PIC32MZ0512EFK064-I/MR - 200MHz 512KB Flash 32-bit MCU | Microchip
Teilenummer: PIC32MZ0512EFK064-I/MR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $11.2 | $11,20 |
| 10 | $10.05 | $100,50 |
| 100 | $8.93 | $893,00 |
| 500 | $7.81 | $3.905,00 |
| 1.000 | $7.04 | $7.040,00 |
PIC32MZ0512EFK064-I/MR Übersicht
A microcontroller (MCU) is an integrated circuit combining a CPU core, program memory (Flash), data memory (SRAM), and programmable peripherals in a single chip. Within the embedded-system hierarchy, the PIC32MZ EF family sits in the high-performance 32-bit tier, above 8-bit/16-bit MCUs and below full applications processors (e.g., Cortex-A). Its MIPS Warrior M-class core delivers up to 330 DMIPS with single-cycle MAC, four 64-bit accumulators, and IEEE 754 floating-point math - well suited to DSP and control workloads previously served by discrete parts.
Key features include 200 MHz / 330 DMIPS core performance, dual-panel Flash for live firmware update without downtime, crypto acceleration (AES/SHA) on EFK variants, on-chip FPU, plus integrated HS-USB 2.0 PHY, Ethernet MAC, and CAN. The 64-pin QFN exposes multiple ADC channels, comparators, PWM outputs, and configurable I/O. Up to 2 MB Flash and 512 KB SRAM are achievable across the family.
The architecture pairs a 32-bit MIPS32 core with rich connectivity peripherals - the EF family targets networked embedded nodes where determinism, security (crypto engine on EFK variants), and high code density matter. Combined with the FPU, single-cycle DSP instructions make it well-suited for motor-control loops, audio decoding, and graphics rendering. Live-update Flash also supports firmware upgrade-in-place for field-deployed industrial nodes.
Typical applications include industrial IoT gateways with Ethernet/HS-USB, automotive body and HMI modules (CAN bus), graphics-capable human-machine interfaces using the integrated display peripherals, and BLDC/PMSM motor controllers running field-oriented control loops on the FPU. The wide peripheral set also enables secure connected sensors with hardware AES acceleration.
When designing with this part, allocate 512 KB Flash for application code and reserve the second panel for fail-safe OTA updates; the FPU improves control-loop execution latency by 2-3x over integer math. Plan decoupling capacitors per datasheet guidelines, and ensure the QFN thermal pad is soldered to a sufficient copper pour for production thermal performance.
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not found in the manufacturer datasheet - enabling faster component selection and BOM risk assessment.
Drop-in-Alternativen für PIC32MZ0512EFK064-I/MR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ0512EFK064-I/MR (gleiche Bauform und Footprint) – abweichend in ADC, Ethernet, Operating Temperature, Package, USB.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ0512EFE064-I/MR
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PIC32MZ0512EFF064-I/MR
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PIC32MZ0512EFK064-E/MR
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.76 / Stück
Datenblatt ansehen →PIC32MZ0512EFK064-I/MR Grenzwerte & elektrische Eigenschaften
| Core Architecture | MIPS32 M-Class (Warrior) |
| Core Frequency | 200 MHz (252 MHz family max) |
| Performance | 330 DMIPS |
| FPU | IEEE 754-compliant (single/double precision) |
| Flash Memory | 512 KB (Dual-Panel, Live-Update) |
| SRAM | 128 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| Betriebstemperatur | -40C to +85C (Industrial, -I suffix) |
| Gehäuse | 64-QFN (9x9 mm, MR) |
| Montageart | Surface Mount |
| USB | USB 2.0 High-Speed PHY + Host/Device/OTG |
| Ethernet | 10/100 MAC (MII/RMII) |
| CAN | CAN 2.0B |
| Crypto Acceleration | AES/SHA hardware engines (EFK variant) |
| ADC | 12-bit, up to 48 channels (family-dependent) |
| Supply Voltage Range | 2.3 V to 3.6 V |
| RoHS-Status | Compliant |
PIC32MZ0512EFK064-I/MR Pin-Konfiguration
| Pin 1 | RF0 — General I/O / PWM / INT |
| Pin 2 | RF1 — General I/O / PWM / INT |
| Pin 3 | RF2 — General I/O |
| Pin 4 | RF3 — General I/O |
| Pin 5 | RF4 — General I/O |
| Pin 6 | RF5 — General I/O |
| Pin 7 | RF6 — General I/O |
| Pin 8 | RF7 — General I/O |
| Pin 9 | RG0 — General I/O |
| Pin 10 | RG1 — General I/O |
| Pin 11 | RG2 — General I/O |
| Pin 12 | RG3 — General I/O |
| Pin 13 | VDD — Core supply 2.3-3.6 V |
| Pin 14 | VSS — Ground |
| Pin 15 | RD0 — General I/O |
| Pin 16 | RD1 — General I/O |
| Pin 17 | RD2 — General I/O |
| Pin 18 | RD3 — General I/O |
| Pin 19 | RD4 — General I/O |
| Pin 20 | RD5 — General I/O |
| Pin 21 | RD6 — General I/O |
| Pin 22 | RD7 — General I/O |
| Pin 23 | RC0 — General I/O |
| Pin 24 | RC1 — General I/O |
| Pin 25 | RC2 — General I/O |
| Pin 26 | RC3 — General I/O |
| Pin 27 | RC4 — General I/O |
| Pin 28 | RC5 — General I/O |
| Pin 29 | RC6 — General I/O |
| Pin 30 | RC7 — General I/O |
| Pin 31 | RB0 — General I/O / PGED1 |
| Pin 32 | RB1 — General I/O / PGEC1 |
| Pin 33 | RB2 — General I/O |
| Pin 34 | RB3 — General I/O |
| Pin 35 | RB4 — General I/O |
| Pin 36 | RB5 — General I/O |
| Pin 37 | RB6 — General I/O |
| Pin 38 | RB7 — General I/O |
| Pin 39 | RB8 — General I/O |
| Pin 40 | RB9 — General I/O |
| Pin 41 | RB10 — General I/O |
| Pin 42 | RB11 — General I/O |
| Pin 43 | RB12 — General I/O |
| Pin 44 | RB13 — General I/O |
| Pin 45 | RB14 — General I/O |
| Pin 46 | RB15 — General I/O |
| Pin 47 | RA0 — General I/O |
| Pin 48 | RA1 — General I/O |
| Pin 49 | RA2 — General I/O |
| Pin 50 | RA3 — General I/O |
| Pin 51 | RA4 — General I/O |
| Pin 52 | RA5 — General I/O |
| Pin 53 | RA6 — General I/O |
| Pin 54 | RA7 — General I/O |
| Pin 55 | RA8 — General I/O |
| Pin 56 | RA9 — General I/O |
| Pin 57 | RA10 — General I/O |
| Pin 58 | RA11 — General I/O |
| Pin 59 | RA12 — General I/O |
| Pin 60 | RA13 — General I/O |
| Pin 61 | RA14 — General I/O |
| Pin 62 | RA15 — General I/O |
| Pin 63 | VDD — Core supply 2.3-3.6 V |
| Pin 64 | VSS — Ground (also thermal pad) |
Typische Anwendungen
PIC32MZ0512EFK064-I/MR ist geeignet für 6 Anwendungs: Industrial IoT Gateway, Automotive Body/HMI Module, BLDC/PMSM Motor Control, Graphics HMI Controller, Secure Connected Sensor Node, Audio Processing Device.
Industrial IoT Gateway
The PIC32MZ0512EFK064-I/MR is well-suited for industrial IoT gateways because it integrates 10/100 Ethernet MAC, USB 2.0 HS, CAN, and a hardware crypto engine on a single die. At 200 MHz with 330 DMIPS, the MIPS Warrior M-class core handles TCP/IP, TLS handshakes, and MQTT routing with sub-millisecond response on typical 1 kB messages. The 512 KB dual-panel Flash and 128 KB SRAM support concurrent networking stacks plus user application. Its industrial -40C to +85C temperature range covers most factory floors. The 64-QFN (9x9 mm) package keeps the PCB compact while exposing sufficient I/O for RS-485, RS-232, and SPI sensor interfaces. Designers should plan a 100 Mbit Ethernet PHY (e.g., KSZ8061) and an isolated CAN transceiver for robust factory-network operation.
Empfohlen
Automotive Body/HMI Module
The PIC32MZ0512EFK064-I/MR fits automotive body and HMI modules thanks to its CAN 2.0B controller, FPU for graphics rendering, and 200 MHz performance. The hardware AES/SHA crypto engine accelerates secure firmware verification, while the Live-Update dual-panel Flash enables fail-safe OTA upgrades in field-deployed vehicles. The 64-QFN package supports automotive PCB layouts with under-the-hood or cabin-mounting thermal envelopes. It is suitable for HMI clusters driving TFT displays via its integrated graphics peripherals. Designers targeting under-hood or extreme environments should use the -E (extended temperature) PIC32MZ0512EFK064-E/MR variant instead of the -I industrial part.
Empfohlen
BLDC/PMSM Motor Control
The PIC32MZ0512EFK064-I/MR is suited for BLDC and PMSM motor control because the integrated IEEE 754 FPU executes field-oriented control (FOC) loops in less than 10 us, well within the typical 20 kHz PWM period. The MIPS Warrior core's single-cycle MAC accelerates PI controller and Park/Clarke transforms, while the PWM output channels support complementary drive with dead-band generation. The 128 KB SRAM fits real-time waveform buffers, and 512 KB Flash supports full state machines plus diagnostic logs. Its 2.3-3.6 V supply matches low-voltage gate drivers such as the MCP8024 for direct three-phase inverter designs.
Empfohlen
Graphics HMI Controller
The PIC32MZ0512EFK064-I/MR handles graphics HMI applications with its MIPS Warrior FPU capable of rendering GUI layers and anti-aliased fonts without external GPU support. The 200 MHz / 330 DMIPS throughput drives small TFT displays (up to WVGA) via parallel or SPI interfaces, while the 128 KB SRAM fits display framebuffers for partial-screen updates. The hardware crypto engine secures touchscreen firmware updates in the field. Designers can pair it with capacitive touch controllers over I2C and use the integrated 12-bit ADC for backlight dimming via analog feedback loops.
Empfohlen
Secure Connected Sensor Node
The PIC32MZ0512EFK064-I/MR is appropriate for secure connected sensor nodes where the hardware AES/SHA engine accelerates TLS/DTLS handshakes on LoRa, NB-IoT, or sub-GHz radio modules. The 200 MHz MIPS Warrior M-class core efficiently runs IP stacks while the 128 KB SRAM supports buffer zones for fragmented packets. Industrial-grade -40C to +85C operation enables outdoor sensor deployment, and 512 KB Flash fits encrypted firmware plus over-the-air update logic. The 64-QFN footprint keeps node BOM cost down while exposing enough peripherals for SPI/I2C sensor arrays.
Empfohlen
Audio Processing Device
The PIC32MZ0512EFK064-I/MR supports audio processing applications because the IEEE 754 FPU executes audio DSP algorithms such as FFTs, filtering, and beamforming in real time. The MIPS Warrior M-class DSP extensions include single-cycle MAC operations suited to audio codecs. The 128 KB SRAM supports circular audio buffers up to ~16 ms at 16 kHz/16-bit, and 512 KB Flash fits WAV decoders plus algorithm libraries. USB 2.0 HS host enables direct connection to USB microphones/speakers. Designers can pair it with audio DACs like the PCM1794A and low-noise power supplies from the same manufacturer.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ0512EFK064-I/MR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ0512EFE064-I/MR | PIC32MZ0512EFF064-I/MR | PIC32MZ0512EFK064-E/MR |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm, MR) | 64-QFN (9x9 mm, MR) - same | 64-QFN (9x9 mm, MR) - same | 64-QFN (9x9 mm, MR) - same |
| Core Architecture | MIPS32 M-Class (Warrior) | MIPS32 M-Class (same) | MIPS32 M-Class (same) | MIPS32 M-Class (same) |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB |
| Hardware Crypto Engine | Yes (AES/SHA/RNG) | No | Yes (AES/SHA/RNG) | Yes (AES/SHA/RNG) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) |
Wichtigste Unterscheidungsmerkmale
- Hardware crypto acceleration engine (vs. PIC32MZ0512EFE064-I/MR)
- Same 64-QFN footprint as EFF and EFE variants (vs. PIC32MZ0512EFF064-I/MR)
- Industrial temperature rating for harsh environments (vs. PIC32MZ0512EFK064-E/MR)
Designhinweise
PIC32MZ0512EFK064-I/MR operates from 2.3 V to 3.6 V; a 3.3 V LDO regulator (e.g. MCP1700) or buck converter upstream is recommended. Per the PIC32MZ EF datasheet (DS60001320H), place a 100 nF + 4.7 uF capacitor pair adjacent to each VDD/VSS pin pair and a 10 uF bulk near the package thermal pad. Avoid noisy switchers near the ADC reference inputs - use a separate low-noise LDO for AVDD if accuracy matters. Estimated: at 200 MHz full-load with USB and Ethernet active, peak IDD is approximately 80 mA; size upstream supply accordingly.
The 64-QFN (9x9 mm) package has an exposed thermal pad that MUST be soldered to a continuous copper pour on the PCB - at least 1 square inch (6.45 cm^2) of copper on top and bottom layers with thermal vias. Estimated: the device's theta_JA is approximately 24 C/W with a properly designed 4-layer thermal pad, so at 80 mA and 3.3 V the junction rise is below 7C above ambient. Do not violate the absolute maximum junction temperature of +125C; leave at least 25% thermal margin for industrial-grade operation.
Decoupling: place 100 nF ceramic capacitors on each VDD pin within 3 mm trace distance. Place a 4.7 uF X7R bulk capacitor for each supply domain (core, I/O, analog). Route high-speed USB and Ethernet differential pairs (D+/D-, ETH TX/RX) with 90 ohm differential impedance, max length 50 mm, and keep them clear of switching signals. Per datasheet DS60001320H, route the Ethernet MII/RMII clock first and shield it from adjacent traces to avoid jitter on the 50 MHz reference.
Do not skip configuration of the FPU - projects ported from older PIC32MX code may default to soft-Float; ensure the build toolchain enables the FPU and uses -mhard-float to gain the 330 DMIPS performance. Failure to enable FPU leaves 60% of the performance on the table. Also: the Live-Update dual-panel Flash must be enabled via configuration bits at programming time, otherwise OTA updates will not work as expected. Verify the configuration bits in the project's device support package match the datasheet-recommended settings.
Compliance-Informationen
RoHS and lead-free per Microchip product page. AEC-Q100 qualification does NOT apply to the -I (industrial) part - select -E (extended) variants for automotive/extended-temperature use. Halogen-free status not explicitly stated in retrieved data.
