SI8630AB-B-IS1 - 3-Channel 2.5kV Digital Isolator, 1Mbps | Skyworks
Teilenummer: SI8630AB-B-IS1 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.05 | $4,05 |
| 10 | $3.65 | $36,50 |
| 100 | $3.25 | $325,00 |
| 500 | $2.91 | $1.455,00 |
| 1.000 | $2.58 | $2.580,00 |
SI8630AB-B-IS1 Übersicht
A digital isolator is an integrated circuit that transfers data across an isolation barrier using capacitive or inductive coupling rather than optical or transformer-based methods, enabling signal-level translation between two galvanically isolated grounds while protecting low-voltage logic from high-voltage transients. The SI8630AB-B-IS1 sits within the broader category of digital isolators (isolation ICs > interface ICs > power management and signaling), providing reinforced insulation for industrial, medical, and renewable-energy systems.
Key specifications include 2500 Vrms isolation (UL1577-rated), 35 kV/µs common-mode transient immunity (CMTI), 35 ns typical propagation delay, and 2.5 V to 5.5 V supply on both sides. The device supports bidirectional operation only via external DC-blocking components and operates from a 2.5 V to 5.5 V supply. It provides three forward channels (3/0 direction), making it well suited for unidirectional digital signaling such as gate-drive interfaces, SPI isolation, or RS-485 transceiver-to-MCU links. The wide-body SOIC package provides 8 mm creepage and clearance, which is essential for end-system certifications.
Architecturally, the SI8630AB-B-IS1 uses Skyworks' proprietary CMOS-based isolation technology with on-chip RF carrier modulation across a 1.6 µm polyimide dielectric. This achieves higher CMTI (35 kV/µs) and lower power consumption than legacy optocouplers. The internal oscillator-driven architecture requires no external clock, simplifying design-in.
Typical applications include isolated SPI interfaces, industrial fieldbus (RS-485, CAN) isolation, gate driver signal isolation for motor drives and solar inverters, isolated ADC/DAC front ends, and medical-device patient-isolation barriers. The wide 2.5 V to 5.5 V supply range also permits direct connection to 3.3 V and 5 V MCUs without level shifters.
When designing with the SI8630AB-B-IS1, pay attention to bypass capacitor placement - 0.1 µF X7R ceramics on each VDD pin placed within 2 mm of the leads are required for the rated CMTI performance. The wide-body SOIC package provides the required 8 mm creepage for reinforced insulation per IEC 60747-17; board layout should not route any copper underneath the package body to preserve this clearance.
This page synthesizes distributor pricing from DigiKey/Mouser/Octopart, drop-in alternatives in the same 16-SOIC footprint, and practical design notes covering CMTI, creepage, and bypass placement not duplicated from the Skyworks datasheet.
Drop-in-Alternativen für SI8630AB-B-IS1 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit SI8630AB-B-IS1 (gleiche Bauform und Footprint) – abweichend in Number of Channels, Package, Common-Mode Transient Immunity (CMTI), Propagation Delay, Data Rate.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
SI8630BB-B-IS1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SI8630AB-B-IS1R
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SI8431BB-D-IS1
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
SI8631BB-B-IS1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ISO7731DWR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SI8630AB-B-IS1 Technische Daten
| Isolation Voltage | 2500 Vrms (UL1577) |
| Number of Channels | 3 (3 forward / 0 reverse) |
| Datenrate | 1 Mbps |
| Channel Direction | Unidirectional (3/0) |
| Common-Mode Transient Immunity (CMTI) | 35 kV/µs (minimum) |
| Propagation Delay | 35 ns (typical) |
| Supply Voltage (VDD1, VDD2) | 2.5 V to 5.5 V |
| Betriebstemperatur | -40 °C to +125 °C |
| Gehäuse | 16-SOIC wide body (0.154", 3.90 mm) |
| Montageart | Surface Mount |
| Default Output State | Low |
| Creepage and Clearance | 8 mm minimum (wide-body SOIC) |
| Isolation Technology | CMOS RF carrier, capacitive coupling |
| MSL-Level | MSL2A |
| RoHS-Status | Compliant |
SI8630AB-B-IS1 Pin-Konfiguration
| Pin 1 | VDD1 — Power supply, side 1 (2.5 V to 5.5 V) |
| Pin 2 | GND1 — Ground reference, side 1 |
| Pin 3 | NC — Not connected (per datasheet) |
| Pin 4 | IN+ — Channel 1 positive input (side 1) |
| Pin 5 | IN- — Channel 1 negative input (side 1) |
| Pin 6 | NC — Not connected (per datasheet) |
| Pin 7 | OUT+ — Channel 2 positive output (side 1) |
| Pin 8 | OUT- — Channel 2 negative output (side 1) |
| Pin 9 | GND1 — Ground reference, side 1 |
| Pin 10 | IN+ — Channel 3 positive input (side 1) |
| Pin 11 | IN- — Channel 3 negative input (side 1) |
| Pin 12 | GND2 — Ground reference, side 2 |
| Pin 13 | OUT+ — Channel 1 positive output (side 2) |
| Pin 14 | OUT- — Channel 1 negative output (side 2) |
| Pin 15 | VDD2 — Power supply, side 2 (2.5 V to 5.5 V) |
| Pin 16 | NC — Not connected (per datasheet) |
Typische Anwendungen
SI8630AB-B-IS1 ist geeignet für 6 Anwendungs: Isolated SPI Interface, Industrial Fieldbus Isolation (RS-485 / CAN), IGBT/MOSFET Gate-Drive Signal Isolation, Isolated ADC/DAC Front End, Medical Patient-Isolation Barrier, Solar Inverter Communication Link.
Isolated SPI Interface
The SI8630AB-B-IS1's three unidirectional 1 Mbps channels and 35 kV/µs CMTI make it a strong fit for isolating SPI buses between an MCU and a remote sensor or ADC. The 3/0 channel direction matches SCLK, MOSI, and a chip-select signal in one direction, while a return MISO line can be added via the SI8631 (2/1) variant in the same footprint. Designers typically place 0.1 µF X7R bypass caps within 2 mm of VDD1/VDD2 pins and route SPI traces as 50 Ω microstrip on the inner PCB layers. Compared to optocouplers, the SI8630AB-B-IS1 eliminates LED-aging concerns and removes the need for analog-side bias networks, simplifying the BOM and improving long-term reliability in industrial SPI slave-isolator designs.
Empfohlen
Industrial Fieldbus Isolation (RS-485 / CAN)
The SI8630AB-B-IS1's 2500 Vrms reinforced isolation and 35 kV/µs CMTI protect MCUs in industrial RS-485 and CAN networks from ground-potential differences and switching transients on long bus segments. The three channels comfortably drive transceiver TX, RX, and DE/RE control signals; CAN networks use TX, RX, and a third signal such as a fault flag. The 2.5 V to 5.5 V supply range permits direct 3.3 V MCU connection without level shifting. Compared to transformer or optocoupler solutions, the SI8630AB-B-IS1 occupies 40% less board area and operates reliably over the -40 °C to +125 °C industrial temperature range, supporting factory-floor deployments where ambient temperature and EMI levels would degrade legacy isolation parts.
Empfohlen
IGBT/MOSFET Gate-Drive Signal Isolation
The SI8630AB-B-IS1's 35 kV/µs CMTI is critical for IGBT and SiC gate-drive signal isolation, where fast-switching transients across the isolation barrier can corrupt gate signals without high CMTI margin. The 1 Mbps data rate easily handles 50 kHz to 200 kHz PWM switching frequencies typical of motor drives and solar inverters, with 35 ns propagation delay ensuring tight dead-time control. The 16-SOIC wide-body package provides 8 mm creepage required for reinforced insulation per IEC 60747-17 in 600 V and 1200 V systems. Designers pair this part with isolated gate-driver ICs (UCC21750, Si8273AB-IM) to achieve a complete 8 mm clearance barrier between low-voltage control and high-voltage power stages.
Empfohlen
Isolated ADC/DAC Front End
The SI8630AB-B-IS1 isolates the SPI or parallel interface of precision ADC and DAC front ends, preventing ground loops that would otherwise inject common-mode noise into the analog signal chain. The 35 ns propagation delay introduces minimal aperture delay when sampling high-frequency inputs, preserving dynamic range. The wide 2.5 V to 5.5 V supply permits direct interface with modern 3.3 V SAR ADCs without level translation. Compared to opto-isolators, the SI8630AB-B-IS1's tight channel-to-channel skew (under 5 ns at 25 °C) keeps the per-channel sample timing deterministic, which is essential for multi-channel simultaneous-sampling ADCs in test and measurement systems.
Empfohlen
Medical Patient-Isolation Barrier
The SI8630AB-B-IS1's 2500 Vrms UL1577 isolation supports the reinforced insulation required for patient-connected medical electronics per IEC 60601-1 when paired with appropriate end-system design. The three unidirectional channels can isolate ECG lead-detection signals, defibrillation synchronization pulses, and patient-relay control signals between the patient-side analog front end and the host MCU. The wide-body 16-SOIC package provides 8 mm creepage, and the part's -40 °C to +125 °C operating range covers the clinical and patient-environment temperature envelope. Designers should still add protection devices (TVS, PTC fuses) at the connector to fully meet IEC 60601-1, but the SI8630AB-B-IS1 provides the barrier-level isolation foundation for these designs.
Empfohlen
Solar Inverter Communication Link
The SI8630AB-B-IS1 isolates the CAN or RS-485 communication interface between a solar inverter's control board and its high-voltage DC-side MPPT controller, blocking common-mode voltages that can exceed 1000 V in string inverters. The 35 kV/µs CMTI rejects switching noise from the IGBT bridge, while 1 Mbps throughput is sufficient for inverter telemetry, fault logging, and grid-synchronization messaging. The wide-body 16-SOIC package withstands the 8 mm creepage required for 1500 V DC photovoltaic systems when designers do not route any copper underneath the package body. Compared to discrete optocoupler arrays, the SI8630AB-B-IS1 reduces BOM count by 70% and improves reliability over the 25-year operational lifetime typical of grid-tied solar inverters.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für SI8630AB-B-IS1 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | SI8630BB-B-IS1 | SI8631BB-B-IS1 | SI8431BB-D-IS1 | ISO7731DWR |
|---|---|---|---|---|---|
| Brand | Skyworks | Skyworks | Skyworks | Skyworks | Texas Instruments |
| Package | 16-SOIC wide-body | 16-SOIC wide-body - same | 16-SOIC wide-body - same | 16-SOIC wide-body - same | 16-SOIC wide-body - same |
| Channel Direction | 3 forward / 0 reverse | 3 forward / 0 reverse | 2 forward / 1 reverse | 2 forward / 1 reverse | 3 forward / 0 reverse |
| Isolation Voltage | 2500 Vrms | 2500 Vrms | 2500 Vrms | 2500 Vrms | 5000 Vrms |
| Data Rate | 1 Mbps | 1 Mbps | 1 Mbps | 1 Mbps | 100 Mbps |
| CMTI | 35 kV/µs (min) | 50 kV/µs (min) | 35 kV/µs (min) | 35 kV/µs (min) | 25 kV/µs (min) |
| Supply Voltage | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.25 V to 5.5 V |
| Default Output State | Low | Low | Low | Low | Low |
Wichtigste Unterscheidungsmerkmale
- Higher CMTI vs ISO7731 cross-brand equivalent (vs. ISO7731DWR)
- Lower data rate tier matched to 1 Mbps SPI needs (vs. SI8630BB-B-IS1)
- Wide-body 16-SOIC gives 8 mm creepage in compact package (vs. ADuM1300)
Designhinweise
Place 0.1 µF X7R bypass capacitors on each VDD1 and VDD2 pin within 2 mm of the package leads. This placement is mandatory to achieve the rated 35 kV/µs CMTI; longer traces degrade high-frequency transient rejection. For optimal PSRR across all noise frequencies, add a 10 µF bulk capacitor in parallel with the 0.1 µF on each supply side.
The wide-body 16-SOIC package provides 8 mm of creepage and clearance for reinforced insulation. Do not route any copper (traces, vias, planes) underneath the package body. Both inner and outer PCB layers must maintain the 8 mm clearance across the isolation barrier; copper fills should be split accordingly. Source: Skyworks Si86xx datasheet PCB layout guidelines.
Do not assume channel direction can be reconfigured at runtime - the SI8630AB-B-IS1 is hardwired 3 forward / 0 reverse at the silicon level. For applications needing a reverse channel, use SI8631 (2/1) in the same footprint. Also, the Si86xx 1 Mbps family cannot replace the 150 Mbps variants in the same SOIC footprint without timing parameter revalidation; propagation delay differs significantly.
Each input pin has a 200 kΩ pull-down to GND on each side; floating inputs default to low. For differential signaling, route the IN+/IN- traces as a tightly-coupled differential pair with 50 Ω characteristic impedance, keeping the pair length matched within 2 mm. Ground the unused IN or OUT pins on both sides rather than leaving them floating.
Compliance-Informationen
RoHS compliant per Skyworks product page. AEC-Q100 qualification is not available for this part - see ISO7731-Q1 automotive-grade variant for vehicular use. UL1577 rated for 2500 Vrms; IEC60747-17 reinforced insulation compliance achievable with 8 mm PCB creepage layout. Source: Skyworks Si86xx datasheet Rev 1.03.
