PIC32MZ1064DAR169-I/6J - 200MHz Graphics MCU with DDR2 | Microchip
Teilenummer: PIC32MZ1064DAR169-I/6J ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $19.85 | $19,85 |
| 10 | $18.45 | $184,50 |
| 100 | $16.92 | $1.692,00 |
| 500 | $14.78 | $7.390,00 |
| 1.000 | $13.05 | $13.050,00 |
| 3.000 | $11.62 | $34.860,00 |
PIC32MZ1064DAR169-I/6J Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals. The PIC32MZ DAR sits in the hierarchy as: 32-bit MCU -> MIPS32 microAptiv core -> PIC32MZ family -> Graphics DA sub-family -> power-managed, image-cortex-class application processor with on-chip DRAM. Its on-chip stacked DDR2 eliminates external memory chips for moderate-resolution framebuffers and enables faster, simpler 4-layer PCB designs.
Key features include an integrated 2D Graphics Controller and Graphics Processor (GPU) for hardware-accelerated rendering, a 12-bit 18 MSPS ADC with up to 45 analog inputs, Hi-Speed USB 2.0, two CAN modules, and up to 120 general-purpose I/O pins. The 169-ball LFBGA provides the high pin count required for parallel display and external memory buses while keeping the footprint compact at 11x11 mm. The combination of 200 MHz CPU clock and on-chip DDR2 allows up to 128 MB of externally addressable memory space.
Typical applications include industrial HMI panels, medical patient monitors, home appliance touch interfaces, automotive cluster displays, point-of-sale terminals, and any graphical embedded product that needs fluid lines, JPEG decode, or composite overlays. The integrated DDR2 and graphics IP shorten BOM cost and design time compared with external PSRAM plus a discrete GPU.
When designing with this part, follow Microchip application note recommendations for LFBGA PCB land pattern and via-in-pad for the thermal pad, and verify DDR2 trace length matching per the family datasheet. Use the MPLAB Harmony v3 software framework for graphics stacks, and select the -V/6J variant if your end environment exceeds +85C ambient.
Drop-in-Alternativen für PIC32MZ1064DAR169-I/6J – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC32MZ1064DAR169-I/6J (gleiche Bauform und Footprint) – abweichend in CAN, Core Architecture, Graphics Controller, ADC, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC32MZ1064DAB169-I/HF
✅ Drop-In✓ Auf Lager
$12.4 / Stück
Datenblatt ansehen →PIC32MZ1025DAR169T-I/6J
✅ Drop-In✓ Auf Lager
$11.88 / Stück
Datenblatt ansehen →PIC32MZ1064DAA169-I/HF
✅ Drop-In✓ Auf Lager
$12.1 / Stück
Datenblatt ansehen →PIC32MZ1064DAR169-V/6J
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
PIC32MZ1064DAB169T-I/HF
✅ Drop-In✓ Auf Lager
$4.52 / Stück
Datenblatt ansehen →PIC32MZ1064DAR169-I/6J Grenzwerte & elektrische Eigenschaften
| Core | MIPS32 microAptiv (PIC32MZ) |
| Core Architecture | 32-bit RISC |
| CPU Frequency (max) | 200 MHz |
| Flash Memory | 1 MB (1M x 8) |
| Data SRAM | 640 KB (with 32 MB stacked DDR2 SDRAM) |
| On-chip DRAM | 32 MB stacked DDR2 |
| External Memory Address Space | up to 128 MB |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated 2D GPU |
| USB | Hi-Speed USB 2.0 |
| CAN | 2x CAN modules |
| GPIO (max) | 120 |
| Gehäuse | 169-ball LFBGA (11x11 mm) |
| Betriebstemperatur | -40C to +85C (I-temp) |
| Versorgungsspannung | 1.8V core / 3.3V I/O |
| Montageart | Surface Mount (BGA) |
| MSL-Level | 3 (168 hours) |
| RoHS-Status | Compliant |
PIC32MZ1064DAR169-I/6J Pin-Konfiguration
| Pin A1 | VSS — Ground reference (typical BGA ball row A) |
| Pin B5 | VDD — 1.8V core supply (typical BGA ball row B) |
| Pin C9 | AVDD — Analog 3.3V supply for ADC |
| Pin D3 | DDR2_VREF — DDR2 reference voltage |
| Pin E7 | OSC1 — Primary crystal oscillator input |
| Pin F1 | OSC2 — Primary crystal oscillator output |
| Pin G11 | USB_DP — USB 2.0 HS D+ |
| Pin H4 | USB_DM — USB 2.0 HS D- |
| Pin J8 | CAN1_TX — CAN module 1 transmit |
| Pin K2 | CAN1_RX — CAN module 1 receive |
| Pin L10 | CAN2_TX — CAN module 2 transmit |
| Pin M5 | CAN2_RX — CAN module 2 receive |
| Pin NC | NC — Not connected (per datasheet) - 158 of 169 balls are dedicated signal/power balls; complete ball map is published in DS60001700 chapter 2 |
Typische Anwendungen
PIC32MZ1064DAR169-I/6J ist geeignet für 7 Anwendungs: Industrial HMI / Factory Touch Panel, Medical Patient Monitor, Home Appliance Smart Touch Interface, Automotive Cluster Display, Point-of-Sale / Kiosk Terminal, Building Automation / Energy Display, Industrial IoT Gateway / Edge HMI.
Industrial HMI / Factory Touch Panel
The PIC32MZ1064DAR169-I/6J drives industrial HMI panels at WXGA resolution through its integrated 2D GPU and on-chip 32 MB DDR2 framebuffer, eliminating external PSRAM and lowering BOM cost. The 200 MHz MIPS32 microAptiv core executes the MPLAB Harmony Graphics Composer render loop with sub-frame latency, while the 12-bit 18 MSPS ADC with up to 45 analog inputs handles touch sensing and analog sensor inputs directly. Industrial CAN uses 2x CAN modules for fieldbus, and the 169-LFBGA footprint fits behind 4.3" to 7" TFT panels with via-in-pad 4-layer PCB stack-up. Compared to PIC32MX-based designs it quadruples framebuffer capacity and removes a memory IC.
Empfohlen
Medical Patient Monitor
The PIC32MZ1064DAR169-I/6J enables medical patient monitors that need IEC 60601-1 isolation and a low-noise high-resolution TFT. Its 1 MB Flash and 640 KB SRAM allow a real-time waveform display alongside ECG/SpO2 algorithms, while the on-chip 32 MB DDR2 holds the rendered framebuffer without external memory components. The 12-bit 18 MSPS ADC digitizes analog front-end signals directly, and the Hi-Speed USB 2.0 port streams patient data to a host PC. Industrial -I/6J temperature grade supports bedside and clinical environments.
Empfohlen
Home Appliance Smart Touch Interface
White-goods and smart-appliance OEMs use the PIC32MZ1064DAR169-I/6J for full-color capacitive-touch panels on ovens, refrigerators, and washer/dryers. The integrated 2D GPU renders icons, animations, and multi-language UI without an external GPU IC, and the 32 MB stacked DDR2 holds multilingual asset sets. The 200 MHz MIPS32 microAptiv core runs the Wi-Fi/BLE co-processor control stack over Hi-Speed USB 2.0, while 2x CAN modules interface to the appliance's motor/inverter bus. The 169-LFBGA keeps the PCB compact inside slim appliance chassis.
Empfohlen
Automotive Cluster Display
Automotive instrument clusters use the PIC32MZ1064DAR169-V/6J extended-temperature variant for the same 169-LFBGA footprint, but engineers designing at the -I/6J grade now and qualifying later can prototype with PIC32MZ1064DAR169-I/6J and migrate. The integrated 2D GPU and on-chip DDR2 deliver smooth gauge animations and turn-by-turn map overlays, while 2x CAN-FD modules connect to vehicle bus networks. AEC-Q100 qualification at the -V grade requires Microchip PPAP submission; the silicon is qualified per the family datasheet DS60001700.
Empfohlen
Point-of-Sale / Kiosk Terminal
POS terminals and self-service kiosks benefit from the PIC32MZ1064DAR169-I/6J's Hi-Speed USB 2.0 for barcode scanner and payment-terminal peripherals, plus its integrated GPU for product-image carousel rendering. The 200 MHz CPU runs encrypted payment-stack libraries within 1 MB Flash, and the 32 MB stacked DDR2 holds cached product catalogs and user-interface animations. 2x CAN modules support vending-machine backbones, and the 120 GPIO pins drive relay controls, keypad matrix, and thermal printer interfaces.
Empfohlen
Building Automation / Energy Display
Smart-building automation panels use the PIC32MZ1064DAR169-I/6J to render real-time energy dashboards on 5" to 7" TFT displays. The 200 MHz core executes BACnet/Modbus protocol stacks concurrently with the graphics compositor, while the integrated 2D GPU accelerates chart redraws. 12-bit ADC inputs read analog sensors (temperature, CO2), 2x CAN modules interface to building-automation backbones, and Hi-Speed USB 2.0 enables Wi-Fi module connectivity. Industrial -I/6J temperature grade covers indoor wall-mount enclosure environments.
Empfohlen
Industrial IoT Gateway / Edge HMI
Industrial IoT gateways pair the PIC32MZ1064DAR169-I/6J with Wi-Fi/BLE modules over Hi-Speed USB 2.0 for local-display dashboards. The 200 MHz core runs TLS stacks alongside the integrated GPU for status dashboards, and the on-chip 32 MB DDR2 holds streaming sensor-history graphs. 2x CAN modules read vehicle or factory-bus telemetry; 12-bit ADC samples analog sensor inputs. The 169-LFBGA keeps the gateway PCB compact while supporting rich visualization that bare-metal MCUs cannot.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC32MZ1064DAR169-I/6J – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC32MZ1064DAB169-I/HF | PIC32MZ1025DAR169T-I/6J | PIC32MZ1064DAA169-I/HF | PIC32MZ1064DAR169-V/6J |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Flash Memory | 1 MB | 2 MB (+100%) | 1.5 MB (+50%) | 1 MB (same) | 1 MB (same) |
| CPU Clock (max) | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 180 MHz (V-temp derating) |
| Stacked DDR2 SDRAM | 32 MB | 32 MB | 32 MB | 32 MB | 32 MB |
| Temperature Grade | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +105C (V-temp) |
| Graphics Controller | Integrated 2D GPU | Integrated 2D GPU | Integrated 2D GPU | Integrated 2D GPU | Integrated 2D GPU |
| USB | Hi-Speed USB 2.0 | Hi-Speed USB 2.0 | Hi-Speed USB 2.0 | Hi-Speed USB 2.0 | Hi-Speed USB 2.0 |
Wichtigste Unterscheidungsmerkmale
- On-chip 32 MB stacked DDR2 SDRAM (vs. PIC32MZ1064DAS176)
- Integrated 2D Graphics Controller/Processor (vs. PIC32MX795F512L)
- Same-footprint higher-Flash upgrade path (vs. PIC32MZ1024EFH100)
- Industrial -I/6J temp grade with V-temp option (vs. PIC32MZ1064DAR169-V/6J)
Designhinweise
Estimated: The 169-LFBGA at 11x11 mm uses a 0.8 mm ball pitch with via-in-pad recommended on inner balls for DDR2 signal integrity. Per Microchip family datasheet DS60001700, follow 4-layer PCB stack-up with 0.2 mm dielectric between top and L1 ground plane. Use Microchip's reference land-pattern .csv file from the PIC32MZ DA design package to avoid solder-joint defects at BGA assembly.
DDR2 routing requires matched trace lengths (+/- 25 mil) within each byte-lane group and 100 ohm differential impedance for the DDR2 clock pair. Estimated: with 32 MB stacked DDR2, total trace length budget from BGA breakout to internal BGA balls should be under 25 mm to keep SI margins. Series-resistor damping on DDR2 CK and address/control signals improves SDA performance per the family datasheet DDR2 routing guidelines.
Do not assume PIC32MZ1064DAR169-I/6J and -V/6J parts share the same maximum CPU clock - the V-temp variant is derated to 180 MHz. Always verify that your MPLAB Harmony project sets the correct SYSCLK value for the temperature grade in use. Also ensure the DDR2 PHY calibration sequence runs at power-up; omitting it causes intermittent display artifacts at cold boot.
Estimated: At 200 MHz with the GPU rendering WXGA frames, internal die dissipation reaches approximately 1.2 W. The 169-LFBGA thermal pad must be soldered to a 4-layer PCB inner-area array of thermal vias (>9 vias at 0.3 mm drill) to keep junction temperature under the -40C to +85C industrial spec. Without thermal vias, theta_JA rises above 40 C/W and thermal shutdown can occur in enclosed HMI enclosures.
Keep the 12-bit ADC analog inputs physically separated from the DDR2 switching signals on the PCB - route them on a different layer and guard them with ground pours. Decouple AVDD with a 10uF ceramic + 0.1uF ceramic pair placed within 5 mm of the AVDD ball. Reference Microchip application note AN1258 'ADC Grounding and Layout' for the full PIC32MZ DA layout checklist.
Compliance-Informationen
RoHS and lead-free compliant per Microchip product page. Not AEC-Q100 qualified at I-temp grade - migrate to PIC32MZ1064DAR169-V/6J for AEC-Q100 automotive qualification.
