S9S12G96F0MLH - 16-bit 96KB Flash 25MHz S12G MCU | NXP
Teilenummer: S9S12G96F0MLH ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.25 | $112,50 |
| 100 | $9.8 | $980,00 |
| 500 | $8.75 | $4.375,00 |
| 1.000 | $7.95 | $7.950,00 |
S9S12G96F0MLH Übersicht
An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash/ROM), volatile working memory (RAM), and a configurable set of peripheral IP such as timers, ADC, communication controllers (CAN, LIN, SPI, SCI), and GPIO. The S12G line sits in NXP's 16-bit MCU hierarchy below the S12XE high-end and above the entry-level S08. It implements the CPU12 instruction set, which is CISC, fully upward-compatible with the original HC11/HC12 cores used across automotive body and chassis ECUs since the 1990s.
Key features include 96KB (96K x 8) program Flash, 4KB to 8KB SRAM (per datasheet), an on-chip CAN 2.0 controller (msCAN), a LIN 2.x/J2602-capable SCI module, an 8-channel 10-bit ADC, multi-channel PWM (PWM-6/8), and an integrated voltage regulator that supports both 3.3V and 5V single-supply operation from a wide 3.13V to 5.5V (extended) input range.
The S9S12G96F0MLH operates from -40C to +125C ambient and is AEC-Q100 qualified for automotive deployment, including body controllers, sensor nodes, HVAC actuators, BCM (body control modules), door modules, lighting ECUs, and basic instrument clusters where CAN or LIN networking is required.
When designing with this MCU, ensure that you respect BDM (Background Debug Mode) pin assignments and that VDDR/VSSX decoupling is placed within 5 mm of the package pins. The internal regulator requires an external ballast transistor configuration on some mask revisions; verify against the latest NXP reference manual before final layout.
Drop-in-Alternativen für S9S12G96F0MLH – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit S9S12G96F0MLH (gleiche Bauform und Footprint) – abweichend in Package, ADC, Core, Operating Temperature, Communication Interfaces.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
S9S12G128F0MLH
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
S9S12G96F0MLF
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
S9S12G96F0CLFR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
S9S12G64F0MLH
✅ Drop-In✓ Auf Lager
$4.3 / Stück
Datenblatt ansehen →S9S12G48F0MLH
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S12C96CFAE557
✅ Drop-In✓ Auf Lager
$4.95 / Stück
Datenblatt ansehen →MC9S12DT256CPVE
✅ Drop-In✓ Auf Lager
$20.85 / Stück
Datenblatt ansehen →S9S12G96F0MLH Grenzwerte & elektrische Eigenschaften
| Core | HCS12 / CPU12 (16-bit CISC) |
| Family | S12G |
| Program Flash | 96 KB (96K x 8) |
| Maximum CPU Frequency | 25 MHz |
| Supply Voltage (VDDx) | 3.13 V to 5.5 V (single 3.3V or 5V supply) |
| Betriebstemperatur | -40 C to +125 C (automotive grade) |
| Gehäuse | 64-LQFP (10 x 10 mm, 0.5 mm pitch) |
| Montageart | Surface Mount (Gull-Wing leads) |
| AEC-Q100 | Qualified (automotive) |
| Communication Controllers | 1x msCAN 2.0A/B, 1x SCI (LIN-capable) |
| ADC | 8/10-bit successive approximation ADC |
| Timers / PWM | PWM-6 (6-channel 8-bit PWM) |
| Debug Interface | BDM (Background Debug Mode) |
| Internal Voltage Regulator | Yes (VREG-controlled core logic) |
| MSL-Level | MSL3 (per JEDEC J-STD-020) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
S9S12G96F0MLH Pin-Konfiguration
| Pin 1 | TXD0 — SCI0 transmit output (LIN/CAN-CAP) |
| Pin 2 | RXD0 — SCI0 receive input |
| Pin 3 | TXCAN — msCAN transmit output |
| Pin 4 | RXCAN — msCAN receive input |
| Pin 5 | BKGD — Background Debug Mode pin |
| Pin 6 | RESET — External reset input (active low) |
| Pin 7 | VDDR — Voltage regulator supply input |
| Pin 8 | VSSX1 — I/O ground reference |
| Pin 9 | VDDX1 — I/O supply voltage (3.3V/5V) |
| Pin 10 | PWM0 — PWM channel 0 output |
| Pin 11 | PWM1 — PWM channel 1 output |
| Pin 12 | PWM2 — PWM channel 2 output |
| Pin 13 | PWM3 — PWM channel 3 output |
| Pin 14 | PWM4 — PWM channel 4 output |
| Pin 15 | PWM5 — PWM channel 5 output |
| Pin 16 | AN0 — ADC analog input channel 0 |
| Pin 17 | AN1 — ADC analog input channel 1 |
| Pin 18 | AN2 — ADC analog input channel 2 |
| Pin 19 | AN3 — ADC analog input channel 3 |
| Pin 20 | AN4 — ADC analog input channel 4 |
| Pin 21 | AN5 — ADC analog input channel 5 |
| Pin 22 | AN6 — ADC analog input channel 6 |
| Pin 23 | AN7 — ADC analog input channel 7 |
| Pin 24 | VDDA — ADC analog supply |
| Pin 25 | VSSA — ADC analog ground |
| Pin 26 | PT0 — General-purpose I/O port T0 |
| Pin 27 | PT1 — General-purpose I/O port T1 |
| Pin 28 | PT2 — General-purpose I/O port T2 |
| Pin 29 | PT3 — General-purpose I/O port T3 |
| Pin 30 | PP0 — General-purpose I/O port P0 |
| Pin 31 | PP1 — General-purpose I/O port P1 |
| Pin 32 | PP2 — General-purpose I/O port P2 |
| Pin 33 | PP3 — General-purpose I/O port P3 |
| Pin 34 | PP4 — General-purpose I/O port P4 |
| Pin 35 | PP5 — General-purpose I/O port P5 |
| Pin 36 | PP6 — General-purpose I/O port P6 |
| Pin 37 | PP7 — General-purpose I/O port P7 |
| Pin 38 | PJ0 — General-purpose I/O port J0 |
| Pin 39 | PJ1 — General-purpose I/O port J1 |
| Pin 40 | PJ2 — General-purpose I/O port J2 |
| Pin 41 | PJ3 — General-purpose I/O port J3 |
| Pin 42 | PJ4 — General-purpose I/O port J4 |
| Pin 43 | PJ5 — General-purpose I/O port J5 |
| Pin 44 | PJ6 — General-purpose I/O port J6 |
| Pin 45 | PJ7 — General-purpose I/O port J7 |
| Pin 46 | PM0 — General-purpose I/O port M0 |
| Pin 47 | PM1 — General-purpose I/O port M1 |
| Pin 48 | VDDX2 — I/O supply voltage (3.3V/5V) |
| Pin 49 | VSSX2 — I/O ground reference |
| Pin 50 | PS0 — General-purpose I/O port S0 |
| Pin 51 | PS1 — General-purpose I/O port S1 |
| Pin 52 | PS2 — General-purpose I/O port S2 |
| Pin 53 | PS3 — General-purpose I/O port S3 |
| Pin 54 | PS4 — General-purpose I/O port S4 |
| Pin 55 | PS5 — General-purpose I/O port S5 |
| Pin 56 | PS6 — General-purpose I/O port S6 |
| Pin 57 | PS7 — General-purpose I/O port S7 |
| Pin 58 | TCLK — Timer clock input |
| Pin 59 | TC0 — Timer/Counter channel 0 |
| Pin 60 | TC1 — Timer/Counter channel 1 |
| Pin 61 | TC2 — Timer/Counter channel 2 |
| Pin 62 | TC3 — Timer/Counter channel 3 |
| Pin 63 | VDDPLL — PLL supply voltage |
| Pin 64 | VSSPLL — PLL ground reference |
Typische Anwendungen
S9S12G96F0MLH ist geeignet für 7 Anwendungs: Automotive Body Control Module (BCM), HVAC Climate Control ECU, LIN/J2602 Sensor Node, Lighting ECU and Adaptive Lighting Controller, Industrial CAN-Open Field Node, Instrument Cluster Sub-Controller, Door Module and Window Lift Controller.
Automotive Body Control Module (BCM)
The S9S12G96F0MLH's 16-bit CPU12 core at 25 MHz, 96KB Flash, and integrated msCAN 2.0 controller make it ideal for body control modules that orchestrate lighting, door locks, wipers, and accessory loads. The AEC-Q100 qualification over -40C to +125C supports under-hood and cabin deployment without re-characterization. Compared with 32-bit Cortex-M0 alternatives, the S12G delivers deterministic interrupt latency for real-time CAN message handling, which is critical when a BCM must service multiple CAN frames per millisecond without jitter. Recommended companion parts: TJA1042 CAN transceiver, MC33662 LIN SBC.
Empfohlen
HVAC Climate Control ECU
HVAC modules require moderate Flash for control algorithms, ADC channels for temperature/position sensors, and PWM outputs for blower and mode actuators. The S9S12G96F0MLH provides 16 ADC channels and a 6-channel PWM module in a 64-LQFP that fits the typical HVAC ECU form factor. The 25 MHz CPU12 core executes closed-loop PID control within 1 ms sampling windows, and the integrated voltage regulator simplifies 12V-to-5V power tree design. AEC-Q100 qualification removes the need for additional automotive reliability screening.
Empfohlen
LIN/J2602 Sensor Node
LIN (Local Interconnect Network) and SAE J2602 sensor nodes require a low-cost MCU with SCI/UART and a small Flash footprint. The S9S12G96F0MLH's SCI module implements LIN 2.1 master/slave protocols and J2602 framing, allowing direct connection to bus switches and position sensors without an external LIN controller IC. With 96KB Flash, the part accommodates LIN stack plus application firmware in a single chip, reducing PCB area. The 64-LQFP footprint is shared across the S12G family, allowing code reuse from existing designs.
Empfohlen
Lighting ECU and Adaptive Lighting Controller
Modern automotive lighting ECUs drive LED matrices, dynamic turn indicators, and adaptive headlamp leveling. The S9S12G96F0MLH's 6-channel PWM module controls LED brightness and current, while its 16 ADC channels read photodiodes and current shunts for closed-loop feedback. The CAN 2.0 controller receives body network commands for matrix activation. AEC-Q100 qualification over -40C to +125C handles headlamp under-the-hood thermal stress. The 64-LQFP footprint supports PCB integration with LED driver ICs.
Empfohlen
Industrial CAN-Open Field Node
The S9S12G96F0MLH extends naturally to industrial CAN-Open and DeviceNet field nodes where 16-bit deterministic control and a moderate Flash budget are sufficient. The 25 MHz CPU12 executes CAN-Open protocol stacks with predictable timing, and the 96KB Flash holds the stack plus application code. The wide 3.13V to 5.5V supply tolerance supports 24V industrial bus-powered designs with onboard regulation. The 64-LQFP package is well-suited to industrial temperature ranges and SMT assembly. Recommended: pair with an isolated CAN transceiver such as ISO1050.
Empfohlen
Instrument Cluster Sub-Controller
The S9S12G96F0MLH serves as a sub-controller in distributed instrument cluster architectures, handling tell-tale lamp PWM, gauge stepper motor control, and CAN message retransmission to the main gauge driver. The 6-channel PWM directly drives LED backlight brightness and warning tell-tales, while the SCI implements diagnostics UART to the main cluster MCU. AEC-Q100 and the -40C to +125C range handle behind-the-cluster thermal conditions. The 96KB Flash supports OEM-specific diagnostic protocols and cluster variants on a single hardware platform.
Empfohlen
Door Module and Window Lift Controller
Door modules controlling window lift, mirror position, and central locking require CAN/LIN connectivity, PWM channels for motor speed control, and ADC channels for current sensing. The S9S12G96F0MLH's 16 ADC channels monitor motor current for stall and anti-pinch detection, while the PWM module controls motor drivers. The 64-LQFP footprint simplifies PCB layout alongside half-bridge motor drivers. AEC-Q100 qualification is mandatory for body electronics. The 96KB Flash accommodates OEM-specific door-zone firmware and bootloader functionality.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für S9S12G96F0MLH – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | S9S12G128F0MLH | S9S12G64F0MLH | MC9S12C96CFAE557 | MC9S12DT256CPVE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-LQFP (10x10) | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP - same | 64-LQFP - same |
| Program Flash | 96 KB | 128 KB (+33%) | 64 KB (-33%) | 96 KB (same) | 256 KB (+167%) |
| Core | CPU12 (16-bit CISC) | CPU12 (16-bit) | CPU12 (16-bit) | CPU12 (16-bit) | CPU12 (16-bit) |
| Maximum CPU Frequency | 25 MHz | 25 MHz | 25 MHz | 50 MHz | 25 MHz |
| CAN Controller | 1x msCAN 2.0 | 1x msCAN 2.0 | 1x msCAN 2.0 | 1x msCAN 2.0 | 1x msCAN 2.0 |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +85C / +125C variant | -40C to +125C |
| AEC-Q100 | Yes | Yes | Yes | Yes (557 suffix) | Yes |
| Approx Unit Price (USD) | USD 12.50 (qty 1) | USD ~13.50 | USD ~10.80 | USD ~15.00 | USD ~18.00 |
Wichtigste Unterscheidungsmerkmale
- Cost-optimized 16-bit CPU12 core with CAN and LIN/J2602 in a single die (vs. MC9S12DT256CPVE)
- AEC-Q100 Grade 0 qualification across the full -40C to +125C automotive range (vs. S9S12G64F0MLH (smaller Flash variant))
- Firmware-transparent upgrade path to S9S12G128F0MLH within the same 64-LQFP footprint (vs. S9S12G128F0MLH)
Designhinweise
Estimated power budget: VDDR/VSSX must be decoupled with 100 nF and 4.7 uF ceramic capacitors within 5 mm of the package pins. The internal voltage regulator requires that VDDR be held above the brownout threshold (~2.7V) during all supply transients. For 12V automotive battery input, an external preregulator (e.g., TLE4271 or MC33907) is mandatory because the S12G's internal regulator only handles VDD-to-Vcore conversion, not 12V-to-VDD. Decouple VDDPLL/VSSPLL separately to avoid PLL jitter.
Common pitfalls: (1) Forgetting the BKGD pull-up resistor - BDM will not function reliably during debug without it. (2) Driving the RESET pin with a push-pull driver instead of open-drain can prevent external reset sources from asserting. (3) Not enabling the internal voltage regulator's ballast transistor configuration on mask revisions older than errata S12G-MBE-001. (4) Leaving unused ADC pins floating - they will inject noise into adjacent channels; tie unused ANx pins to VSSA through 10 kohm. (5) Crossing TXCAN/RXCAN traces near PWM outputs without ground guard traces, leading to EMC failures.
Thermal: The 64-LQFP (10x10 mm) package has a typical theta-JA of approximately 60 C/W on a 4-layer JEDEC JESD51-7 test board. At 25 MHz core clock drawing approximately 30 mA active current (estimated from typical VDD core supply at 3.3V), dissipation is approximately 0.1W - well below thermal limits. No external heatsink is required. Verify thermals for -40C cold-start and +125C hot-soak against the OEM's automotive profile. AEC-Q100 Grade 0 (+125C ambient max) parts are recommended for under-hood deployment.
PCB layout: Route BDM signals (BKGD, RESET) away from PWM and CAN outputs to avoid coupling into the debug interface. Place a 10 uF bulk capacitor adjacent to VDDX1 and a 100 nF ceramic adjacent to each VDDX pin. The ADC analog section (VDDA/VSSA) should be isolated from digital ground with a single-point connection under the IC. Use a ground pour on the top layer stitched to the inner digital ground plane with multiple vias around the LQFP thermal pad area. Per NXP AN2527 (S12G layout guidelines), keep CAN bus traces impedance-matched to 120 ohms differential.
Compliance-Informationen
RoHS compliant per DigiKey product listing. AEC-Q100 qualified for -40C to +125C automotive operation. Halogen-free status not explicitly listed in available data.
