RTL8852BU - Wi-Fi 6 + BT 5.2 USB Combo Chip | Realtek
Teilenummer: RTL8852BU ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8.6 | $8,60 |
| 10 | $8.2 | $82,00 |
| 100 | $7.6 | $760,00 |
| 500 | $7 | $3.500,00 |
| 1.000 | $6.5 | $6.500,00 |
RTL8852BU Übersicht
A Wi-Fi + Bluetooth combo chipset is a single-die (or co-packaged) RF SoC that consolidates the WLAN baseband, MAC, RF transceiver, power management, and a Bluetooth controller into one package. In the connectivity hierarchy it sits below complete wireless modules and above discrete PHY/MAC solutions, serving as the core silicon inside USB dongles, embedded modules (such as the Fn-Link 6252B-UUB and LB-LINK BL-M8852BU1), and portable device mainboards.
Key features include dual-band 2.4 GHz and 5 GHz operation, 2T2R 802.11ax (Wi-Fi 6) support with backward compatibility to 802.11a/b/g/n/ac, integrated Bluetooth 5.2 with Low Energy, and a single USB 2.0 interface carrying both WLAN and BT traffic. This integration removes the need for a separate Bluetooth controller and UART, reducing BOM cost and board area.
Technically, the RTL8852BU implements OFDMA and other Wi-Fi 6 PHY enhancements to improve spectral efficiency in congested 2.4 GHz environments, while the 2x2 architecture sustains throughput above 200 Mbps in real module implementations (per Fn-Link module data). The USB 2.0 interface for both Wi-Fi and BT simplifies host driver support, with open-source Linux drivers (for example the community rtl8852bu driver covering RTL8832BU and RTL8852BU) widely available.
Typical applications include USB Wi-Fi adapters and dongles, smart TVs and set-top boxes, portable and smartphone-adjacent devices, industrial gateways requiring Wi-Fi 6 upgrade paths, and embedded modules for IoT products.
When designing with this chipset, plan for 3.3 V supply operation, external antenna matching (module implementations use external antennas), and USB layout discipline for the shared WLAN/BT interface.
This page synthesizes distributor and module-maker data, family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für RTL8852BU – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
RTL8832BU
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
RTL8852BS
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
RTL8851BU
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
RTL8852BU Technische Daten
| Product Type | Wi-Fi 6 + Bluetooth 5.2 combo chipset |
| WLAN Standard | IEEE 802.11a/b/g/n/ac/ax (Wi-Fi 6) |
| Bluetooth Version | Bluetooth 5.2 with Low Energy |
| Frequency Bands | 2.4 GHz and 5 GHz (dual-band) |
| MIMO Configuration | 2T2R (2x2) |
| Host Interface | USB 2.0 (WLAN and BT) |
| Realized Throughput | >200 Mbps (module implementation, Fn-Link 6252B-UUB) |
| Versorgungsspannung | 3.3 V |
| Gehäuse | LCC-50 SMT (13 x 15 mm module reference) |
| Montageart | Surface Mount |
| Work Mode | AP + STA |
| Antenna Type | External (module implementations) |
| RoHS-Status | Compliant (JLCPCB listing: ROHS) |
| Certification | Module implementations carry CE (e.g., LB-LINK BL-M8852BU1) |
RTL8852BU lcc-50 smt (13 x 15 mm module reference) Pinbelegungsleitfaden
Pinbelegung für RTL8852BU (lcc-50 smt (13 x 15 mm module reference)-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für RTL8852BU.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
RTL8852BU ist geeignet für 6 Anwendungs: USB Wi-Fi 6 Adapters and Dongles, Smart TV and Set-Top Box Connectivity, Embedded Wi-Fi Modules for IoT Gateways, Industrial Wireless Gateways and AP+STA Networks, Smartphones and Portable Devices, Linux Desktops and Embedded Computers.
USB Wi-Fi 6 Adapters and Dongles
The RTL8852BU was designed primarily for USB Wi-Fi adapters: the USB 2.0 host interface carries both WLAN and Bluetooth traffic over a single port, eliminating a separate BT UART. Its dual-band 2T2R 802.11ax radio delivers >200 Mbps realized throughput in commercial dongles, a major upgrade over 802.11n USB adapters while keeping host driver complexity low. The open-source morrownr Linux driver (2025-08-26 release) covers RTL8832BU/RTL8852BU dongles explicitly, easing Linux deployment. Designers should budget USB 2.0 bandwidth (~480 Mbps raw) as the throughput ceiling, which matches well with the chipset's real-world rates rather than the theoretical 11ax PHY rate.
Empfohlen
Smart TV and Set-Top Box Connectivity
Smart TVs, streaming sticks, and set-top boxes embed the RTL8852BU to add dual-band Wi-Fi 6 and Bluetooth 5.2 remote-control/audio connectivity through one USB or embedded USB 2.0 interface. The 5 GHz band avoids congested 2.4 GHz spectrum for 4K video streaming, while 2T2R MIMO sustains stable throughput >200 Mbps for IPTV. Integrated BT 5.2 LE handles voice remotes and peripherals without a second chip, cutting BOM cost and board area in cost-sensitive consumer AV platforms. Module implementations with external antennas (13 x 15 mm footprint) allow antenna placement optimized for enclosure metal environments typical of AV equipment.
Empfohlen
Embedded Wi-Fi Modules for IoT Gateways
Module makers (Fn-Link 6252B-UUB, LB-LINK BL-M8852BU1) wrap the RTL8852BU-VS-CG into certified 13 x 15 x 2.0 mm LCC modules with CE approval, letting IoT gateway and smart-home hub designers skip RF design and regulatory testing. The chipset's AP+STA work mode enables gateway topologies bridging upstream Wi-Fi and downstream sensor networks, and Bluetooth 5.2 LE covers BLE sensor provisioning from the same silicon. The 3.3 V supply and USB 2.0 interface drop directly into typical embedded Linux SoC designs, with community driver support reducing software integration risk for RTOS-to-Linux migrations.
Empfohlen
Industrial Wireless Gateways and AP+STA Networks
Industrial gateways use the RTL8852BU in AP+STA mode to simultaneously backhaul over an upstream Wi-Fi 6 network and serve downstream clients, a pattern common in factory retrofit and machine-connectivity products. Dual-band 2T2R 802.11ax with OFDMA improves spectrum efficiency in RF-noisy industrial floors where legacy 802.11n congestion causes latency spikes. The USB 2.0 host interface isolates wireless connectivity from the industrial controller's main bus, simplifying EMC partitioning, and the open Linux driver stack supports long-lifecycle industrial OS images. External-antenna module form factors tolerate the metal enclosures typical of industrial panels.
Empfohlen
Smartphones and Portable Devices
Realtek and module partners position RTL8852BU-based combo modules specifically for smartphones and portable devices (per Trolink and Fn-Link module documentation). The single-chip Wi-Fi 6 + BT 5.2 integration with a shared USB 2.0 interface minimizes PCB area and power distribution complexity inside compact handheld enclosures. Bluetooth 5.2 Low Energy supports wearables, audio accessories, and beacon use cases, while dual-band 2T2R Wi-Fi sustains hotspot-tethering performance. The 13 x 15 mm module footprint with external antenna connectors accommodates the antenna-isolation requirements of metal-framed portable product designs.
Empfohlen
Linux Desktops and Embedded Computers
For Linux desktops, SBCs, and embedded computers lacking native Wi-Fi 6, USB adapters based on the RTL8852BU are a pragmatic upgrade path thanks to the actively maintained community driver (morrownr/rtl8852bu, with the oe-alliance fork adding set-top patches). Dual-band Wi-Fi 6 delivers >200 Mbps practical throughput where 802.11ac USB chips previously dominated, and Bluetooth 5.2 arrives over the same USB port for keyboards and audio. The 3.3 V, USB 2.0 interface requires no PCIe or SDIO controller resources, making it suitable for older SoCs and retrofit embedded designs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für RTL8852BU – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | RTL8832BU | RTL8852BS | RTL8851BU |
|---|---|---|---|---|
| Package | LCC-50 SMT | LCC-50 family | LCC-50 family | LCC-50 family |
| Brand | Realtek | Realtek | Realtek | Realtek |
| WLAN Standard | 802.11a/b/g/n/ac/ax (Wi-Fi 6) | 802.11a/b/g/n/ac/ax (Wi-Fi 6) | 802.11a/b/g/n/ac/ax (Wi-Fi 6) | 802.11b/g/n/ax |
| Frequency Bands | 2.4 GHz + 5 GHz | 2.4 GHz + 5 GHz | 2.4 GHz + 5 GHz | 2.4 GHz only |
| MIMO Configuration | 2T2R | 2T2R | 2T2R | 1T1R |
| Bluetooth | Bluetooth 5.2 + LE | None (Wi-Fi only) | Bluetooth 5.2 + LE | None (Wi-Fi only) |
| Host Interface | USB 2.0 (WLAN + BT) | USB 2.0 | SDIO | USB 2.0 |
Wichtigste Unterscheidungsmerkmale
- Integrated Bluetooth 5.2 in the same USB silicon (vs. RTL8832BU)
- Dual-band 2T2R Wi-Fi 6 vs single-band competitor sibling (vs. RTL8851BU)
- USB 2.0 host simplicity vs SDIO variant (vs. RTL8852BS)
Designhinweise
The RTL8852BU carries both WLAN and Bluetooth traffic over a single USB 2.0 interface, so USB differential-pair layout discipline directly determines throughput stability. Route D+/D- as a 90-ohm matched pair, keep the pair under 50 mm if possible, and place 3.3 V RF decoupling close to the supply pins per the Fn-Link 6252B-UUB reference design (3.3 V supply, external antenna). Provide a solid ground plane beneath the chipset and keep the crystal/RF section clear of switching-regulator noise.
USB 2.0 high-speed (480 Mbps) signals are the chipset's only host path; a marginal USB eye diagram shows up as Wi-Fi throughput collapse before it shows as link drops. Add common-mode chokes and ESD arrays rated for USB 2.0 on externally accessible dongle designs, and verify eye compliance with a USB 2.0 electrical test. For module-based designs using external antennas, respect the antenna isolation and matching network specified by the module vendor's reference layout (13 x 15 mm module footprint).
Realtek distributes full datasheets under NDA; public part listings (JLCPCB C9900174420, Alldatasheet index) confirm package (LCC-50, ROHS) but not full electrical limits such as operating temperature and TX power. Before design-in, request the NDA datasheet and confirm regulatory certification applies to the chipset only through certified modules (CE-marked 6252B-UUB or BL-M8852BU1) - using bare silicon requires your own FCC/CE RF testing, a cost frequently underestimated.
Compliance-Informationen
RoHS compliance stated in JLCPCB part listing (C9900174420, LCC-50 ROHS). CE certification applies to module implementations (LB-LINK BL-M8852BU1). Other declarations not present in reviewed public data.
