SPC5743RK1MLU5 - Automotive 32-bit MCU, 2MB Flash, 200MHz | NXP
Teilenummer: SPC5743RK1MLU5 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $36.26 | $36,26 |
| 10 | $32.5 | $325,00 |
| 100 | $29.4 | $2.940,00 |
| 500 | $27.69 | $13.845,00 |
| 1.000 | $26.15 | $26.150,00 |
SPC5743RK1MLU5 Übersicht
A microcontroller (MCU) is a single-chip processing subsystem that integrates a CPU core, program and data memory (Flash / SRAM), analog and digital peripherals, communication interfaces, and timing hardware into one package. The MPC57xx family belongs to NXP's Power Architecture (formerly PowerPC/e200) line for automotive and industrial safety, extending the standard MCU taxonomy (MCU -> embedded processor -> semiconductor IC). Functional-safety MCUs add lockstep cores, ECC on Flash/SRAM, watchdog timers, and a fault-collection unit so the chip can satisfy ISO 26262 ASIL-D workflows.
Key features include triple Power Architecture cores (two z4 cores plus one z0 lockstep), 3 MB total on-chip Flash (organized as 2 MB primary + 1 MB auxiliary per some datasheet variants), a 200 MHz maximum CPU frequency, and a 3.5 V to 5.5 V supply range with 12-bit/16-bit ADC channels. The device integrates FlexCAN, LINFlex, DSPI, and Ethernet interfaces for vehicle networks, plus an on-chip enhanced modular timer subsystem (eMIOSS) for precise actuation.
The architecture is optimized for hard-real-time control loops. Dual z4 cores split chassis and powertrain tasks while the z0 lockstep core performs safety diagnostics without burdening the application cores. Hardware ECC and end-to-end error-correcting memory bus meet ISO 26262 integrity targets, while the 24x24 mm LQFP-176 footprint and 0.5 mm pitch suit dense powertrain PCB layouts.
Typical applications include automotive engine control units (ECUs), transmission control modules (TCUs), battery management systems, electric power steering, and chassis-domain controllers. Industrial automation and robotic safety controllers also benefit from the AEC-Q100 qualification and lockstep architecture.
Designers should review the device's power sequencing requirement (3.5-5.5 V with clean analog/digital rail split) and its 176-pin LQFP layout; a 4-layer PCB with dedicated ground pour is recommended for EMC. Compare this part against SPC5742 and SPC5744 family variants if memory size, peripheral mix, or frequency scaling differs from your bill of materials.
This page synthesizes distributor pricing, drop-in alternatives, and design notes not aggregated on the manufacturer datasheet alone, and consolidates cross-reference findings for engineers selecting a drop-in replacement for the SPC5743RK1MLU5 in active programs.
Drop-in-Alternativen für SPC5743RK1MLU5 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
SPC5743RK1MLQ5R
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SPC5743PK1AMLQ5R
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SPC5742PK1AMLQ8
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SPC5742PK1MLQ5R
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SPC5744RK1MLU5
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SPC5743RK1MLU5 Grenzwerte & elektrische Eigenschaften
| Core Architecture | Power Architecture e200z4 (MPC57xx) Triple-Core |
| CPU Core Count | Dual e200z4 + e200z0 lockstep core |
| Maximum CPU Frequency | 200 MHz |
| Program Memory Size | 2 MB Flash (3 MB total on-chip Flash per variant) |
| Supply Voltage Range | 3.5 V to 5.5 V |
| Betriebstemperaturbereich | -40 °C to +125 °C |
| Automotive Qualification | AEC-Q100 qualified |
| ADC Resolution | 12-bit / 16-bit |
| Package Type | LQFP-176 |
| Package Dimensions | 24 mm x 24 mm |
| Lead Pitch | 0.5 mm |
| Montageart | Surface Mount (Gull Wing) |
| MSL-Level | 3 (per JEDEC J-STD-020, typical for LQFP-176) |
| Communication Interfaces | FlexCAN, LINFlex, DSPI, Ethernet |
| Timer Subsystem | Enhanced Modular Timer (eMIOSS) |
| Functional Safety | Hardware ECC, lockstep core, fault collection unit |
| RoHS-Status | Compliant |
SPC5743RK1MLU5 24 mm x 24 mm Pinbelegungsleitfaden
Pinbelegung für SPC5743RK1MLU5 (24 mm x 24 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für SPC5743RK1MLU5.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
SPC5743RK1MLU5 ist geeignet für 6 Anwendungs: Engine Control Unit (ECU), Transmission Control Module (TCU), Battery Management System (BMS), Electric Power Steering (EPS), Chassis Domain Controller, Industrial Functional-Safety Controller.
Engine Control Unit (ECU)
The SPC5743RK1MLU5 powers gasoline and diesel engine ECUs where dual e200z4 cores drive fuel-injection and ignition loops while the lockstep z0 core handles diagnostics. Its 200 MHz throughput, 3 MB on-chip Flash, and 12/16-bit ADCs sample crank/cam sensors and drive actuators at sub-millisecond cadence for closed-loop control. AEC-Q100 +125 °C rating supports under-hood ambient conditions while the ECC-protected Flash and FlexCAN interfaces integrate cleanly into CAN-FD powertrain networks without external watchdog or supervisor ICs.
Empfohlen
Transmission Control Module (TCU)
For automatic and DCT transmission control, the SPC5743RK1MLU5 provides the dual-core throughput required to schedule shift solenoids, model clutch torque, and process wheel-speed sensors concurrently. The lockstep z0 core allows the application cores to execute shift logic without safety overhead, while the Enhanced Modular Timer subsystem (eMIOSS) generates PWM waveforms for solenoid current profiling. The 176-pin LQFP exposes sufficient FlexCAN/LIN channels to communicate with the engine ECU and vehicle CAN-FD backbone simultaneously.
Empfohlen
Battery Management System (BMS)
In lithium-ion battery management applications, the SPC5743RK1MLU5 executes cell-balancing algorithms and state-of-charge estimations across up to 96 series cells when paired with external AFE devices. Its dual z4 cores handle coulomb counting and cell-voltage sampling while ECC protects calibration tables used to translate cell voltage to SoC. The AEC-Q100 grade and 3.5-5.5 V supply tolerance accommodate 12 V automotive rails directly, and the 24x24 mm LQFP-176 footprint suits modular BMS masters.
Empfohlen
Electric Power Steering (EPS)
EPS controllers rely on fast torque-loop control and ASIL-D safety classification, both delivered by the SPC5743RK1MLU5's lockstep z0 core and end-to-end ECC. The dual application cores run torque-vectoring firmware while the lockstep core validates every operation, eliminating the need for an external safety MCU. The 200 MHz headroom and the FlexCAN-FD bandwidth allow torque sensor fusion at high update rates; 12/16-bit ADC channels read torque, position, and motor current feedback precisely.
Empfohlen
Chassis Domain Controller
Chassis domain controllers consolidate braking, suspension, and steering subsystems; the SPC5743RK1MLU5's MPC57xx triple-core architecture provides the bandwidth and isolation to run multiple time-deterministic tasks concurrently. FlexCAN-FD channels aggregate messages from corner ECUs while Ethernet MACs feed sensor data from domain-wide networks. ECC-protected Flash preserves critical suspension/ride-height calibration and the +125 °C grade tolerates thermal stress inside the chassis electronics bay.
Empfohlen
Industrial Functional-Safety Controller
Beyond automotive, the SPC5743RK1MLU5 serves as the central safety controller in industrial robotics, PLC safety modules, and SIL-3 servo drives. Its lockstep z0 core and ECC memory enable IEC 61508 SIL-3 / ISO 26262 ASIL-D software certification without dedicated supervisor ICs, while the 200 MHz performance handles fast servo current loops. The LQFP-176 footprint plus standard 3.5-5.5 V supply simplify board reuse between automotive and industrial programs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für SPC5743RK1MLU5 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | SPC5743RK1MLQ5R | SPC5743PK1AMLQ5R | SPC5742PK1AMLQ8 | SPC5742PK1MLQ5R | SPC5744RK1MLU5 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | LQFP-176 (24x24 mm) | LQFP-176 (24x24 mm) - same | LQFP-176 (24x24 mm) - same | LQFP-176 (24x24 mm) - same | LQFP-176 (24x24 mm) - same | LQFP-176 (24x24 mm) - same |
| Core Architecture | Dual e200z4 + lockstep z0 (Triple-core) | Dual e200z4 + lockstep z0 - identical | SPC5743 PK1 family - same MPC57xx core | SPC5742 family - adjusted core mix | SPC5742 family - adjusted core mix | SPC5744 family - same triple-core architecture |
| Maximum CPU Frequency | 200 MHz | 200 MHz - same | 200 MHz - same | 200 MHz - same | 200 MHz - same | 200 MHz - same |
| On-Chip Flash (total) | 3 MB (2 MB primary + auxiliary) | 3 MB - identical | 3 MB - same SPC5743 PK1 family | Lower Flash count - SPC5742 family | Lower Flash count - SPC5742 family | 4 MB+ - SPC5744 family, expanded Flash |
| Operating Temperature Range | -40 °C to +125 °C | -40 °C to +125 °C - same | -40 °C to +125 °C - same | -40 °C to +125 °C - same | -40 °C to +125 °C - same | -40 °C to +125 °C - same |
| Automotive Qualification | AEC-Q100 qualified | AEC-Q100 qualified - same | AEC-Q100 qualified - same family | AEC-Q100 qualified - same family | AEC-Q100 qualified - same family | AEC-Q100 qualified - same family |
| Supply Voltage Range | 3.5 V to 5.5 V | 3.5 V to 5.5 V - same | 3.5 V to 5.5 V - same | 3.5 V to 5.5 V - same | 3.5 V to 5.5 V - same | 3.5 V to 5.5 V - same |
| Functional-Safety Features | Lockstep z0 core, ECC, FCCU | Lockstep z0 + ECC + FCCU - identical | Same SPC5743 safety features - identical | SPC5742 safety set - scaled peripherals | SPC5742 safety set - scaled peripherals | Same lockstep + ECC architecture - scaled |
Wichtigste Unterscheidungsmerkmale
- Triple Power Architecture core with hardware lockstep (vs. SPC5742PK1AMLQ8)
- 3 MB on-chip Flash for powertrain code density (vs. SPC5742PK1MLQ5R)
- 176-pin LQFP with high peripheral count (vs. SPC5743PK1AMLQ5R)
Designhinweise
Estimated: The SPC5743RK1MLU5 draws in the order of hundreds of mA from a single 3.5-5.5 V supply across its 12 V automotive rail. Use a low-ESR 100 uF bulk capacitor plus 100 nF/10 uF decoupling on each VDD/VSS pin pair, with vias stitching the inner ground planes around the LQFP-176 thermal pad region. A dedicated 5 V LDO upstream improves ADC reference stability - EPCOS/TDK or Murata BNEptype Murata parts at 10-100 nF high-frequency bypass are recommended. Estimated: assume typical 250 mA core current at 200 MHz for thermal budgeting.
The 24x24 mm LQFP-176 package dissipates application-level heat through the lead frame and PCB copper; at 1 W dissipation the junction-to-ambient thermal resistance is in the 30-40 C/W range without special copper. Recommended: place a continuous top-layer ground pour directly under the IC with thermal vias to inner power planes, and consider copper area on both sides connected by a via grid beneath the package for thermal relief. AEC-Q100 +125 °C ambient operation implies the application SoP would typically run below ~75 °C junction under the recommended layout.
Signal-integrity considerations for the SPC5743RK1MLU5 include routing FlexCAN and Ethernet differential pairs as 100-ohm impedance-matched layers with no stubs, separating analog/digital grounds and joining at one point near the regulator. Crystal traces should be symmetric, short, and surrounded by ground hatching to suppress noise coupling into the ADC reference. Estimated: trace lengths under 8 mm and series terminations at 33 ohm on high-speed clocks reduce reflections on this LQFP-176 footprint.
Do not assume software compatibility between the SPC5743RK1 and the SPC5743 PK1 sub-families - they ship with different header files and linker scripts. Also, the 0.5 mm lead pitch on LQFP-176 requires PCB manufacturing with 0.1 mm/4 mil trace-and-space capability; designs violating this fabricate unreliably. Estimated: rely on NXP's S32 Design Studio toolchain and the provided SDK rather than third-party compilers not validated for the lockstep core. Always validate peripheral pin alternate-function mappings against the latest datasheet revision before committing to layout.
Compliance-Informationen
AEC-Q100 qualified per NXP MPC57xx family documentation; RoHS compliant per distributor listings. Halogen-free status not specified in retrieved distributor snippets; engineers should consult NXP's environmental compliance report for definitive status. Conflict-mineral compliance follows NXP's published CMRT filings.