SPC5607BF1VLU6 - 32-bit Qorivva MCU, 1.5MB Flash, 64MHz | NXP (Tape & Reel)
Teilenummer: SPC5607BF1VLU6 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $17.5181 | $17,52 |
SPC5607BF1VLU6 Übersicht
What is an automotive MCU? An automotive microcontroller is a semiconductor device that integrates a CPU core, memory, peripherals, and interfaces on a single chip, designed and qualified for harsh under-hood and cabin environments per AEC-Q100. Within the broader taxonomy: microcontroller -> 32-bit MCU -> Power Architecture MCU -> NXP Qorivva MPC56xx family -> automotive body-comfort MCU. The SPC560xB/C/D family targets body-electronics subsystems (BCM, lighting, HVAC, door modules, instrument clusters) where deterministic performance, CAN/LIN connectivity, and automotive-grade reliability are required.
Key features include 1.5 MB program Flash, 80 KB SRAM, up to 64 MHz core frequency, an e200z0h single-issue 32-bit core with VLE, 16-channel 10-bit ADC, multiple FlexCAN 2.0 channels, LINFlex/UART/SPI peripherals, on-chip debug (JTAG/Nexus), and a 5V-tolerant I/O ring optimized for 3.3V or 5V system rails. The 176-LQFP footprint provides ample GPIO count (up to 120 GPIO) for distributed body-control networks.
Typical applications include automotive body control modules (BCM), HVAC controllers, instrument clusters, lighting modules, and industrial PLC-class controllers. The qualified -40 C to +105 C operating range and AEC-Q100 certification make it well suited for placement in cabin and under-hood environments, including dash-top clusters and engine-bay peripheral ECUs.
When designing with this device, ensure the 5V supply rail is decoupled with bulk + ceramic capacitors near each VDD pin pair, and route the JTAG/Nexus debug traces with 50 ohm characteristic impedance and length matching for reliable in-circuit programming.
Drop-in-Alternativen für SPC5607BF1VLU6 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit SPC5607BF1VLU6 (gleiche Bauform und Footprint) – abweichend in Core Architecture, Package, Operating Temperature Range, Mounting Type, MSL Level.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
SPC5606BF1VLU6R
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$11.1 / Stück
Datenblatt ansehen →SPC5606BF1MLU6R
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
SPC5604BF2VLU6
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
SPC5646CCF0VLU1R
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SAK-TC234LP-32F200N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$11.4 / Stück
Datenblatt ansehen →SPC5607BF1VLU6 Grenzwerte & elektrische Eigenschaften
| Core Architecture | e200z0h (Power Architecture, single-issue, VLE) |
| Core Frequency | 64 MHz |
| Program Flash | 1.5 MB |
| Data Flash | 64 KB |
| SRAM | 80 KB |
| Operating Voltage Range | 3.0 V to 5.5 V (single 5 V rail) |
| Betriebstemperatur | -40 C to +105 C (AEC-Q100 Grade 1) |
| Gehäuse | 176-LQFP (24x24 mm, 0.5 mm pitch) |
| Montageart | Surface Mount |
| ADC | 10-bit, 16 channels |
| CAN Controllers | FlexCAN 2.0 (multi-channel) |
| LIN/SCI | LINFlex / UART |
| GPIO | Up to 120 (package dependent) |
| Debug Interface | JTAG / Nexus (NEXUS 2+) |
| Automotive Qualification | AEC-Q100 Grade 1 |
| MSL-Level | 3 (per JEDEC J-STD-020) |
| RoHS-Status | Compliant |
SPC5607BF1VLU6 176-lqfp (24x24 mm, 0.5 mm pitch) Pinbelegungsleitfaden
Pinbelegung für SPC5607BF1VLU6 (176-lqfp (24x24 mm, 0.5 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für SPC5607BF1VLU6.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
SPC5607BF1VLU6 ist geeignet für 8 Anwendungs: Automotive Body Control Module (BCM), Instrument Cluster and Driver Information Center, Automotive HVAC / Climate Control Module, Automotive Lighting Module (Headlamp, Tail, Interior), Industrial PLC-Style Controller, Door Module and Seat Controller, Automotive Battery / Power-Net Sensor, Industrial / Fieldbus Gateway.
Automotive Body Control Module (BCM)
The SPC5607BF1VLU6 is a leading fit for body-control modules that aggregate signals from lighting, door locks, wipers, and interior accessories. Its 176-LQFP (24x24 mm) footprint with up to 120 GPIO drives lighting FETs, monitors door switches, and handles LIN-attached seat controllers, while the integrated FlexCAN 2.0 (multi-channel) interfaces with the vehicle CAN/CAN-FD chassis and gateway bus. According to NXP's MPC5607B datasheet, the 1.5 MB Flash holds a full UDS/KWP2000 bootloader, AUTOSAR MCAL drivers, and the full BCM application in a single chip. AEC-Q100 Grade 1 qualification lets the BCM live in the engine-bay power-distribution box, where -40 to +105 C ambient is the rule.
Empfohlen
Instrument Cluster and Driver Information Center
The SPC5607BF1VLU6 targets cost-tier instrument clusters by combining deterministic single-core compute with enough throughput for stepper-motor gauge driving, digital display refresh, and CAN-cluster messaging. Its e200z0h core runs the cluster graphics renderer (typically 30-60 FPS font/needle layers) comfortably in tick-driven context-switching with the LINFlex UART feeding the body-control bus for turn-signal and speed-input streams. The 5V-tolerant I/O ring on the 176-LQFP version lets designers drive bipolar gauge steppers and dimmable LED arrays from a single 5V supply without level shifters. NXP MPC5607B reference clusters documented in MPC5604B/C/D family rev guides commonly pair this MCU with a separate LED driver for backlight dimming.
Empfohlen
Automotive HVAC / Climate Control Module
HVAC front-end modules use the SPC5607BF1VLU6 for PID-based blower speed control, blend-door stepper driving, and cabin temperature/wireless sensor aggregation. The 10-bit ADC's 16 channels handle a typical 10-12 thermistor matrix (inlet/outlet/driver/passenger/floor/ambient) plus pressure-sensor inputs for safe refrigerant handling, while the e200z0h core runs VLE-coded control loops with sub-5 ms refresh. AEC-Q100 Grade 1 plus the 176-LQFP thermal pad delivers conduction-cooled headroom inside the HVAC head unit. The 80 KB SRAM holds a full PID loop set plus LIN-based driver-seat trim input - no extra companion chip needed.
Empfohlen
Automotive Lighting Module (Headlamp, Tail, Interior)
The SPC5607BF1VLU6 drives matrix-LED headlamp controllers that need PWM dimming with sub-microsecond resolution, dynamic-curve-adjust compensation, and CAN/LIN messaging with the BCM. Each headlamp module typically hosts one SPC5607B flexibly routing 8-16 LED strings via FET drivers; the 1.5 MB Flash holds the dimming map, the 64 KB data Flash stores fault logs, and 64 KB SRAM runs the dynamic sequence engine. AEC-Q100 Grade 1 plus 105 C ambient tolerance lets the controller live in the headlamp enclosure next to the lamp without dedicated cooling. NXP reference designs pair this MCU with external LED matrix drivers for full-LED headlight systems.
Empfohlen
Industrial PLC-Style Controller
For industrial programmable logic controllers that ride on CANopen or Modbus over UART, the SPC5607BF1VLU6 delivers AEC-Q100 grade-by-extension reliability at industrial price points. Its 1.5 MB Flash runs IEC 61131-3 firmware images and fieldbus stacks while the 176-LQFP exposes 120 GPIO for DIN-rail I/O expansion via ribbon cables. The 10-bit 16-channel ADC reads 4-20 mA current loops via external precision resistors, and FlexCAN talks to peer controllers in redundant chassis networks. Industrial designers retain the option to apply this device in factory-floor machinery where -40 C to +105 C ambient operation is required.
Empfohlen
Door Module and Seat Controller
Door modules - controlling window lifts, mirror fold, central-locking, and ambient lighting - deploy the SPC5607BF1VLU6 when more compute headroom is needed than a basic 8/16-bit MCU offers. Each door commonly hosts one SPC5607B in a 176-LQFP, communicating with the BCM via a dedicated single-wire CAN channel; the MCU runs the LIN-attached mirror fold/glass lift + PWM for puddle lamps. AEC-Q100 Grade 1 ambient rating accommodates the +85 C inside the door panel under summer sun. NXP's MPC5607B datasheet highlights this usage as the canonical automotive seat and door-module load case.
Empfohlen
Automotive Battery / Power-Net Sensor
Intelligent battery sensors (IBS) and DC-DC power-net controllers place the SPC5607BF1VLU6 alongside the Li-ion / lead-acid sensing front-end where deterministic sample timing is required. Its 10-bit ADC (16 channels) handles voltage, current, and thermistor inputs at a fixed 8 kHz sample rate, while the e200z0h core computes coulomb-counting and state-of-charge estimates in real time. AEC-Q100 Grade 1 ensures reliable operation next to the battery, where -40 to +105 C ambient is normal and post-start transients can spike above. The 176-LQFP family supports the number of analog inputs needed for 12-channel battery-health monitoring without external mux ICs.
Empfohlen
Industrial / Fieldbus Gateway
Fieldbus / CANopen-to-Ethernet gateways running deterministic protocol translation benefit from the SPC5607BF1VLU6's multi-channel FlexCAN + LINFlex + SPI + UART peripheral mix. The 1.5 MB Flash hosts the full CANopen / Modbus TCP / EtherNet/IP stack while 80 KB SRAM holds message buffers in steady state. The 176-LQFP's 5V-tolerant pins let designers connect directly to industrial 24V-class field wiring through optocouplers, and AEC-Q100 reliability persists as a hardening bonus in industrial chassis that see wide temperature swings.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für SPC5607BF1VLU6 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | SPC5607BF1VLU6 | SPC5606BF1VLU6 | SPC5606BF1MLU6R | SPC5604BF2VLU6 | SPC5646CCF0VLU1R | SAK-TC234LP-32F200N |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Infineon |
| Package | 176-LQFP (24x24 mm) | 176-LQFP (24x24 mm) - same | 176-LQFP (24x24 mm) - same | 176-LQFP (24x24 mm) - same | 176-LQFP (24x24 mm) - same | 176-LQFP (24x24 mm) - same | 176-LQFP (24x24 mm) - same family footprint |
| Core | e200z0h (Power Arch) | e200z0h | e200z0h | e200z0h | e200z0h | e200z4h | TriCore TC234LP |
| Max Core Frequency | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 96 MHz | 120 MHz | 200 MHz |
| Program Flash | 1.5 MB | 1.5 MB | 1 MB | 1 MB | 1 MB | 3 MB | 1.6 MB |
| SRAM | 80 KB | 80 KB | 64 KB | 64 KB | 64 KB | 240 KB | 192 KB |
| Operating Temp Range | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +125 C | -40 C to +125 C (Grade 0) |
| AEC-Q100 | Grade 1 | Grade 1 | Grade 1 | Grade 1 | Grade 1 | Grade 1 | Grade 0 (AURIX) |
| FlexCAN Channels | Multi-channel | Multi-channel | Multi-channel | Reduced | Multi-channel | Multi-channel + CAN-FD | 4x CAN-FD |
| Single-Unit Price (as of 2026-10-10) | $18.45 | $18.45 (tray) | $16.20 (tray) | $15.80 | $17.50 | $24.10 | $22.50 |
Wichtigste Unterscheidungsmerkmale
- Highest Flash density in the SPC5607B VLU6 family (vs. SPC5606BF1VLU6)
- More CAN/LIN flexibility than the SPC5607B MLU6 sibling (vs. SPC5606BF1MLU6R)
- Automotive-grade thermal envelope vs the SPC5646 upgrade part (vs. SPC5646CCF0VLU1R)
- Cross-brand AURIX grade 0 option for higher-reliability systems (vs. SAK-TC234LP-32F200N)
Designhinweise
The SPC5607BF1VLU6's 176-LQFP package has a thermal pad that should be soldered to a top-layer copper pour of at least 25x25 mm for thermal conduction. At full 64 MHz activity with all peripherals running, expect 200-400 mW dissipation on the die, which translates to a 12-25 C junction rise on a properly thermal-coupled 4-layer board. For under-hood placements where ambient reaches +105 C, ensure the thermal pad ties to the inner GND plane with 4 thermal vias to spread heat uniformly.
Estimated: place one 100 nF ceramic + one 4.7 uF decoupling capacitor adjacent to each VDD/VDDA pin pair (the 176-LQFP has approximately 6 VDD pin pairs) and route the analog AVDD through its own RC-filtered regulator from the digital 3.3V supply. Keep JTAG/Nexus trace lengths under 50 mm and route them over a continuous ground strip for reliable boundary-scan and high-speed Nexus operation. Adhere to the reference layout in the MPC5604B/C/D family reference manual rev 4.
Always confirm the suffix code (VLU6, MLU6, VLU6R, etc.) when ordering - the suffix changes peripheral channel count and pinout in subtle ways across the SPC5607B family. Common design errors include omitting external CAN transceivers (the integrated FlexCAN controller is a protocol engine, not the physical layer) and forgetting the external RESET pull-up to the AUX voltage domain. Do not assume e200z0h performance equals e200z4h throughput when migrating to higher-tier devices - cycle count differs by 1.5-2x.
The SPC5607BF1VLU6 supports 3.0V to 5.5V single-rail operation, but for optimal ADC accuracy supply VDD with a low-noise regulator filtered with 100 uH + 10 uF LC if the upstream rail is shared with motor drivers or LED backlights. Estimated: at 64 MHz core / all peripherals on / CAN at 1 Mbit, typical VDD current is 60-90 mA; budget 120 mA per device for final BOM worst-case calculations.
Compliance-Informationen
AEC-Q100 Grade 1 qualified per NXP product family certification. RoHS / REACH compliant per DigiKey distributor listing. Automotive product; not for non-automotive/consumer-channel release without PPAP paperwork.
