NXP Semiconductors

S912XET256BCAGR - 16-Bit 50MHz 256KB MCU | NXP

Teilenummer: S912XET256BCAGR ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
144-LQFP, 20 x 20 mm Package 50 MHz Speed 256 KB Memory
Ab $12.1089 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-21
Mengenpreise
Menge Stückpreis Gesamt
1 $12.1089 $12,11
10 $12.1089 $121,09
100 $12.1089 $1.210,89
500 $12.1089 $6.054,45
1.000 $12.1089 $12.108,90
ℹ️ Alle Preise sind in USD

S912XET256BCAGR Übersicht

The NXP Semiconductors S912XET256BCAGR is an automotive-qualified 16-bit HCS12X microcontroller with a 50 MHz S12X core, 256 KB flash memory, and a 144-LQFP 20 x 20 mm package. It is designed for embedded automotive and industrial control systems requiring deterministic real-time performance, integrated flash, and a high pin count for external peripherals and communication interfaces.

A microcontroller is a semiconductor device that integrates a processor core, program memory, data memory, peripherals, and interface circuitry into one component. The S12X family belongs to the HCS12 16-bit embedded-control hierarchy, combining higher processing performance than traditional 8-bit controllers with dedicated resources for automotive networking, timing, analog, communication, and safety-oriented control functions.

The verified source data identifies an S12X core, 50 MHz operating frequency, 256 KB flash organized as 256K x 8, and a 144-pin QFP package. Its automotive-qualified temperature range is -40°C to +85°C. These specifications make the device appropriate for body electronics, powertrain-adjacent controls, gateways, instrumentation, actuator management, and other systems requiring deterministic embedded processing.

The 50 MHz core provides the computational headroom needed for protocol handling, control-loop execution, diagnostics, and supervisory tasks. The 256 KB flash capacity allows larger embedded programs than small 8-bit controllers while retaining a conventional embedded-control software model. The 144-pin package provides access to a broad peripheral complement and allows simultaneous connection of sensors, actuators, communication transceivers, and power-management circuitry.

Typical applications include automotive body-control modules, transmission or powertrain interface controllers, motor-control supervisory circuits, instrument-cluster electronics, gateway modules, diagnostic equipment, and industrial automation controllers. In these systems, the MCU can execute periodic control algorithms while handling CAN-class network traffic, diagnostic services, input capture, timers, and external sensor signals.

Designers should preserve the exact 144-LQFP footprint, pin assignments, electrical limits, clock configuration, power requirements, and automotive qualification constraints from the manufacturer documentation. Decoupling, clock stability, signal integrity, thermal management, and production-programming provisions should be validated against the applicable NXP datasheet and reference design before layout release.

This product page consolidates verified distributor specifications, sourcing information, application guidance, and design notes for engineers evaluating the S912XET256BCAGR. It does not substitute for the complete NXP datasheet, errata, reference manual, or device-specific qualification documentation.

Drop-in-Alternativen für S912XET256BCAGR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit S912XET256BCAGR (gleiche Bauform und Footprint) – abweichend in Package, Pin Count, Mounting Type, Core Architecture, Debug Interface.

NXP Semiconductors
Pin Count: 80
Mounting Type: Surface Mount (Gull Wing)
Core Architecture: HCS12X (S12X CPU + XGATE co-processor)
Vergleichen mit S912XET256BCAGR →
NXP Semiconductors
Package: 144-pin LQFP, 20 x 20 mm
Vergleichen mit S912XET256BCAGR →
NXP Semiconductors
Package: LQFP-112
Pin Count: 112
Debug Interface: BDM (Background Debug Mode)
Vergleichen mit S912XET256BCAGR →
NXP Semiconductors
Package: 112-LQFP (20 x 20 mm)
Core Architecture: 16-bit HCS12X CPU with XGATE co-processor
Vergleichen mit S912XET256BCAGR →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

S912XDT256F1VAA

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20 mm)
HCS12X (S12X CPU + XGATE co-processor) · 16-bit · 80 MHz · 256 KB (256K x 8) · 14 KB · 4 KB · 2.5 V to 5.5 V · -40 C to +105 C (Automotive/Industrial)

✓ Auf Lager

$13.6 / Stück

Datenblatt ansehen →

S912XEG384J3VAL

✅ Drop-In
📦 144-LQFP (20x20 mm)
Same NXP S912-family and 144-LQFP class are reported, but flash size and detailed electrical compatibility differ or are unverified

📋 Referenzalternative (nicht im Katalog)

S912XES384J2CAL

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20 mm)
HCS12X (S12XE-series) · HCS12X (enhanced 16-bit) · 50 MHz · 384 KB · 16 KB · 4 KB · LQFP-112 · 112

✓ Auf Lager

$5.15 / Stück

Datenblatt ansehen →

S912XEG384AVAGR

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20 mm)
16-bit microcontroller · S12X · 50 MHz · 50 MHz · 384 KB (384K x 8) · -40°C to +105°C · 1.8 V, 2.8 V, and 5 V

✓ Auf Lager

Preis auf Anfrage

Datenblatt ansehen →

S912XES384J3VAL

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (20x20 mm)
NXP Semiconductors (formerly Freescale) · HCS12X (S12XE family) · 16-bit HCS12X CPU with XGATE co-processor · 50 MHz · 384 KB Flash (384K x 8) · 112-LQFP (20 x 20 mm) · GULL WING

✓ Auf Lager

$14.85 / Stück

Datenblatt ansehen →

S912XET256BCAGR Grenzwerte & elektrische Eigenschaften

Product Type 16-bit HCS12X microcontroller
Processor Core S12X
Maximum CPU Frequency 50 MHz
Flash Memory 256 KB
Flash Organization 256K x 8
Gehäuse 144-LQFP, 20 x 20 mm
Pin-Anzahl 144 pins
Montageart Surface mount
Betriebstemperatur -40°C to +85°C
Qualification Automotive qualified
Product Category Microcontrollers - MCU
Manufacturer NXP Semiconductors
Lebenszyklusstatus Active
Reference Price $12.1089 per unit as of 2026-10-21
Reported Inventory 4,800 pieces from Heisener as of 2026-10-21

S912XET256BCAGR 144-lqfp, 20 x 20 mm Pinbelegungsleitfaden

Pinbelegung für S912XET256BCAGR (144-lqfp, 20 x 20 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für S912XET256BCAGR im 144-lqfp, 20 x 20 mm-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für S912XET256BCAGR.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

S912XET256BCAGR ist geeignet für 6 Anwendungs: Automotive Body-Control Modules, Vehicle Network Gateways, Motor and Actuator Supervisory Control, Instrumentation and Diagnostic Electronics, Industrial Automation Controllers, Embedded IoT and Edge Control.

🚗

Automotive Body-Control Modules

The S912XET256BCAGR is a strong candidate for body-control modules because it combines a 16-bit S12X core, 50 MHz performance, 256 KB flash, automotive qualification, and a 144-pin package. The 144-pin LQFP provides ample connection density for switch inputs, sensor interfaces, driver outputs, communication transceivers, and diagnostic circuitry. In a distributed vehicle architecture, the MCU can execute periodic control tasks while coordinating lighting, locks, power-window logic, remote functions, and network diagnostics. Its -40°C to +85°C specified range supports vehicle environments, while the larger package increases PCB routing and assembly complexity compared with a low-pin-count controller.

🌐

Vehicle Network Gateways

Use the S912XET256BCAGR in a vehicle gateway or interface controller when several vehicle networks and discrete signals must be coordinated. The 50 MHz S12X core provides deterministic execution for protocol servicing, message filtering, diagnostics, and supervisory logic, while 256 KB flash supports firmware and configuration data. The 144-LQFP package can expose multiple communication, interrupt, timer, and general-purpose I/O resources on one controller. Compared with a small communication-only MCU, this device offers more compute and pin density, but the design must carefully budget bus levels, termination, protection, clocking, and software isolation.

🏭

Motor and Actuator Supervisory Control

The S912XET256BCAGR can serve as the supervisory controller for an automotive actuator or motor-control subsystem. Its 16-bit architecture and 50 MHz frequency are suitable for coordinating pulse timing, sensor acquisition, control-state logic, fault detection, and communication with a dedicated power-stage driver. The 256 KB flash capacity allows more elaborate control and diagnostic firmware than a minimal 8-bit controller, and the 144-pin package simplifies access to external drivers, sensors, and protection components. The controller should not replace a dedicated power device; it manages control sequencing and protection coordination while the actuator driver handles the high-current switching.

📺

Instrumentation and Diagnostic Electronics

The S912XET256BCAGR is suitable for instrumentation modules that combine sensor conditioning, signal processing, display or vehicle-network reporting, and self-diagnostics. Its 50 MHz core supports faster control-loop updates and protocol handling than many small general-purpose MCUs, while 256 KB flash provides room for calibration tables, diagnostics, and application firmware. The high-pin-count package makes it practical to connect multiple input channels, communication transceivers, and output signals. Engineers should verify ADC, timer, serial-interface, and electrical specifications in the full NXP documentation before assigning any specific measurement chain.

🏭

Industrial Automation Controllers

Although the verified information identifies S912XET256BCAGR as automotive qualified, its 16-bit S12X core, 50 MHz frequency, and 256 KB flash also fit industrial automation controllers that require deterministic embedded control. It can be evaluated for machinery interfaces, distributed I/O modules, pump or valve controllers, and test fixtures. The 144-LQFP package offers more external connections than a minimal controller, supporting sensors, relays, communication transceivers, and status indicators. Industrial adoption still requires checking the full electrical limits, environmental ratings, functional-safety expectations, and long-term supply conditions.

🧩

Embedded IoT and Edge Control

The S912XET256BCAGR can be evaluated for connected industrial edge-control nodes that require local real-time decisions rather than only network connectivity. Its 50 MHz S12X core can handle sensor polling, state-machine logic, local filtering, actuator commands, and communication tasks, while 256 KB flash supports more capable firmware than a very small microcontroller. The 144-pin package offers flexibility for digital interfaces and external transceivers. A practical design must define the power architecture, communications stack, watchdog behavior, secure update strategy, and environmental requirements; the verified snippets do not establish a specific wireless interface.

What is the S912XET256BCAGR?
The S912XET256BCAGR is an NXP Semiconductors automotive-qualified 16-bit HCS12X microcontroller operating at 50 MHz. According to the verified Mouser and DigiKey product information, it provides 256 KB of flash memory and is packaged in a 144-LQFP 20 x 20 mm surface-mount package. Its -40°C to +85°C temperature range suits embedded vehicle electronics and industrial control equipment requiring deterministic processing and extensive external connectivity.
What are the key specifications of S912XET256BCAGR that engineers should know?
The S912XET256BCAGR combines a 16-bit S12X core, 50 MHz maximum frequency, 256 KB flash organized as 256K x 8, and 144 LQFP pins in a 20 x 20 mm package. Verified distributor data also identifies it as automotive qualified over -40°C to +85°C. According to DigiKey and Mouser, these are the core procurement and architecture checks; supply voltage, RAM, peripheral details, and electrical limits require the complete NXP documentation.
Where can I download the S912XET256BCAGR datasheet PDF?
The S912XET256BCAGR datasheet should be obtained from NXP or a linked Octopart datasheet record because those sources provide the authoritative device documentation. The verified NXP page is https://www.nxp.com/part/S912XET256BCAG, while Octopart provides a separate datasheet landing page at https://octopart.com/datasheet/part/nxp-semiconductors/S912XET256BCAGR. Check the document revision and errata before releasing a design.
Where can I buy S912XET256BCAGR online and what is its price?
S912XET256BCAGR is listed by Mouser, DigiKey, and other electronic distributors, while Heisener reports a reference price of $12.1089 per unit as of 2026-10-21. Heisener also reported 4,800 pieces in stock on that date. Price and availability can change without notice, so request a current quotation before placing a production order. The verified distributor links are included in this product record.
What is the lead time for S912XET256BCAGR?
The verified Heisener listing reports the part as available with 4,800 pieces, but it also states that the lead time is to be confirmed and gives an estimated delivery window of August 13 through August 18. Because those dates are listing-specific and the current date is 2026-10-21, engineers should confirm the current lead time directly with the supplier before scheduling production.
Is S912XET256BCAGR in stock?
The verified Heisener result reports 4,800 pieces of S912XET256BCAGR in stock, while DigiKey describes the part as available to buy and ship. Stock is distributor-specific and may change quickly, so the safest procurement decision is to confirm quantity, lot traceability, and delivery timing with the selected authorized distributor.
How does S912XET256BCAGR compare with S912XDT256F1VAA?
The verified data confirms that S912XDT256F1VAA is an NXP S912-family part and identifies the target as a 50 MHz, 256 KB, 144-LQFP automotive-qualified microcontroller. The supplied evidence does not verify pin-by-pin compatibility, voltage limits, RAM, qualification status, or all electrical parameters for S912XDT256F1VAA. Therefore, treat it as a potential design review candidate, not a confirmed drop-in replacement, until the NXP datasheets confirm every package, pin, and functional requirement.
What is the best drop-in replacement for S912XET256BCAGR?
No confirmed drop-in replacement is established by the supplied cross-reference data. The search identifies S912XDT256F1VAA as a related S912-family candidate, but it does not provide enough verified information to establish same-package pin compatibility or parameter equivalence. A true drop-in substitute must match the 144-LQFP footprint, pin functions, supply requirements, clock behavior, memory configuration, peripheral mapping, and automotive qualification.
Can S912XET256BCAGR replace another 144-LQFP automotive MCU?
Only after a complete electrical and software compatibility review. The verified data confirms a 144-LQFP package and an S12X 50 MHz architecture, but matching package dimensions alone does not prove pin compatibility. Compare the complete NXP pinout, alternate-function mapping, memory map, reset behavior, clocking, timing, voltage range, temperature rating, qualification, and software driver requirements before substitution.
When should I choose S912XET256BCAGR instead of a lower-pin-count MCU?
Choose S912XET256BCAGR when a design needs a 16-bit S12X core, 50 MHz performance, 256 KB flash, automotive qualification, and a high-pin-count 144-LQFP interface. Its 144 pins provide more external connectivity than lower-pin-count devices, making it useful for modules that connect multiple sensors, actuators, communications, and control signals. The tradeoff is higher board complexity, package size, and system-design responsibility compared with a smaller microcontroller.
Is S912XET256BCAGR suitable for automotive control and motor-control applications?
The verified product information identifies S912XET256BCAGR as automotive qualified and rated from -40°C to +85°C, which makes it a candidate for vehicle electronic modules and embedded supervisory control. Its 50 MHz S12X core and 256 KB flash provide resources for real-time control, diagnostics, and communication tasks. Final suitability still depends on the complete datasheet electrical limits, safety requirements, transient immunity, and validation evidence.
What type of package does S912XET256BCAGR use?
S912XET256BCAGR uses a 144-LQFP surface-mount package measuring 20 x 20 mm, according to the verified DigiKey and Mouser listings. The package provides 144 external connections and requires a PCB land pattern, solder-mask design, and assembly process compatible with fine-pitch leaded LQFP packaging. The selected XAIPART package illustration key is lqfp-144.
What is the operating temperature range of S912XET256BCAGR?
The verified Mouser and related distributor snippets specify an operating temperature range of -40°C to +85°C for S912XET256BCAGR. This range is important for automotive and industrial designs because it indicates the stated environmental operating envelope. Designers should still verify thermal design, power dissipation, and qualification details in the official NXP documentation.
Does S912XET256BCAGR support low-power embedded control designs?
The verified snippets do not provide a complete power-consumption table or detailed low-power-mode specification for S912XET256BCAGR. Its 16-bit S12X core and automotive-control positioning make it suitable for many embedded applications, but power mode, sleep current, wake-up behavior, and clock-tree requirements must be taken from the official datasheet and reference manual. Do not assume a low-power specification from the processor frequency alone.
How should an engineer validate S912XET256BCAGR before production?
An engineer should validate the official NXP datasheet, pinout, electrical characteristics, clock requirements, memory map, peripherals, programming procedure, and automotive qualification documentation before production. The verified distributor data confirms the core identity, 50 MHz S12X performance, 256 KB flash, 144-LQFP package, and -40°C to +85°C range, but it does not provide every electrical or programming detail. Prototype testing, boundary-condition review, and firmware validation remain necessary.
Where can I find the S912XET256BCAGR pinout?
The S912XET256BCAGR pinout must be taken from the official NXP datasheet or device documentation linked from the verified NXP product page at https://www.nxp.com/part/S912XET256BCAG. The supplied search data confirms a 144-LQFP package but does not provide individual pin names, alternate functions, or exposed thermal-pad details, so a complete 144-pin pinout cannot be reproduced reliably from the provided evidence.
What is S912XET256BCAGR used for in embedded systems?
S912XET256BCAGR is used for embedded control systems that need a 16-bit processor, 50 MHz performance, 256 KB flash, automotive qualification, and 144 external package pins. Typical uses include body-control modules, vehicle gateways, actuator and motor supervisory controllers, diagnostic interfaces, instrument electronics, and industrial automation controllers. The exact peripheral capabilities and safety requirements must be confirmed in the full NXP documentation.
What is the difference between S912XET256BCAGR and S912XET256BCAG?
The verified NXP result identifies S912XET256BCAG, while the distributor listings identify the target orderable MPN as S912XET256BCAGR and describe it as automotive qualified. The provided data does not define the exact suffix difference or confirm whether the two MPNs differ only in packaging, qualification, or ordering information. Engineers should compare the complete manufacturer ordering table and datasheet before treating the parts as interchangeable.

Technische Referenzdaten für S912XET256BCAGR – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose S912XET256BCAGR when the design requires the specifically verified combination of a 16-bit S12X core, 50 MHz operation, 256 KB flash, automotive qualification, -40°C to +85°C operation, and a 144-LQFP package. It is a sensible candidate for vehicle body modules, network interfaces, diagnostics, actuator supervisory control, and instrumentation where deterministic processing and substantial I/O are important. Consider S912XDT256F1VAA only after comparing the complete datasheet and validating pin-level compatibility. Consider a 384-device S912-family candidate when its additional flash or other verified resources justify a redesign review. The target's tradeoff is package size, routing density, and the engineering responsibility required for automotive qualification; it should not be selected solely because another part has the same LQFP outline.

Vergleich mit Alternativen

Parameter Dieses Produkt S912XDT256F1VAA S912XEG384J3VAL S912XES384J2CAL S912XEG384AVAGR S912XES384J3VAL
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) 144-LQFP (20x20 mm)
CPU Core 16-bit S12X S12-family controller; exact core detail unavailable S12-family controller; exact core detail unavailable S12-family controller; exact core detail unavailable S12-family controller; exact core detail unavailable S12-family controller; exact core detail unavailable
Flash Memory 256 KB 256 KB family indication; verified target comparison unavailable 384 KB family indication; verified target comparison unavailable 384 KB family indication; verified target comparison unavailable 384 KB family indication; verified target comparison unavailable 384 KB family indication; verified target comparison unavailable

Wichtigste Unterscheidungsmerkmale

  • Confirmed 50 MHz 16-bit S12X performance (vs. S912XDT256F1VAA)
  • Confirmed 256 KB flash capacity (vs. S912XEG384J3VAL)
  • Automotive-qualified operating envelope (vs. S912XDT256F1VAA)
  • High-pin-count integration (vs. MC9S12DJ256MFUE)

Designhinweise

Do not select the supply rails or decoupling values until the complete NXP electrical-characteristics table is available. The verified snippets confirm a 50 MHz automotive-qualified S12X MCU but do not state supply voltage, absolute maximum ratings, or operating current. In an implementation, place required bulk and high-frequency decoupling capacitors at the device power pins, keep return paths short, and verify startup, reset, and power-sequencing behavior against the datasheet.

Use a PCB land pattern specifically qualified for the 144-LQFP 20 x 20 mm package and validate it against the current NXP package drawing. Keep clock, reset, and sensitive analog or communication routes away from noisy switching-node routes, and provide adequate via access around the device. The high pin count increases routing congestion, so complete escape routing and fanout checks before placing the part on a multilayer board.

Thermal design must begin with the actual processor current, supply voltage, ambient temperature, and PCB copper area. The verified sources do not provide power dissipation or junction-temperature data, so no numerical thermal claim is made here. Measure or calculate the worst-case operating condition, maintain the manufacturer’s recommended layout and exposed-land requirements where applicable, and validate temperature rise in the assembled system rather than relying on the 50 MHz clock rating alone.

A matching package name does not prove a drop-in replacement. Before substituting any S912-family candidate, compare the complete pinout, alternate functions, memory map, clock and reset behavior, supply levels, timers, communication peripherals, programming model, qualification, and firmware support. S912XDT256F1VAA and the 384-device candidates in the comparison are review leads, not automatically qualified replacements.

Treat the clock input, reset circuitry, programming signals, and communication interfaces as separate high-integrity nets during layout. Follow the official reference schematic and recommended external-component values once retrieved from NXP documentation. Keep test points accessible, provide programming and debug access, and verify that the chosen LQFP assembly process supports the package pitch, solder paste pattern, reflow profile, and inspection requirements.

Compliance-Informationen

RoHS
Unknown
REACH
Unknown
AEC-Q100
Qualified
Bleifrei
Unknown
Halogenfrei
Unknown
Konfliktmineralien
Unknown

Verified distributor and manufacturer search data identifies the target as automotive qualified, but the supplied evidence does not explicitly state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status.

Daten verifiziert am: 2026-10-21 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

Ähnliche Suchanfragen

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Verwandte Bauteile & Begriffe

NXP Semiconductors S912XET256BCAGR S912XET256BCAG S912X core HCS12X 16-bit microcontroller embedded microcontroller automotive electronics 50 MHz 256 KB flash 144-LQFP LQFP surface-mount package automotive qualified -40°C to +85°C embedded control vehicle body control vehicle network gateway motor supervisory control industrial automation embedded IoT CAN-class communication real-time control microcontroller programming RoHS REACH AEC-Q100
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