator with PLL multiplication, providing deterministic timing for communication stacks.
Key features include 512 KB Flash, 128 KB RAM, 85 I/O pins, 8 DMA channels, 5 timers/counters, 16-bit parallel master port, and CTMU for touch sensing. Hardware peripherals include SPI, I2C, UART, dual CAN 2.0B, USB-OTG (full-speed), and 10/100 MII/RMII Ethernet MAC. The 121-ball TFBGA package with 0.8 mm pitch enables compact PCB routing for high-density designs, suitable for industrial and consumer networking products.
The PIC32MX695F512L is supported by MPLAB X IDE, MPLAB XC32 Compiler, and MPLAB Harmony framework, which provides TCP/IP stacks (TCP, UDP, HTTP, SNMP, MQTT), USB middleware, and graphics libraries. The integrated Ethernet MAC eliminates external PHY for medium-density designs when paired with a low-cost 100 Mbit PHY, reducing total BOM. Code is consistently held in flash for firmware updates via ICSP or UART bootloader.
Typical applications include industrial Ethernet gateways, building automation controllers, USB device bridges, CAN-connected motor control nodes, and connected sensor hubs. The combination of Ethernet, USB, and CAN makes the part well-suited for protocol-conversion gateways that bridge legacy industrial serial/CAN networks to modern IP networks. The 80 MHz CPU and DMA enable deterministic handling of multiple communication stacks simultaneously.
When designing with this device, ensure PCB layout meets 121-ball TFBGA escape routing constraints (0.8 mm pitch). Place decoupling capacitors within 3 mm of each VDD/VSS pair. Configure the system clock PLL with an 8 MHz external crystal or internal RC for jitter-sensitive applications. Use MPLAB Harmony's TCP/IP stack with an external PHY for Ethernet operation.
This page consolidates distributor pricing, drop-in alternatives from Microchip's PIC32MX5XX/6XX/7XX family, and practical design notes that extend the manufacturer datasheet's typical application information for selection and procurement contexts.
Drop-in-Alternativen für PIC32MX695F512L-80V/BG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MX695F512L-80V/BG (gleiche Bauform und Footprint) – abweichend in DMA Channels, Package, ADC, USB, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MX695F512LT-80V/BG
✅ Drop-In✓ Auf Lager
$7.75 / Stück
Datenblatt ansehen →PIC32MX695F512L-80I/BG
✅ Drop-In✓ Auf Lager
$14.85 / Stück
Datenblatt ansehen →PIC32MX675F512L-80V/BG
✅ Drop-In✓ Auf Lager
$7.1 / Stück
Datenblatt ansehen →PIC32MX575F512L-80V/BG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX795F512L-80V/BG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MX460F512L-80V/BG
✅ Drop-In✓ Auf Lager
$6.1 / Stück
Datenblatt ansehen →PIC32MX695F512L-80V/BG Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Core Processor | PIC32 |
| Maximum CPU Clock | 80 MHz |
| Program Memory (Flash) | 512 KB (512K x 8) |
| RAM Size | 128 KB |
| Number of I/O Pins | 85 |
| Gehäuse / Bauform | 121-TFBGA (10x10 mm, 0.8 mm pitch) |
| Supply Voltage (VDD) | 2.3 V to 3.6 V |
| Betriebstemperaturbereich | -40 C to +105 C (V grade) |
| ADC | 10-bit, 16-channel, 1 Msps |
| DMA Channels | 8 |
| Timers/Counters | 5 (16-bit or combinations) |
| Communication Interfaces | USB-OTG, 10/100 Ethernet MAC, dual CAN 2.0B, SPI, I2C, UART |
| Parallel Master Port | Yes (16-bit PMP) |
| Ethernet MAC | 10/100 MII/RMII |
| CTMU (Touch) | Yes |
| Montageart | Surface Mount (TFBGA) |
| Packaging | Tray |
PIC32MX695F512L-80V/BG 121-tfbga (10x10 mm, 0.8 mm pitch) Pinbelegungsleitfaden
Pinbelegung für PIC32MX695F512L-80V/BG (121-tfbga (10x10 mm, 0.8 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC32MX695F512L-80V/BG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC32MX695F512L-80V/BG ist geeignet für 6 Anwendungs: Industrial Ethernet Gateway, USB Device Bridge, Building Automation Controller, CAN-to-Ethernet Protocol Converter, Connected Sensor Hub, Medical Device Interface.
Industrial Ethernet Gateway
The PIC32MX695F512L-80V/BG fits industrial Ethernet gateway designs because it integrates a 10/100 MII/RMII Ethernet MAC, dual CAN 2.0B controllers, and 512 KB Flash at 80 MHz. The 512 KB Flash holds the MPLAB Harmony TCP/IP stack (TCP, UDP, HTTP, MQTT, SNMP) plus Modbus TCP/RTU bridging code, while 128 KB RAM provides dedicated packet buffers. The V-grade -40C to +105C operating range allows deployment inside sealed industrial enclosures without active cooling. Place a 100 Mbit PHY (e.g., KSZ8041) externally; the integrated MAC handles all MII/RMII framing. Compared to a discrete MCU + external Ethernet controller, this single-chip approach reduces BOM by approximately $1.50 and simplifies PCB layout. Use this part when designing protocol converters that bridge CAN/RS-485 field networks to Ethernet, a typical use case in factory automation and building management systems.
Empfohlen
USB Device Bridge
The PIC32MX695F512L-80V/BG suits USB device bridge designs with its integrated USB-OTG full-speed controller, 512 KB Flash for USB class drivers, and 128 KB RAM for endpoint buffers. The USB-OTG port supports host, device, and OTG roles with internal pull-up/pull-down resistors, removing the need for external USB transceiver circuitry. MPLAB Harmony provides USB CDC, HID, MSD, and vendor class stacks that fit comfortably in 512 KB Flash. The 80 MHz MIPS core sustains 12 Mbps USB traffic while servicing concurrent communication tasks via DMA channels. Example scope: industrial data loggers using USB for configuration or factory-floor sensor hubs providing USB connectivity to legacy hosts. Compared to a standalone USB controller, the integrated approach reduces external component count from approximately 6 chips to 1.
Empfohlen
Building Automation Controller
The PIC32MX695F512L-80V/BG fits building automation controllers because it combines Ethernet MAC, dual CAN, USB-OTG, and 16-channel 10-bit ADC at 80 MHz with V-grade temperature rating. The dual CAN interfaces support BACnet MS/TP and LonWorks via external transceivers, while Ethernet provides IP connectivity to BACnet/IP and Modbus TCP networks. The 16 ADC channels directly read temperature sensors, occupancy detectors, and analog control loops, eliminating an external ADC. The 85 GPIO pins drive relays, triacs, and LCD displays without external I/O expanders. V-grade (-40C to +105C) supports rooftop or basement installation in commercial HVAC systems. Example scope: BACnet gateway between BACnet MS/TP and BACnet/IP. Compared to multiple discrete controllers, this single-chip design reduces panel space by approximately 40%.
Empfohlen
CAN-to-Ethernet Protocol Converter
The PIC32MX695F512L-80V/BG fits CAN-to-Ethernet protocol converter designs because it combines 10/100 Ethernet MAC and dual CAN 2.0B controllers at 80 MHz. The 512 KB Flash holds TCP/IP plus CANopen or DeviceNet stacks, while 128 KB RAM buffers CAN frames during Ethernet forwarding. DMA channels offload CAN and Ethernet data movement from the CPU, freeing the MIPS core to handle routing logic. Example scope: automotive fleet telematics gateways converting J1939 CAN bus data to MQTT-over-Ethernet for cloud servers. The -40C to +105C V-grade temperature range supports under-hood automotive enclosures. Compared to a discrete MCU + external Ethernet controller design, this integrated approach removes approximately $1.20 in external chip cost.
Empfohlen
Connected Sensor Hub
The PIC32MX695F512L-80V/BG fits connected sensor hub designs because it integrates 16-channel 10-bit ADC, CTMU touch sensing, dual CAN, USB-OTG, and Ethernet MAC at 80 MHz. The 16 ADC channels directly read analog sensors (temperature, pressure, light, gas), while CTMU handles capacitive touch buttons or sliders. The 512 KB Flash runs MQTT-over-Ethernet or BLE gateway code, while 128 KB RAM holds sensor sample buffers. Example scope: industrial IoT gateway aggregating multiple analog sensor inputs and forwarding via Ethernet to a cloud platform. The CTMU peripheral eliminates an external touch IC for HMI designs. Compared to a multi-chip sensor hub solution, this single-chip design shrinks the PCB area by approximately 30%.
Empfohlen
Medical Device Interface
The PIC32MX695F512L-80V/BG fits medical device interface designs because it combines USB-OTG, Ethernet MAC, 16-channel ADC, and 80 MHz MIPS performance with reliable Flash/RAM. The USB-OTG port provides connectivity to medical PCs and tablets, while Ethernet enables networked patient monitoring. The 16 ADC channels read physiological sensor data (ECG, SpO2, temperature) directly, while DMA channels sustain data throughput without CPU load. The V-grade temperature range supports operating room equipment environments. Example scope: bedside patient monitor interface connecting to hospital networks via Ethernet. Compared to a discrete solution, this single-chip approach reduces EMI emissions and improves certification paths. The 512 KB Flash is sufficient for USB stack, TCP/IP stack, and application firmware.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MX695F512L-80V/BG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MX695F512LT-80V/BG | PIC32MX695F512L-80I/BG | PIC32MX675F512L-80V/BG | PIC32MX575F512L-80V/BG | PIC32MX795F512L-80V/BG | PIC32MX460F512L-80V/BG |
|---|---|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Core | MIPS M4K 32-bit @ 80 MHz | MIPS M4K 32-bit @ 80 MHz | MIPS M4K 32-bit @ 80 MHz | MIPS M4K 32-bit @ 80 MHz | MIPS M4K 32-bit @ 80 MHz | MIPS M4K 32-bit @ 80 MHz | MIPS M4K 32-bit @ 80 MHz (MX4 family) |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| RAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 32 KB (lower) |
| Ethernet MAC | 10/100 MII/RMII | 10/100 MII/RMII | 10/100 MII/RMII | 10/100 MII/RMII (675 includes Ethernet) | None | 10/100 MII/RMII | None |
| USB-OTG | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) | Yes (Full-Speed) |
| CAN 2.0B | 2 controllers | 2 controllers | 2 controllers | 2 controllers | None | 2 controllers | None |
| Operating Temperature | -40C to +105C (V grade) | -40C to +105C (V grade) | -40C to +85C (I grade) | -40C to +105C (V grade) | -40C to +105C (V grade) | -40C to +105C (V grade) | -40C to +105C (V grade) |
Wichtigste Unterscheidungsmerkmale
- Integrated 10/100 Ethernet MAC eliminates external controller (vs. PIC32MX575F512L-80V/BG)
- Dual CAN 2.0B controllers for industrial networking (vs. PIC32MX575F512L-80V/BG)
- USB-OTG host/device/OTG tri-role capability (vs. PIC32MX460F512L-80V/BG)
Designhinweise
The 121-ball TFBGA package (0.8 mm pitch) requires a 4-layer PCB minimum with microvia escape routing on inner layers. Place at least 8 vias in a 2x4 grid under the package's center thermal balls to provide thermal dissipation path to the inner ground plane. Keep all signal traces under 0.1 mm width (4 mils) between BGA escape vias to maintain 50 ohm controlled impedance for Ethernet MII/RMII signals. Decoupling: place 100 nF X7R ceramic capacitors within 3 mm of each VDD/VSS pair, plus 4.7 uF bulk on each VDD rail.
PIC32MX695F512L-80V/BG VDD must be 2.3V-3.6V with ripple under 50 mVpp. Add a ferrite bead (600 ohm @ 100 MHz) in series with the main VDD supply, followed by 100 nF + 4.7 uF + 10 uF capacitor network. The internal 1.8V core LDO requires its own 1 uF + 100 nF bypass network within 5 mm of the VCAP pin. Brown-out reset (BOR) and power-on reset (POR) thresholds are programmable via config bits; default BOR is enabled. Monitor VDD with the internal voltage regulator power-ready signal before enabling peripherals.
Ethernet MII/RMII signals must be routed as 50 ohm controlled-impedance pairs with length matching within 2 mm. Place the external PHY (e.g., KSZ8041) within 50 mm of the MCU to keep MII traces short. The 25 MHz PHY reference clock can be sourced from the MCU or the PHY; sharing a single 25 MHz oscillator reduces BOM. USB DP/DM traces must be 90 ohm differential impedance with length matching within 1 mm; route them on the top layer over a continuous ground plane. CAN TX/RX signals should be routed as 120 ohm impedance-controlled pairs.
Do not enable Ethernet MAC without an external PHY connected and clock-stable, or use premature code will hang the EMAC block. Always set the CFGCON.PMD bits to disable unused peripherals (USB, CAN, Ethernet) at code startup so unused peripheral clocks are gated to reduce quiescent current from approximately 95 mA to 65 mA at 80 MHz. Configure the JTAG/Trace port pins as GPIO in config bits if not using a debugger, or use them as additional I/O. The 121-ball TFBGA package cannot be hand-reworked on older solder - design PCBs to support -40C to +105C operation with proper thermal vias.
Compliance-Informationen
RoHS compliant per Microchip product page. Not AEC-Q100 qualified (industrial grade only); AEC-Q100 variants are not available in this family. Halogen-free status unknown from verified data.