RK3168 - Dual-Core Cortex-A9 SoC | Rockchip | Mobile/Embedded
Teilenummer: RK3168 ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.5 | $7,50 |
| 10 | $7 | $70,00 |
| 100 | $6 | $600,00 |
| 400 | $5.652 | $2.260,80 |
| 1.000 | $5.1 | $5.100,00 |
RK3168 Übersicht
A SoC (System-on-Chip) is an integrated circuit that consolidates CPU cores, GPU, video codecs, display controllers, and peripheral interfaces on a single silicon die. Within the broader taxonomy, the RK3168 belongs to the application processor family, sitting between a microcontroller (no display/multimedia capability) and a full multimedia SoC. The Cortex-A9 microarchitecture places the RK3168 in the mid-2010s generation of ARMv7 application processors, which succeeded the Cortex-A8 and was later overtaken by Cortex-A53/A55 designs.
Key features include dual-core 1.2 GHz Cortex-A9 with out-of-order execution, PowerVR SGX540 graphics, integrated HDMI/LVDS display controllers, USB 2.0 OTG, MIPI CSI camera interface, multiple SDIO/EMAC/SD card controllers, and a hardware crypto block. The SoC is fabbed on a low-power process with typical smartphone power dissipation below 1 W, enabling fanless designs in tablets and set-top boxes.
Architecturally, the RK3168 uses a dual-core Cortex-A9 with NEON SIMD for media acceleration and a separate VPU (Video Processing Unit) that offloads 1080p decode from the CPU. This hardware partitioning delivers the multimedia performance of higher-priced application processors while maintaining the power profile of mobile devices. The SGX540 GPU provides OpenGL ES 2.0 and OpenVG 1.1 support suitable for 3D UI and casual gaming.
Typical applications include Android smartphones and tablets in the 7-10 inch class, Miracast/dongle wireless display adapters, low-cost media players and set-top boxes, in-vehicle infotainment (IVI) systems, and industrial HMI panels. The Miracast reference design (RK3168 + Wi-Fi companion chip) became a $10 retail adapter form factor in 2013.
When designing with this part, ensure the PCB stack-up meets the BGA escape routing requirements and provide adequate thermal relief on the package substrate. Designers should pair the RK3168 with LPDDR2 or DDR3 memory validated by Rockchip's hardware reference manual to avoid boot issues.
This page synthesizes distributor pricing, datasheet details, and Rockchip family alternatives not available on a single manufacturer datasheet, helping procurement engineers and engineering teams source the part with confidence.
Drop-in-Alternativen für RK3168 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
RK3188
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
RK3028
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
RK3168 Grenzwerte & elektrische Eigenschaften
| CPU Architecture | Dual-core ARM Cortex-A9 |
| CPU Clock Speed | 1.2 GHz |
| NEON SIMD Coprocessor | Yes (per core) |
| FPU Coprocessor | Yes (per core) |
| GPU | PowerVR SGX540 @ 400 MHz |
| Video Decoder | 1080p H.264/MJPEG/VC-1/MPEG-4 (hardware) |
| Process Node | Low-power (per Rockchip TRM) |
| Typical Power Dissipation | <1 W (smartphone use case) |
| Display Interfaces | HDMI, LVDS, MIPI DSI |
| Camera Interface | MIPI CSI |
| USB | USB 2.0 OTG |
| Memory Interface | LPDDR2 / DDR3 |
| Gehäuse | BGA |
| Operating System Support | Android 4.x |
| RoHS-Status | Compliant |
RK3168 bga Pinbelegungsleitfaden
Pinbelegung für RK3168 (bga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für RK3168.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
RK3168 ist geeignet für 6 Anwendungs: Android Smartphones, 7-10 Inch Android Tablets, Miracast Wireless Display Adapters, Set-Top Boxes and Media Players, In-Vehicle Infotainment (IVI), Industrial HMI Panels.
Android Smartphones
The RK3168's dual-core Cortex-A9 at 1.2 GHz with PowerVR SGX540 GPU delivers the throughput required for Android 4.x smartphones in the entry-level to mid-range segment. Typical BOM integrates the RK3168 with LPDDR2 memory, eMMC storage, MIPI DSI LCD, MIPI CSI camera, and 3G/4G modem. The 1 W typical power dissipation supports all-day battery life in 1500-2000 mAh smartphone packs without active cooling.
Empfohlen
7-10 Inch Android Tablets
The RK3168 drives 7-10 inch Android tablets targeting the entry-level and educational markets where cost dominates over peak performance. HDMI output supports external 1080p display mirroring for classroom projection, while the LVDS interface drives the integrated LCD panel. The fanless thermal envelope is maintained by the SGX540's modest 400 MHz clock and the dual-core CPU's 1.2 GHz limit.
Empfohlen
Miracast Wireless Display Adapters
Rockchip's 2013 announcement specifically showcased the RK3168 in a $10 Miracast dongle reference design paired with a Wi-Fi companion chip. The hardware H.264 1080p decoder enables low-latency screen mirroring from Android and Windows devices, while the small BGA package allows the dongle to fit into HDMI-stick form factors. Power comes from the HDMI port or a single USB connector.
Empfohlen
Set-Top Boxes and Media Players
The RK3168 powers entry-level Android set-top boxes and IPTV media players supporting 1080p H.264 decode of streaming video, HDMI output to the television, and USB 2.0 for external HDD media playback. The hardware video decoder offloads 1080p streams from the CPU, freeing the Cortex-A9 cores for UI rendering and network buffering.
Empfohlen
In-Vehicle Infotainment (IVI)
The RK3168's hardware video decode and HDMI/LVDS dual-display support make it suitable for aftermarket in-vehicle infotainment systems featuring Android Auto-like interfaces. The 1 W typical power dissipation handles the thermal environment of head-unit enclosures, while the BGA form factor fits behind the LCD panel. Automotive AEC-Q100 qualification is not present, so aftermarket only.
Empfohlen
Industrial HMI Panels
The RK3168 drives industrial human-machine interface panels requiring Android 4.x GUI with capacitive touch, MIPI DSI display, and Ethernet connectivity for factory-floor integration. The PowerVR SGX540 GPU renders SCADA dashboards and 3D machinery visualizations at 720p with low latency. Long-life-cycle industrial designs benefit from the BGA package's mechanical robustness and the SoC's stable firmware.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für RK3168 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | RK3188 | RK3028 |
|---|---|---|---|
| Package | BGA | BGA | BGA |
| Brand | Rockchip | Rockchip | Rockchip |
| CPU Architecture | Dual-core Cortex-A9 | Quad-core Cortex-A9 | Dual-core Cortex-A9 |
| CPU Clock Speed | 1.2 GHz | 1.6-1.8 GHz | 1.0 GHz |
| GPU | PowerVR SGX540 @ 400 MHz | Mali-400 MP4 | Mali-400 MP2 |
| Video Decode | 1080p H.264/MJPEG/VC-1/MPEG-4 | 1080p H.264/MJPEG/VC-1/MPEG-4 + 4K H.265 (VPU2) | 1080p H.264 |
| Memory Interface | LPDDR2 / DDR3 | DDR3 / LPDDR2 | DDR3 / LPDDR2 |
| Typical Power | <1 W | Approx 2 W | <1 W |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy |
Wichtigste Unterscheidungsmerkmale
- Dual-core Cortex-A9 at 1.2 GHz with NEON per core (vs. RK3188)
- PowerVR SGX540 @ 400 MHz GPU (vs. RK3028 Mali-400 MP2)
- Hardware 1080p H.264/VC-1/MPEG-4 decoder VPU (vs. RK3188 VPU2)
Designhinweise
Estimated: At typical smartphone load (CPU 50% utilization, GPU 400 MHz, display ON), the RK3168 dissipates approximately 1 W. In a sealed tablet enclosure without active cooling, junction temperature rise is dominated by the BGA substrate thermal resistance. Designers should provide a thermal pad or copper pour under the BGA land area to keep Tj below 85 C ambient; derate performance if the enclosure exceeds 40 C ambient.
The BGA package requires careful PCB stack-up design: a 4-layer minimum with 0.8 mm or 0.65 mm BGA pitch demands microvia or via-in-pad escape routing. Use Rockchip's reference PCB gerber as a starting point, including the DDR3/LPDDR2 matched-length routing constraints documented in the RK30xx TRM. Failure to match DDR3 routing lengths causes boot failures and intermittent memory errors.
Do not attempt to reuse firmware images from the RK3188 or RK3028 on the RK3168 - the bootloader, device tree, and PMU initialization differ between Rockchip SoCs even within the same RK30xx family. Always use the firmware blob explicitly built for the RK3168 device tree. Substituting memory ICs outside Rockchip's validated memory list causes DDR3 training failures at first boot.
Place the RK3168 BGA, LPDDR2/DDR3 memory, and eMMC on the same PCB layer (typically top) to minimize via count on high-speed memory traces. Route HDMI differential pairs with 100 ohm differential impedance and length-matching within 5 mils. MIPI DSI/CSI lanes require 100 ohm differential with length-matching within 0.25 mm per the RK30xx TRM.
Compliance-Informationen
RoHS compliance per IC Components Limited distributor listing (2026-10-15). REACH, halogen-free, and conflict minerals status not documented in available distributor data - set to unknown. AEC-Q100 not applicable for smartphone/tablet consumer SoC.
