PIC32MZ0512EFE100T-I/GJX - 200MHz 32-bit MCU 512KB Flash | Microchip
Teilenummer: PIC32MZ0512EFE100T-I/GJX ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $12.45 | $12,45 |
| 10 | $11.62 | $116,20 |
| 100 | $10.34 | $1.034,00 |
| 500 | $9.18 | $4.590,00 |
| 1.000 | $8.45 | $8.450,00 |
PIC32MZ0512EFE100T-I/GJX Übersicht
A 32-bit microcontroller (MCU) is an integrated circuit combining a high-performance processor core, Flash program memory, SRAM data memory, and a rich set of on-chip peripherals (USB, Ethernet, ADC, PWM, timers, communication interfaces) into a single chip. The PIC32MZ EF family sits at the top of Microchip's MIPS-based 32-bit MCU portfolio and bridges into the broader category of embedded microcontrollers within the semiconductor taxonomy: 32-bit MCU -> microcontroller -> embedded processor -> integrated circuit. Devices in this class typically replace separate microprocessor-plus-support-chip designs, lowering BOM cost and PCB area while providing deterministic real-time response.
Key features of this variant include a hardware floating-point unit, dual-panel Flash for live update support, advanced analog with high-speed ADC, Hi-Speed USB, 10/100 Ethernet MAC, audio and graphics interfaces, and an integrated crypto engine on related family members (this specific variant is the no-Crypto, no-CAN member of the family). The 100-lead TFBGA package exposes the full peripheral set while keeping board footprint compact at approximately 49 mm squared.
Typical applications include industrial automation controllers, IoT edge nodes with Ethernet connectivity, graphical HMI panels, audio processing products, motor-control inverter boards, and automotive body/comfort modules where the wide temperature range and connectivity peripherals fit naturally. The PIC32MZ EF family's combination of FPU + DSP extensions and high peripheral integration makes it well-suited to closed-loop control, networked sensors, and graphical user-interface designs.
When designing with this device, ensure that the chosen TFBGA land pattern is fabricated precisely to JEDEC MS-026 tolerances to avoid solder-joint reliability issues and that all decoupling follows Microchip's recommended capacitor network. Plan for an external PHY when using the integrated Ethernet MAC and verify the chosen PHY reference design supports your required RMII/RGMII timing.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für PIC32MZ0512EFE100T-I/GJX – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ0512EFE100T-I/GJX (gleiche Bauform und Footprint) – abweichend in Core Architecture, Package, ADC, Ethernet, FPU.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ0512EFE100-I/GJX
✅ Drop-In✓ Auf Lager
$6.84 / Stück
Datenblatt ansehen →PIC32MZ0512EFE100-E/GJX
✅ Drop-In✓ Auf Lager
$9.52 / Stück
Datenblatt ansehen →PIC32MZ1024EFE100T-I/GJX
✅ Drop-In✓ Auf Lager
$8.1 / Stück
Datenblatt ansehen →PIC32MZ0512EFE100T-I/GIX
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MZ0512EFE100T-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$7.42 / Stück
Datenblatt ansehen →PIC32MZ0512EFE100-E/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$7.92 / Stück
Datenblatt ansehen →PIC32MZ0512EFE100T-I/GJX Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 M-Class (MIPS Warrior) |
| Core Frequency | 200 MHz |
| Core Performance | 330 DMIPS |
| Program Flash | 512 KB (512K x 8) |
| Data SRAM | 128 KB |
| Floating Point Unit | Yes (IEEE 754-compliant) |
| DSP Extensions | Yes (4x 64-bit accumulators, single-cycle MAC, saturating/fractional math) |
| Operating Voltage | 2.3 V to 3.6 V |
| Betriebstemperatur | -40 C to +85 C (Industrial) |
| Gehäuse | 100-lead TFBGA (7x7 mm, 0.65 mm pitch) |
| Montageart | Surface Mount |
| Packaging Type | Tape and Reel (T suffix) |
| Ethernet | 10/100 MAC (external PHY required) |
| USB | Hi-Speed USB 2.0 |
| Crypto Engine | No (no-Crypto variant) |
| CAN | No (no-CAN variant) |
| RoHS-Status | Compliant |
PIC32MZ0512EFE100T-I/GJX 100-lead tfbga (7x7 mm, 0.65 mm pitch) Pinbelegungsleitfaden
Pinbelegung für PIC32MZ0512EFE100T-I/GJX (100-lead tfbga (7x7 mm, 0.65 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PIC32MZ0512EFE100T-I/GJX.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PIC32MZ0512EFE100T-I/GJX ist geeignet für 7 Anwendungs: Industrial Automation Controllers, IoT Edge Nodes with Ethernet, Graphical HMI Panels, Audio Processing Products, Motor Control Inverter Boards, Automotive Body and Comfort Modules, Networking and Connectivity Hubs.
Industrial Automation Controllers
The PIC32MZ0512EFE100T-I/GJX fits industrial automation controllers because its 200 MHz MIPS core with IEEE 754 FPU and DSP extensions handles deterministic closed-loop control of motors, valves, and process variables. The integrated 10/100 Ethernet MAC enables PROFINET, EtherNet/IP, or Modbus TCP connectivity for plant-floor networks without an external communication processor, while the 128 KB SRAM supports real-time protocol stacks and 512 KB Flash accommodates IEC 61131-3 application logic plus safe firmware-update storage via dual-panel Flash. Its industrial -40C to +85C grade is qualified for cabinet and machine-mount environments. The 100-lead TFBGA keeps PCB area compact at 49 mm squared, freeing board space for analog front ends, gate drivers, and isolated I/O. Engineers benefit from Microchip's MPLAB Harmony framework with pre-validated TCP/IP, USB, and motor-control libraries, reducing time-to-prototype. Compared with a Cortex-M4F alternative at the same clock, this part delivers comparable floating-point throughput and richer on-chip connectivity, making it a strong choice for PLCs, motion controllers, and industrial IoT gateways.
Empfohlen
IoT Edge Nodes with Ethernet
The PIC32MZ0512EFE100T-I/GJX is well matched to IoT edge nodes because its integrated 10/100 Ethernet MAC and Hi-Speed USB 2.0 port simplify connected-product designs without external bridge ICs. The 200 MHz MIPS M-class core delivers sufficient compute for MQTT, CoAP, or lightweight TLS termination alongside sensor-fusion algorithms, while the 512 KB Flash and 128 KB SRAM hold networking stacks, OTA update buffers, and application telemetry. Its industrial temperature grade ensures reliability in unattended edge installations ranging from factory floors to outdoor enclosures. The 100-lead TFBGA package allows small-form-factor node designs, and the dual-panel Flash enables safe over-the-air firmware upgrades essential for long-life IoT deployments. Compared with discrete MCU-plus-ETH-IC solutions, this single-chip approach reduces BOM cost and PCB complexity. Microchip's MPLAB Harmony networking services provide tested TCP/IP and HTTP/TLS primitives that shorten development cycles for gateways and protocol converters.
Empfohlen
Graphical HMI Panels
The PIC32MZ0512EFE100T-I/GJX supports graphical HMI panels through its combination of high-performance MIPS core, parallel graphics interfaces, and 128 KB SRAM that can host modest framebuffers and UI objects. At 200 MHz, it drives resistive or capacitive touch panels and renders menus, gauges, and icons without external GPU silicon. The integrated audio interfaces enable beep-tone and voice-prompt feedback alongside display updates. The 512 KB Flash stores UI assets, fonts, and localized strings, while the dual-panel Flash architecture permits safe field updates of UI firmware. The 100-lead TFBGA footprint suits compact panel-mount designs where space behind the LCD is at a premium. Industrial temperature tolerance ensures reliable operation in machine-cabinet and outdoor kiosks. Compared with discrete MCU-plus-display-controller solutions, this single-chip approach reduces BOM and simplifies EMC compliance by centralizing high-speed signals on one well-characterized silicon platform.
Empfohlen
Audio Processing Products
The PIC32MZ0512EFE100T-I/GJX's DSP-enhanced MIPS core with four 64-bit accumulators and single-cycle MAC delivers deterministic audio processing throughput for codecs, equalizers, and active-noise-cancellation front ends. Its IEEE 754 FPU accelerates sample-rate conversion and filter coefficient math, while the I2S/音频 interfaces integrate directly with external DACs and ADCs. The 128 KB SRAM hosts audio buffers alongside USB or Ethernet streaming stacks, allowing networked speakers and audio-over-IP endpoints from a single chip. Industrial temperature tolerance supports installations in commercial and industrial audio environments. The 100-lead TFBGA package suits compact sealed enclosures where heat dissipation is critical. Compared with bare Cortex-M4F DSP solutions, this part offers comparable signal-processing headroom with the added benefit of integrated connectivity peripherals for networked audio products such as amplifiers, mixers, and intercom systems.
Empfohlen
Motor Control Inverter Boards
The PIC32MZ0512EFE100T-I/GJX drives motor-control inverter boards thanks to its high-speed PWM, integrated ADC, and DSP-extended MIPS core capable of field-oriented control loops in real time. The FPU executes Park/Clarke transforms and PID controllers within microseconds, while the 200 MHz clock reserves cycles for safety monitoring, telemetry, and EtherCAT or CANopen stack execution on the integrated peripherals. The 128 KB SRAM holds observer state variables and control-loop working memory, and the 512 KB Flash accommodates reference firmware plus application code. Industrial temperature grade supports inverter cabinet environments. The 100-lead TFBGA package delivers the high pin count required for multi-phase gate-driver interfaces while keeping board footprint compact. Compared with dedicated DSP motor-control ICs, this single-chip approach combines control loops with system connectivity and HMI handling.
Empfohlen
Automotive Body and Comfort Modules
The PIC32MZ0512EFE100T-I/GJX can serve in automotive body and comfort modules where the industrial temperature grade (-40C to +85C) and high integration reduce module cost. Its 200 MHz MIPS core with FPU handles seat-control, mirror-adjustment, and HVAC algorithms, while the Hi-Speed USB and Ethernet MAC support diagnostic interfaces and connected-car features. The 512 KB Flash holds comfort-module firmware plus secure-boot routines, and the 128 KB SRAM supports CAN message buffering and sensor-fusion data. The 100-lead TFBGA package suits dense module PCBs behind dashboards and door panels. While this is the no-CAN variant, designers can add an external CAN transceiver for LIN/CAN bridge applications. Compared with general-purpose automotive MCUs that lack integrated Ethernet, this part provides a cost-effective connectivity-focused platform for non-safety-critical automotive subsystems.
Empfohlen
Networking and Connectivity Hubs
The PIC32MZ0512EFE100T-I/GJX anchors networking and connectivity hubs because its integrated 10/100 Ethernet MAC, Hi-Speed USB 2.0, and DSP-extended MIPS core handle multi-protocol bridging on a single chip. The 200 MHz performance runs TCP/IP stacks alongside application logic, while 128 KB SRAM buffers packet traffic and 512 KB Flash stores the full firmware image with dual-panel Flash enabling safe OTA updates. Industrial temperature grade supports deployment in network cabinets and factory-floor aggregation points. The 100-lead TFBGA package exposes the high pin count needed for multiple serial channels, GPIO expansion, and external PHY/MAC connections. Compared with MCU-plus-discrete-ETH-chip solutions, this single-chip approach simplifies BOM and PCB layout, reducing EMI challenges. Microchip's MPLAB Harmony TCP/IP services provide tested protocol implementations for HTTP, MQTT, and SNMP that accelerate hub development.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ0512EFE100T-I/GJX – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ0512EFE100-I/GJX | PIC32MZ0512EFE100-E/GJX | PIC32MZ1024EFE100T-I/GJX | PIC32MZ0512EFE100T-I/GIX |
|---|---|---|---|---|---|
| Package | 100-lead TFBGA (7x7 mm, 0.65 mm pitch) | 100-lead TFBGA (7x7 mm) - same | 100-lead TFBGA (7x7 mm) - same | 100-lead TFBGA (7x7 mm) - same | 100-lead TFBGA (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core Frequency | 200 MHz | 200 MHz - same | 200 MHz - same | 200 MHz - same | 200 MHz - same |
| Flash Memory | 512 KB | 512 KB - same | 512 KB - same | 1 MB (+100%) | 512 KB - same |
| SRAM | 128 KB | 128 KB - same | 128 KB - same | 128 KB - same | 128 KB - same |
| Temperature Grade | -40C to +85C (Industrial) | -40C to +85C (Industrial) - same | -40C to +125C (Extended) | -40C to +85C (Industrial) - same | -40C to +85C (Industrial) - same |
| FPU | Yes (IEEE 754) | Yes - same | Yes - same | Yes - same | Yes - same |
| DSP Extensions | Yes (4x 64-bit accumulators, MAC, saturating/fractional) | Yes - same | Yes - same | Yes - same | Yes - same |
| Packaging Media | Tape and Reel | Tray | Tray | Tape and Reel - same | Tape and Reel - same |
Wichtigste Unterscheidungsmerkmale
- Higher Flash density (1 MB) in same TFBGA package (vs. PIC32MZ0512EFE100T-I/GJX vs PIC32MZ1024EFE100T-I/GJX)
- Extended temperature grade option (vs. PIC32MZ0512EFE100T-I/GJX vs PIC32MZ0512EFE100-E/GJX)
- Tape-and-reel packaging for high-volume assembly (vs. PIC32MZ0512EFE100T-I/GJX vs PIC32MZ0512EFE100-I/GJX)
- MIPS M-class core with FPU plus DSP extensions (vs. PIC32MZ0512EFE100T-I/GJX vs general Cortex-M4F MCUs)
Designhinweise
Fabricate the 100-lead TFBGA land pattern to JEDEC MS-026 tolerances with non-solder-mask-defined (NSMD) pads to avoid solder-joint reliability problems. Via-in-pad with filling and plating is recommended for the inner ball grid to improve thermal dissipation and signal routing escape. A 0.1 uF decoupling capacitor must be placed within 2 mm of every supply ball, with bulk 4.7 uF tantalum or ceramic capacitors at the board power input. Estimated: thermal pad copper area of approximately 100 mm squared yields a theta_JA near 30 C/W for the 7x7 mm TFBGA.
Operate the PIC32MZ0512EFE100T-I/GJX within 2.3 V to 3.6 V on VDD with a separate 1.8 V regulator for the core if your design requires precise analog reference isolation. Enable the on-chip voltage regulator with proper sequencing and add a 10 uF bulk capacitor on the VCAP pin per Microchip's reference schematic. Power-rail sequencing between VDD and AVDD should follow datasheet recommendations to avoid latch-up during startup. Estimated: at 200 MHz with all peripherals active, core current draw is roughly 70 mA; high-linearity analog blocks benefit from a dedicated filtered AVDD rail.
Route the 50 MHz Ethernet RMII or 125 MHz RGMII signals with controlled impedance (50 ohm single-ended, 100 ohm differential) and length-match within datasheet tolerances to avoid timing violations. The Hi-Speed USB DP/DN pair must be routed as a 90 ohm differential pair with no stubs, length-matched to within 150 mil. Use a ground reference plane on layer 2 directly beneath these high-speed traces to control return-current paths. For EMI-sensitive designs, add a common-mode choke on the USB and Ethernet lines near the connectors.
Estimated: at maximum 200 MHz operation with 100% CPU and peripheral load, junction temperature rise is on the order of 15-20 C above ambient when the TFBGA is mounted on a JEDEC-standard 4-layer test board with 1 oz copper. For continuous high-throughput designs, monitor internal die temperature via the on-chip diode and reduce clock frequency or peripheral count if approaching the 125 C maximum. Industrial-grade variants (-40C to +85C ambient) provide adequate margin for most embedded enclosures without active cooling.
Do not omit the VCAP pin capacitor; the internal voltage regulator requires this bulk capacitance for stability. Ensure the external PHY is configured for the correct clock reference (RMII vs RGMII) before code initializes the Ethernet MAC, or link-up will fail silently. Configure the boot mode pins correctly to select the desired Flash panel and debug interface - leaving these floating can result in unpredictable boot behavior. Verify unused analog inputs are tied to a defined voltage level to prevent shoot-through current in the ADC input mux.
Compliance-Informationen
Industrial temperature grade, not AEC-Q100 qualified. RoHS and REACH compliant per Microchip product page. For automotive safety-critical applications choose an AEC-Q100-qualified variant or external certification review.
