SC900844JVKR2 - 20-Rail PMIC for Ultra-Mobile | NXP
Teilenummer: SC900844JVKR2 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.2 | $132,00 |
| 100 | $11.85 | $1.185,00 |
| 500 | $10.5 | $5.250,00 |
| 1.000 | $9.25 | $9.250,00 |
SC900844JVKR2 Übersicht
A Power Management IC (PMIC) is a single integrated circuit that consolidates multiple DC-DC converters, LDOs, battery chargers, and supervisory functions into one package. Within the broader taxonomy it sits as: PMIC -> power management -> mixed-signal IC -> semiconductor. By collapsing what would otherwise require 8-12 discrete regulators into one BGA, the PMIC shrinks board area, reduces bill of materials, and provides centralized sequencing, monitoring, and fault response across the entire platform.
Key features of the SC900844JVKR2 include five switching regulators operating between 1.0 MHz and 4.0 MHz to enable small external inductors, fourteen LDOs for low-noise analog and memory rails, ten bit-count programmable voltage control bits, and an integrated ADC for monitoring. The switching rails can be configured as buck or boost stages for core, I/O, and memory domains; the LDOs support always-on housekeeping rails. The 338-TFBGA (Thin Fine-pitch Ball Grid Array) provides dense interconnect while the 11x11 mm footprint keeps the solution area modest for tablet-class boards.
Architecture-wise, the SC900844JVKR2 uses NXP/Freescale's mixed-signal PMIC platform with one-time-programmable (OTP) configuration, I2C or SPI control interfaces (per the variant), and per-rail enable and voltage-scaling support. The wide switching-frequency range (1.0-4.0 MHz) lets designers trade off inductor size against efficiency: higher frequency shrinks magnetics, lower frequency reduces switching losses. Real-time monitoring via the integrated ADC allows platform firmware to read back each rail's voltage for telemetry and fault logging.
Typical applications include ultra-mobile PCs (netbooks), tablets, single-board computers (SBCs), industrial HMI panels, and embedded computing platforms requiring multiple voltage rails from a single battery or 5V/12V supply. Its 20-rail capacity and integrated ADC make it particularly suitable for designs that otherwise need a discrete regulator tree plus a separate fuel-gauge/monitor IC.
When designing with the SC900844JVKR2, attention to PCB layout is critical: place input bulk capacitors within 2 mm of the BGA balls, provide at least four PCB layers with a continuous ground plane beneath the package, and follow the manufacturer's reference layout for thermal vias under the exposed die-pad area.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design considerations not duplicated in the manufacturer datasheet, giving engineers a single, queryable reference for the SC900844JVKR2 PMIC.
Drop-in-Alternativen für SC900844JVKR2 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit SC900844JVKR2 (gleiche Bauform und Footprint) – abweichend in Manufacturer, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
SC900844JVKR2
✅ Drop-In✓ Auf Lager
$9.25 / Stück
Datenblatt ansehen →SC900844EPR2
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
PF0100
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
SC900844JVKR2 Grenzwerte & elektrische Eigenschaften
| Product Type | Integrated Power Management IC (PMIC) |
| Manufacturer | NXP Semiconductors (Freescale) |
| Number of Output Rails | 20 (5 switching + 14 LDO + 1 reserved/monitor rail) |
| Switching Regulators | 5 (buck/boost configurable) |
| LDO Regulators | 14 |
| Switching Frequency Range | 1.0 MHz to 4.0 MHz |
| Integrated ADC | Yes (rail voltage monitoring) |
| Voltage Control Bits | 10-bit programmable |
| Gehäuse | 338-TFBGA (11x11 mm) |
| Package Family | MAP-BGA / TFBGA |
| Montageart | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Target Applications | PCs, PDAs, ultra-mobile platforms, tablets, netbooks, embedded devices |
| RoHS-Status | Compliant |
SC900844JVKR2 map-bga / tfbga Pinbelegungsleitfaden
Pinbelegung für SC900844JVKR2 (map-bga / tfbga-Gehäuse). Dieses Leistungsbauteil verfügt über Gate-, Drain- und Source-Anschlüsse. Bei nicht gepolten Gehäusen entnehmen Sie die genaue Ausrichtung von Pin 1 und Footprint-Details dem Herstellerdatenblatt. Typische Anwendungen sind Netzteilentwurf, Motoransteuerung und Lastschaltung.
Keine detaillierten Pinbelegungsdaten verfügbar für SC900844JVKR2.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
SC900844JVKR2 ist geeignet für 6 Anwendungs: Netbook / Ultra-Mobile PC, Tablet Computing Platform, Industrial HMI / Panel PC, Single-Board Computer / SBC, Embedded Computing Module, Portable Computing Peripheral Dock.
Netbook / Ultra-Mobile PC
The NXP SC900844JVKR2 fits ultra-mobile PC designs because it provides 20 programmable rails (5 switching + 14 LDOs) in a single 338-TFBGA (11x11 mm) package, matching the rail count required by x86 netbook platforms. Its 1.0-4.0 MHz switching frequency allows use of small chip inductors, which keeps the platform's z-height under 1.5 mm. Placed on the system power board adjacent to the SoC's main supply pins, the PMIC replaces an 8-12-discrete regulator tree. Unlike discrete regulators, it adds I2C-controlled sequencing, on-chip ADC monitoring for each rail, and centralized fault response through one chip. For new ultra-mobile designs, the trade-off against external discretes is loss of per-rail supplier choice in exchange for BOM consolidation.
Empfohlen
Tablet Computing Platform
Tablets require dense power delivery for SoC cores, GPU, memory, display backlight drivers, and connectivity subsystems - exactly the use case the NXP SC900844JVKR2 was developed for. The device's 20-rail capacity, programmable sequencing, and 10-bit voltage control let tablet designers power up the application processor, DDR memory, and peripherals in the correct order with millisecond-grade delays. The integrated ADC allows the tablet's firmware to read each rail's actual voltage, supporting battery telemetry and thermal-throttling decisions. Compared with discrete regulators, the BGA-338 solution shrinks the power section to roughly 100 mm^2 versus 250+ mm^2 with discretes. Designers should validate OTP configuration against the specific SoC platform reference schematic before mass-production.
Empfohlen
Industrial HMI / Panel PC
Industrial HMI panels and panel PCs benefit from the NXP SC900844JVKR2's integration of 14 LDOs for analog rails (touch controller, display drivers, sensor analog supply) alongside 5 switching regulators for digital domains. Industrial environments demand robust power sequencing on cold-start, which the OTP-configurable sequencer addresses, and on-chip ADC telemetry enables predictive maintenance by logging rail voltage drift over time. Operating from a single 12V or 19V input with the buck converters stepping down to system voltages, the PMIC collapses what would otherwise be a complex BOM into one package. Industrial designers should pay attention to the BGA's PCB layout - at least 4 layers with continuous ground plane beneath the package is recommended for proper thermal performance.
Empfohlen
Single-Board Computer / SBC
Single-board computers targeting ARM-based application processors often need a complete multi-rail power solution in a small footprint - precisely where the NXP SC900844JVKR2 adds value. Its 338-TFBGA 11x11 mm package provides 20 rails in a footprint small enough for credit-card-sized SBCs. The programmable switching frequency (1-4 MHz) lets designers pick inductor sizes that match the SBC's chassis constraints, and the OTP-configurable output voltages cover the 0.7 V to 3.3 V range typically needed by SoC core, DDR, and I/O domains. The integrated 10-bit ADC also enables Linux u-boot or kernel drivers to read power telemetry. SBC designers using this PMIC should plan PCB stack-up with at least 4 layers and dedicated ground pour under the BGA.
Empfohlen
Embedded Computing Module
Embedded COM (Computer-on-Module) and edge-compute modules can leverage the NXP SC900844JVKR2's 20-rail density to power both the module's SoC and its companion peripherals - Ethernet PHYs, flash storage, PMIC supervisor, and sensor hubs - in a single BGA. The integrated ADC's per-rail voltage readback is useful for module diagnostics exposed over I2C to the host processor, simplifying field-service triage. With 5 switching regulators covering high-current digital domains and 14 LDOs covering analog and housekeeping rails, the PMIC matches typical COM module bill-of-materials. Designers should validate the OTP programming against the specific SoC vendor's reference schematic, since OTP settings can be different across variants of the SC900844 family.
Empfohlen
Portable Computing Peripheral Dock
Docking stations and port-replicators for portable computing benefit from the NXP SC900844JVKR2 when they need to power connected displays, USB hubs, and storage devices alongside the host platform. The device's 20-rail capacity lets a dock source multiple 5V, 12V, and 3.3V domains from one 19V input using the buck converters stepping down to system voltages. The 14 LDOs provide clean analog rails for audio codecs, USB-PHY chips, and HDMI drivers. Compared with discrete regulators, the consolidated solution simplifies the dock's compliance to EMI standards because there are fewer switching nodes to filter. For docks exporting high-power USB-PD, designers should verify the buck converter's current capability against the load profile.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für SC900844JVKR2 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | SC900844JVKR2 | SC900844EPR2 | PF0100 |
|---|---|---|---|---|
| Package | 338-TFBGA (11x11 mm) | 338-TFBGA (11x11 mm) - same | 338-TFBGA (11x11 mm) - same | 338-TFBGA - same family |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Integrated ADC | Yes (rail monitoring) | Yes | Yes | Yes |
| Packaging Media | Tape & Reel | Tray | Tape & Reel | Tray |
| Target Applications | Ultra-mobile PC, Tablet, Embedded | Ultra-mobile PC, Tablet, Embedded | Ultra-mobile PC, Tablet, Embedded | Smartphone, Tablet |
| Lifecycle Status | Active | Active | Active | NRND |
| RoHS / Lead-Free | Compliant / Yes | Compliant / Yes | Compliant / Yes | Compliant / Yes |
Wichtigste Unterscheidungsmerkmale
- Same identical silicon in tray vs tape-and-reel media (vs. SC900844JVKR2)
- Wider target-application coverage spanning ultra-mobile to embedded (vs. PF0100)
- 20-rail density in a single 338-TFBGA reducing BOM and board area (vs. Discrete regulator tree)
Designhinweise
Place input bulk capacitors within 2 mm of the SC900844JVKR2 BGA balls; use a 4-layer PCB minimum with a continuous ground plane under the 338-TFBGA. Stitch the inner ground layers with at least 8 thermal vias under the die-pad footprint to keep junction temperature within the manufacturer's recommended operating range. Route all five switching-regulator power-stage loops as tightly as possible to minimize EMI.
Estimated: based on the BGA pitch of the SC900844JVKR2 (sub-0.8 mm inferred from the 11x11 mm package containing 338 balls), use 4-6 mil micro-via fanouts and 0.5 oz copper on outer layers for fine-pitch escape routing. Place at least one 0.1 uF decoupling capacitor per switching regulator's input pin and another on the SC900844JVKR2's main supply pin, positioned with shortest possible loop area. Length-match the differential pairs of any I2C/SPI control traces to within 5 mm to avoid timing skew.
The 338-TFBGA depends heavily on the PCB for heat dissipation; thermal vias under the center balls and a continuous ground plane on the top inner layer are essential. Estimated junction-to-ambient thermal resistance is on the order of 25-35 C/W when the layout guidelines are followed. Avoid placing the SC900844JVKR2 near board-edge heat sinks or other heat sources. Run a thermal simulation against worst-case load before committing to layout.
Do not assume all SC900844 family variants share the same OTP configuration; 'drop-in' at the silicon level does not guarantee drop-in at the platform level because OTP settings affect rail mapping, sequencing order, and default voltages. Always validate the variant against the specific SoC/vendor reference design before substituting. Also confirm the reel orientation and BGA solder paste stencil aperture match the manufacturer's recommendations to avoid tombstoning and head-in-pillow defects during reflow.
Five switching converters with the buck configuration can source the platform's high-current digital rails; ensure inductor saturation current is rated at least 30% above the worst-case peak load per rail. Use ceramic capacitors with appropriate voltage derating - typically X5R or X7R dielectric at 1.5x the rail voltage - on the buck output to maintain stability under load transients. Place input capacitors as close as possible to each switching regulator's high-side and low-side FET drain/source pins.
Compliance-Informationen
RoHS compliant per NXP product page. AEC-Q100 not applicable - this is a commercial/industrial PMIC, not an automotive-qualified device. Halogen-free status not explicitly confirmed in retrieved data.
