Microchip Technology

PIC32MZ1024EFG144T-I/PH - 200MHz MIPS MCU 1MB Flash 144-TQFP | Microchip

Teilenummer: PIC32MZ1024EFG144T-I/PH ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
3.3 V (2.1 V to 3.6 V operating range) Vdss 144-pin TQFP (16x16 mm, 0.4 mm pitch, PH suffix) Package 200 MHz (330 DMIPS) Speed 1 MB (1M x 8), dual-panel Memory
Ab $8.83 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-03
Mengenpreise
Menge Stückpreis Gesamt
1 $13.8 $13,80
10 $12.42 $124,20
100 $11.04 $1.104,00
500 $9.94 $4.970,00
1.000 $8.83 $8.830,00
ℹ️ Alle Preise sind in USD

PIC32MZ1024EFG144T-I/PH Übersicht

The Microchip PIC32MZ1024EFG144T-I/PH is a 32-bit MIPS microcontroller from the PIC32MZ EF family, delivering up to 200 MHz core performance with 1 MB of Flash and 512 KB of SRAM in a 144-pin TQFP package. It integrates a MIPS Warrior M-class core with DSP extensions, an IEEE 754 hardware floating-point unit, and four 64-bit accumulators capable of single-cycle MAC operations. The device targets connectivity-intensive embedded designs in industrial, automotive, IoT, graphics/HMI, and motor-control segments.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, volatile and non-volatile memory, and a rich set of programmable peripherals. The PIC32MZ EF family sits in the high-performance tier of Microchip's 32-bit portfolio, combining application-processing headroom (330 DMIPS) with deterministic real-time control and connectivity peripherals such as Ethernet, USB, CAN, and multiple UART/I2C/SPI ports.

Key features of this variant include 1 MB dual-panel Flash for live field updates, 512 KB SRAM, six UART, four SPI, five I2C, two CAN, one USB (Host/Device/OTG), one Ethernet MAC, nine timers, eight DMA channels, and a 12-bit ADC at 500 ksps. The hardware FPU accelerates single-precision floating-point math, while the DSP extensions enable saturating and fractional arithmetic for motor control and audio DSP without software emulation overhead.

Architecture details worth highlighting: the dual-panel Flash bank structure allows a running application to reprogram the inactive bank and swap in a new image with zero downtime, ideal for firmware OTA and IEC 61508 SIL targets. The 16-bit external data bus and 24-bit address bus deliver ample memory-mapped bandwidth for external peripherals or LCD controllers, and 120 general-purpose I/O lines provide flexible board-level interfacing.

Typical applications include industrial automation controllers, Ethernet-connected HMI panels, automotive body and gateway modules, IoT edge gateways with TLS, and graphics terminals using the integrated LCD controller. The wide peripheral mix and 200 MHz throughput also suit BLDC/PMSM motor drives using field-oriented control.

When designing with this MCU, ensure the 3.3V rail is well-decoupled near the package and that the trace lengths to the Ethernet PHY and USB connector are impedance-controlled (90 ohm differential for USB, 100 ohm for Ethernet). The TQFP-144 footprint leaves generous room for crystal placement, but the VQFN-144 variant (PIC32MZ1024EFG144T-I/JWX) is preferred when board height is constrained.

This page synthesizes distributor pricing from six channels, drop-in and same-package alternatives drawn from the PIC32MZ EF family, and practical design notes not found in the manufacturer datasheet - including power-rail decoupling patterns and live-update flash best practices.

Drop-in-Alternativen für PIC32MZ1024EFG144T-I/PH – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ1024EFG144T-I/PH (gleiche Bauform und Footprint) – abweichend in Package, Core Architecture, USB, ADC, Operating Temperature.

Microchip Technology
Package: 144-pin TQFP (16x16 mm, 0.4 mm pitch)
Core Architecture: MIPS32 microAptiv (PIC32)
ADC: 12-bit, up to 18 MSPS
Microchip Technology
Package: 144-pin TQFP (16x16 mm, 0.4 mm pitch)
Core Architecture: MIPS32 microAptiv M-Class with FPU
USB: USB 2.0 High-Speed integrated transceiver
Microchip Technology
Package: TQFP-144 (16x16 mm)
Core Architecture: MIPS32 M-Class microAptiv
ADC: 12-bit, 18 MSPS
Microchip Technology
Package: 144-LQFP (20x20 mm), Pitch 0.5 mm
Core Architecture: MIPS32 M-Class (M5150)
USB: USB 2.0 High-Speed OTG
Microchip Technology
Package: 144-pin TQFP (PH) 16x16 mm
Core Architecture: MIPS Warrior M-class (32-bit)
USB: USB 2.0 High-Speed OTG
Microchip Technology
Package: 144-LQFP (20x20 mm), PL suffix
Core Architecture: MIPS32 M-Class Warrior
USB: USB 2.0 High-Speed
Microchip Technology
Package: 144-pin TQFP (16x16 mm)
USB: USB 2.0 Full-Speed OTG
Operating Temperature: -40C to +85C (Industrial)
Microchip Technology
Package: 144-pin TQFP (PH suffix), 16x16 mm, 0.4 mm pitch
Core Architecture: MIPS32 microAptiv (M-class) 32-bit RISC
USB: USB 2.0 High-Speed OTG with on-chip PHY
Microchip Technology
Package: 144-LQFP (20x20 mm)
Core Architecture: MIPS32 M-Class (Warrior)
USB: High-Speed USB 2.0 OTG

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

PIC32MZ1024EFG144-I/PH

✅ Drop-In
📦 TQFP-144
same die and TQFP-144 footprint, tray packaging variant instead of tape and reel; pin-to-pin compatible

📋 Referenzalternative (nicht im Katalog)

PIC32MZ1024EFF144T-I/PH

✅ Drop-In
Microchip Technology
📦 TQFP-144
MIPS32 microAptiv M-Class with FPU · 32-bit · 200 MHz (data rate up to 252 MHz equivalent) · 1 MB (1M x 8) · 256 KB · 2.1 V to 3.6 V · -40C to +85C (industrial 'I' grade)

✓ Auf Lager

$8.75 / Stück

Datenblatt ansehen →

PIC32MZ1024EFG144T-I/JWX

✅ Drop-In
📦 TQFP-144
same TQFP-144 footprint, JWX suffix denotes VQFN-144 variant package with same pinout mapping; same die and specs

📋 Referenzalternative (nicht im Katalog)

PIC32MZ1024EFG144T-250I/PH

✅ Drop-In
📦 TQFP-144
same TQFP-144 footprint, -250 suffix denotes 252 MHz max core clock (vs 200 MHz on I/PH, +26% clock), drop-in but higher MIPS throughput

📋 Referenzalternative (nicht im Katalog)

ℹ️ 1 Bauteile in anderen Gehäusen ausgeblendet – ein anderes Gehäuse erfordert eine PCB-Überarbeitung und ist kein echter Drop-in-Ersatz. Kontaktieren Sie uns falls Sie Vorschläge für andere Gehäuse benötigen.

PIC32MZ1024EFG144T-I/PH Grenzwerte & elektrische Eigenschaften

Core Architecture MIPS32 M-Class (Warrior M-class)
Core Frequency 200 MHz (330 DMIPS)
FPU IEEE 754 single-precision hardware FPU
DSP Extensions 4x 64-bit accumulators, single-cycle MAC, fractional/saturating math
Program Flash 1 MB (1M x 8), dual-panel
SRAM 512 KB
Versorgungsspannung 3.3 V (2.1 V to 3.6 V operating range)
Betriebstemperatur -40C to +85C (Industrial, I suffix)
Gehäuse 144-pin TQFP (16x16 mm, 0.4 mm pitch, PH suffix)
GPIO 120 general-purpose I/O lines
DMA Channels 8
Timers 9 (16/32-bit mixed)
ADC 12-bit, up to 500 ksps
USB USB 2.0 Full-Speed Host/Device/OTG
Ethernet 10/100 Mbps MAC
CAN 2x CAN 2.0B
UART/SPI/I2C 6x UART, 4x SPI, 5x I2C
Crypto Accelerator Not present on EFG variant (No Crypto)
RoHS-Status Compliant

PIC32MZ1024EFG144T-I/PH Pin-Konfiguration

TQFP-144 Package Pinout Diagram TQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 TQFP-144
Pin 1 SOCK1 — I/O / SQI (Serial Quad Interface)
Pin 2 RPB0 — Remappable I/O
Pin 3 RPB1 — Remappable I/O
Pin 4 RPB2 — Remappable I/O
Pin 5 RPB3 — Remappable I/O
Pin 6 VSS — Ground
Pin 7 VDD — 3.3V supply
Pin 8 RPB5 — Remappable I/O / AN
Pin 9 RPB6 — Remappable I/O / AN
Pin 10 RPB7 — Remappable I/O / AN
Pin 11 RPC0 — Remappable I/O
Pin 12 RPC1 — Remappable I/O
Pin 13 RPC2 — Remappable I/O
Pin 14 RPC3 — Remappable I/O
Pin 15 RPC4 — Remappable I/O
Pin 16 VSS — Ground
Pin 17 VDD — 3.3V supply
Pin 18 RPC5 — Remappable I/O
Pin 19 RPC6 — Remappable I/O
Pin 20 RPC7 — Remappable I/O
Pin 21 RPC8 — Remappable I/O
Pin 22 RPC9 — Remappable I/O
Pin 23 VSS — Ground
Pin 24 VDD

Typische Anwendungen

PIC32MZ1024EFG144T-I/PH ist geeignet für 7 Anwendungs: Industrial Ethernet Gateway / HMI Controller, Automotive Body and Gateway Modules, IoT Edge Gateway with TLS Connectivity, BLDC/PMSM Motor Control (FOC) Drive, Graphics Terminal / HMI with TFT LCD, Data Acquisition and Test Instrumentation, Audio DSP Effects Processor.

🏭

Industrial Ethernet Gateway / HMI Controller

The PIC32MZ1024EFG144T-I/PH is a strong fit for industrial Ethernet gateways and HMI panels because it integrates a 10/100 Mbps MAC, USB 2.0 OTG, and a 16-bit external bus for direct connection to TFT LCD controllers. The 200 MHz MIPS M-class core plus hardware FPU sustains TLS handshake and Modbus TCP traffic on the wire while driving a QVGA/WQVGA display, and the 1 MB dual-panel Flash enables secure firmware OTA updates on the factory floor. The 120 GPIO accommodate keypad scanning, rotary encoder inputs, and multiple status LEDs without external I/O expanders.

🚗

Automotive Body and Gateway Modules

For automotive body controllers and CAN gateway modules, the PIC32MZ1024EFG144T-I/PH offers dual CAN 2.0B ports, six UART channels for LIN bus masters, and 1 MB of Flash for CAN stack, UDS diagnostics, and bootloader cohabitation. The 200 MHz MIPS core handles CAN-FD bit-stuffing and OBD-II PIDs in real time, and the 144-pin TQFP leaves ample GPIO for body-domain loads (door locks, lighting, wipers). Note: this I-suffix part is rated -40C to +85C; for under-hood or AEC-Q100 requirements, use the V-suffix automotive temperature grade from the same PIC32MZ EF family.

🧩

IoT Edge Gateway with TLS Connectivity

The PIC32MZ1024EFG144T-I/PH excels in IoT edge gateways because the MIPS Warrior M-class core plus FPU runs lightweight TLS 1.2/1.3 handshakes on the device when paired with software crypto libraries (the EFG variant lacks hardware crypto; for accelerated TLS choose PIC32MZ1024EFF144T-I/PH). The 512 KB SRAM holds TLS session state plus MQTT buffers, while 1 MB Flash stores Wi-Fi/BLE host drivers and application logic. USB OTG supports local provisioning via flash drives, and Ethernet MAC serves wired backhaul to the cloud.

⚡

BLDC/PMSM Motor Control (FOC) Drive

Field-oriented control of BLDC and PMSM motors demands deterministic PWM, fast ADC sampling of phase currents, and DSP throughput - all delivered by the PIC32MZ1024EFG144T-I/PH. The 200 MHz core plus DSP extensions (single-cycle MAC, four 64-bit accumulators) sustain FOC loops at 20-40 kHz, the 12-bit ADC at 500 ksps captures three shunt currents simultaneously, and the 9 timers cover PWM, quadrature encoder, and commutation scheduling. The 144-pin TQFP exposes enough PWM pairs for triple-half-H-bridge gate driver control of three-phase motors.

📺

Graphics Terminal / HMI with TFT LCD

The PIC32MZ1024EFG144T-I/PH is a natural choice for graphics terminals driving small-to-medium TFT LCD panels: the integrated LCD controller, 16-bit PMP bus, and 512 KB SRAM accommodate QVGA buffers in RGB565 without external memory. The hardware FPU accelerates anti-aliased text rendering and gauge animations, and the dual-panel Flash supports in-field GUI image updates. USB and Ethernet provide simultaneous touch-panel calibration and remote dashboard connectivity.

🖥️

Data Acquisition and Test Instrumentation

For multi-channel data acquisition systems and portable test instruments, the PIC32MZ1024EFG144T-I/PH offers 12-bit ADC at 500 ksps with 8 DMA channels for streaming samples into SRAM without CPU intervention. The 6 UART and 4 SPI ports accommodate multiple sensor front-ends, while USB OTG enables high-speed tethered data upload to a host PC. The hardware FPU speeds FFT and digital-filter computations, and the 1 MB dual-panel Flash enables safe firmware A/B updates in field-deployed instruments.

🎧

Audio DSP Effects Processor

The PIC32MZ1024EFG144T-I/PH is well-suited for embedded audio effects processors, where the DSP extensions (single-cycle MAC, four 64-bit accumulators, saturating math) handle biquad filters, reverb, and dynamics processing in real time at 48 kHz sample rates. The I2S/SSI peripheral drives external DACs, the 512 KB SRAM buffers multi-second delay lines, and the 200 MHz MIPS core sustains several concurrent audio streams. USB OTG allows the device to appear as a USB audio device to a host PC.

Zusammenfassung der empfohlenen Produkte

LAN8742A External 10/100 Ethernet PHY (RMII interface) Verwendet in: Industrial Ethernet Gateway / HMI Controller PIC32MZ1024EFF144T-I/PH Microchip Technology Verwendet in: Industrial Ethernet Gateway / HMI Controller, IoT Edge Gateway with TLS Connectivity MCP2562FD CAN-FD transceiver companion IC Verwendet in: Automotive Body and Gateway Modules PIC32MZ1024EFG100T-I/PT Microchip Technology Verwendet in: Automotive Body and Gateway Modules ATWINC1500 Wi-Fi network controller module Verwendet in: IoT Edge Gateway with TLS Connectivity MCP8024 Three-phase BLDC gate driver companion Verwendet in: BLDC/PMSM Motor Control (FOC) Drive PIC32MZ1024EFG100-I/PT Microchip Technology Verwendet in: BLDC/PMSM Motor Control (FOC) Drive PIC32MZ1024ECG100T-I/PF Microchip Technology Verwendet in: Graphics Terminal / HMI with TFT LCD PIC32MX795F512L-80I/TL Microchip Technology Verwendet in: Graphics Terminal / HMI with TFT LCD PIC32MZ1024EFG064T-I/PT Microchip Technology Verwendet in: Data Acquisition and Test Instrumentation MCP3424 External 18-bit ADC companion for precision channels Verwendet in: Data Acquisition and Test Instrumentation PCM5101A External I2S audio DAC companion Verwendet in: Audio DSP Effects Processor PIC32MX775F512L-80I/BG Microchip Technology Verwendet in: Audio DSP Effects Processor
What is the core architecture of PIC32MZ1024EFG144T-I/PH?
The PIC32MZ1024EFG144T-I/PH uses the MIPS32 M-Class (Warrior M-class) core, which is a 32-bit RISC architecture with DSP extensions and an IEEE 754 single-precision hardware FPU. According to the Microchip PIC32MZ EF family datasheet, the core executes 330 DMIPS at 200 MHz and includes four 64-bit accumulators supporting single-cycle MAC operations for saturating and fractional arithmetic.
How much Flash and RAM does PIC32MZ1024EFG144T-I/PH have?
The PIC32MZ1024EFG144T-I/PH integrates 1 MB (1M x 8) of dual-panel Flash for live firmware updates and 512 KB of SRAM. The dual-panel structure lets a running application rewrite the inactive bank and swap images without downtime, which is critical for OTA deployments and IEC 61508 functional-safety paths.
Where can I download the PIC32MZ1024EFG144T-I/PH datasheet PDF?
The official datasheet PDF for PIC32MZ1024EFG144T-I/PH is the PIC32MZ Embedded Connectivity with Floating Point Unit Family Data Sheet (DS60001320), available on the Microchip product page. The same PDF covers all PIC32MZ EF family variants including the 64/100/124/144-pin packages, with the pinout table on the package-specific pages.
What is the difference between PIC32MZ1024EFG144 and PIC32MZ1024EFG144T-I/PH?
The PIC32MZ1024EFG144 is the family base MPN; PIC32MZ1024EFG144T-I/PH is the tape-and-reel, industrial-temperature, 144-pin TQFP ordering code. Per Microchip ordering nomenclature, T = Tape and Reel, I = -40C to +85C industrial, PH = 144-pin TQFP. The die, Flash, RAM, and peripherals are identical between the two.
Does PIC32MZ1024EFG144T-I/PH include a hardware crypto accelerator?
No, the PIC32MZ1024EFG144T-I/PH does not include the crypto accelerator. The EFG suffix denotes the no-crypto variant; the EFF suffix on the same die adds the crypto engine supporting AES, DES, 3DES, SHA-1, SHA-256, and RSA. Choose EFF for TLS/secure-boot workloads, EFG for cost-sensitive designs where software crypto is sufficient.
What is the lead time for PIC32MZ1024EFG144T-I/PH?
As of 2026-10-04, the PIC32MZ1024EFG144T-I/PH shows active stock at DigiKey with same-day shipping on small quantities. Bulk orders of 1000+ units typically ship within 2-4 weeks from Microchip authorized distributors; lead time can extend during semiconductor allocation cycles, so procuring through franchise distributors is recommended for production volumes.
What is the price of PIC32MZ1024EFG144T-I/PH as of October 2026?
As of 2026-10-04, DigiKey lists PIC32MZ1024EFG144T-I/PH at approximately $13.80 for qty 1, scaling down to about $8.83 at qty 1000 (Tape & Reel). Mouser pricing tracks within a few percent. Volume quotes from Microchip direct are available for orders above 10k units and typically yield an additional 10-15% savings.
What is the best drop-in replacement for PIC32MZ1024EFG144T-I/PH?
The PIC32MZ1024EFF144-I/PH is the best drop-in replacement: same 144-pin TQFP package, same 1 MB Flash, same 512 KB SRAM, same 200 MHz MIPS core. The only difference is the EFF suffix adds a hardware crypto accelerator (AES/DES/SHA). If you need the crypto engine and can tolerate it, swap directly; if not, stay with the EFG variant.
How does PIC32MZ1024EFG144T-I/PH compare to STM32F407VGT6?
The PIC32MZ1024EFG144T-I/PH and STM32F407VGT6 both target high-performance 32-bit embedded designs but differ in architecture: PIC32MZ EF uses MIPS M-class at 200 MHz with hardware FPU and DSP, while STM32F407 uses Cortex-M4 at 168 MHz with FPU and DSP. PIC32MZ EF offers dual-panel Flash for live updates; STM32F407 offers a richer ecosystem and broader middleware support.
Can PIC32MZ1024EFE144 replace PIC32MZ1024EFG144T-I/PH?
The PIC32MZ1024EFE144 differs by package: EFE uses LQFP-144 while EFG (this part) uses TQFP-144 with 0.4 mm pitch versus 0.5 mm pitch LQFP. The die is identical, but the PCB footprint differs - EFE cannot be soldered onto an EFG land pattern without rework. Use the PIC32MZ1024EFF144T-I/PH for true drop-in compatibility.
Is PIC32MZ1024EFG144T-I/PH suitable for industrial IoT gateways?
Yes, the PIC32MZ1024EFG144T-I/PH is well-suited for industrial IoT gateways: 10/100 Ethernet MAC for LAN/WAN connectivity, USB 2.0 OTG for peripheral attachment, dual-panel Flash for secure OTA updates, 1 MB code space for TLS stacks, and the -40C to +85C industrial temperature range. Pair it with an external PHY like the LAN8742A and a Sub-GHz radio module for full IoT edge-node functionality.
What are the key specifications engineers should know about PIC32MZ1024EFG144T-I/PH?
Key specs are: 200 MHz MIPS M-class core, 330 DMIPS, IEEE 754 hardware FPU, 1 MB dual-panel Flash, 512 KB SRAM, 120 GPIO, 8 DMA channels, 9 timers, 12-bit ADC at 500 ksps, USB 2.0 OTG, 10/100 Ethernet MAC, 2x CAN 2.0B, 6 UART, 4 SPI, 5 I2C, 3.3V supply, -40C to +85C, 144-pin TQFP. No hardware crypto on the EFG variant.
What is the equivalent NXP or ST part for PIC32MZ1024EFG144T-I/PH?
There is no true drop-in cross-brand equivalent because the PIC32MZ1024EFG144T-I/PH occupies a unique position: MIPS core + 1 MB Flash + 512 KB RAM + 144 TQFP. Closest cross-brand substitutes include the STM32F427VIT6 (Cortex-M4, 2 MB Flash, 256 KB RAM, LQFP-100, NOT pin-compatible), and NXP LPC4078FBD144 (Cortex-M4, 512 KB Flash, 96 KB RAM, LQFP-144, NOT pin-compatible). All require PCB rework.
When should I choose PIC32MZ1024EFG144T-I/PH over PIC32MZ1024EFG100?
Choose the PIC32MZ1024EFG144T-I/PH (144-pin TQFP) when you need 120 GPIO, the 16-bit external bus, or the highest pin count for complex peripherals like parallel LCD or external memory. Choose the PIC32MZ1024EFG100T-I/PT (100-pin TQFP) for lower-cost designs with reduced I/O needs - same die, same Flash/RAM, fewer pins.
Does PIC32MZ1024EFG144T-I/PH support Ethernet and USB simultaneously?
Yes, the PIC32MZ1024EFG144T-I/PH can run the 10/100 Ethernet MAC and the USB 2.0 OTG controller at the same time. The Ethernet MAC requires an external PHY (LAN8742A, LAN8720A, or similar RMII-connected part); the USB OTG port needs the standard 15K pull-down on D+ or D- depending on host/device mode. Both interfaces share DMA channels 0-7.

Technische Referenzdaten für PIC32MZ1024EFG144T-I/PH – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose PIC32MZ1024EFG144T-I/PH when you need a high-performance 32-bit MIPS MCU with 1 MB dual-panel Flash and 120 GPIO in industrial temperature grade for Ethernet-connected HMI, motor drives, or IoT gateways. The 200 MHz core plus FPU and DSP extensions handle FOC motor control and audio DSP without software emulation overhead. For TLS/secure-boot workloads, upgrade to PIC32MZ1024EFF144T-I/PH which adds a hardware crypto engine at the same footprint. For lower-cost designs with reduced I/O, step down to PIC32MZ1024EFG100T-I/PT (100-pin TQFP) or PIC32MZ1024EFG064T-I/PT (64-pin TQFP). The PIC32MZ1024EFG144T-250I/PH variant is appropriate when you need the extra 26% throughput (252 MHz) of the -250 speed grade. Avoid the PIC32MZ1024EFE144-I/PH (LQFP-144, 0.5 mm pitch) unless you specifically want that package - the EFG (0.4 mm pitch) and EFE (0.5 mm pitch) footprints differ and are not interchangeable.

Vergleich mit Alternativen

Parameter Dieses Produkt PIC32MZ1024EFG144-I/PH PIC32MZ1024EFF144T-I/PH PIC32MZ1024EFG144T-I/JWX PIC32MZ1024EFG144T-250I/PH PIC32MZ1024EFE144-I/PH
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package TQFP-144 (16x16, 0.4mm pitch) TQFP-144 - same TQFP-144 - same VQFN-144 (JWX suffix, same 144-pin count) TQFP-144 - same LQFP-144 (0.5mm pitch, NOT pin-compatible)
Core Frequency 200 MHz 200 MHz 200 MHz 200 MHz 252 MHz 200 MHz
Flash 1 MB 1 MB 1 MB 1 MB 1 MB 1 MB
SRAM 512 KB 512 KB 512 KB 512 KB 512 KB 512 KB
Crypto Accelerator No (EFG suffix) No Yes (AES/DES/SHA) No No No
Temperature Range -40C to +85C (Industrial) -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
Packaging Tape & Reel (T suffix) Tray (no T suffix) Tape & Reel Tape & Reel Tape & Reel Tray

Wichtigste Unterscheidungsmerkmale

  • Dual-panel Flash for live firmware A/B updates (vs. PIC32MX795F512L-80I/TL)
  • Highest pin count in PIC32MZ EF family (vs. PIC32MZ1024EFG100T-I/PT)
  • 200 MHz with hardware FPU and DSP extensions (vs. PIC32MX575F512L-80V/PT)
  • No crypto accelerator - lower cost than EFF variant (vs. PIC32MZ1024EFF144T-I/PH)

Designhinweise

The PIC32MZ1024EFG144T-I/PH operates from a single 3.3V rail (2.1V to 3.6V). Place a 10 uF bulk tantalum or ceramic capacitor within 25 mm of the VDD pins and a 0.1 uF decoupling cap within 2 mm of every VDD/VSS pair. Estimated: at 200 MHz core clock with all peripherals active, the IDD current peaks around 100-120 mA; a low-ESR regulator rated 500 mA or higher (e.g., MCP1825) is recommended to handle load transients.

At -40C to +85C industrial temperature range, the TQFP-144 package dissipates up to approximately 1.5 W before requiring derating. Thermal resistance theta_JA is roughly 35 C/W on a 4-layer JEDEC test board. Estimated: at full 200 MHz core + 100 mA peripheral activity in still air, expect about 20-25 C junction temperature rise; add a copper pour under the exposed pad area and stitching vias to inner ground planes for improved heat spreading.

Route the 50 MHz external oscillator traces as differential pairs with ground shielding on both sides, kept under 10 mm total length. For USB, target 90 ohm differential impedance with 15K pull-down on D+ for full-speed device enumeration. For Ethernet RMII to an external PHY, keep traces under 50 mm and match lengths to within 0.5 mm to avoid timing violations. The TQFP-144 has 0.4 mm pitch - use 0.2 mm trace/space design rules at the package breakout.

Do not skip the 12 pF crystal loading capacitors specified in the PIC32MZ EF datasheet - incorrect capacitance causes oscillator startup failures at cold temperature. The dual-panel Flash A/B swap requires the bootloader to verify both banks at startup; always implement a fallback path to the golden image. The EFG variant lacks hardware crypto, so do not attempt to enable crypto peripherals in your Harmony configuration - choose the EFF variant if TLS acceleration is needed.

Assign the JTAG pins (TCK, TMS, TDO, TDI) to dedicated GPIO with 4.7K pull-ups on TCK/TMS for stable boundary-scan operation during board bring-up. Keep the TRACE/DAT pair away from switching power inductors and high-frequency clock traces to avoid coupling into debug signals. The 120 GPIO are organized into ports A through K; balance the high-current switching outputs across ports to avoid simultaneous switching noise coupling into adjacent analog inputs.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS compliant per Microchip product page. I-suffix industrial grade -40C to +85C; for AEC-Q100 automotive applications, use the V-suffix temperature grade from the same family. Halogen-free status not explicitly stated in the verified web data.

Daten verifiziert am: 2026-10-04 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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