STM32F103RBH7 - 72MHz 128KB Cortex-M3 MCU | STMicroelectronics
Teilenummer: STM32F103RBH7 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2.2277 | $2,23 |
| 10 | $2.2277 | $22,28 |
| 100 | $2.2277 | $222,77 |
| 500 | $2.2277 | $1.113,85 |
| 1.000 | $2.2277 | $2.227,70 |
STM32F103RBH7 Übersicht
A microcontroller is a programmable system-on-chip that integrates a processor core, memory, peripherals, and I/O into one device. The Cortex-M3 hierarchy places STM32F103RBH7 within ARM-based 32-bit embedded processors, microcontrollers, and the broader semiconductor category. It is suited to systems that require compact firmware execution, real-time control, and multiple serial interfaces without using a larger application processor.
The verified part data specifies 32-bit processing, a 72 MHz maximum frequency, and 128 KB organized as 128K x 8 Flash. One distributor result also describes a wide I/O selection and available connectivity including USB, CAN, LIN, I2C, and SPI. These interfaces make the device useful when several peripheral buses must coexist. Exact peripheral counts, voltage ranges, RAM capacity, GPIO count, package dimensions, and electrical limits were not supplied in the provided data and therefore remain unconfirmed here.
The STM32F103RBH7 is positioned for embedded control, communication gateways, instrumentation, and compact automation modules. Its 128 KB Flash footprint provides room for boot code, application logic, and communication handlers, while the 72 MHz Cortex-M3 core provides computational headroom for control loops. Firmware planning must nevertheless include the device's actual RAM, interrupt map, peripheral variants, clock limits, and pin multiplexing after those values are confirmed from the manufacturer datasheet.
PCB design should provide a regulated supply, decoupling capacitors, ground-plane continuity, and clean routing for external interfaces. Because the verified package is a 64-pin TFBGA, assembly and inspection require a land pattern and via arrangement suitable for fine-pitch BGA construction. Do not substitute a package drawing from an LQFP STM32F103 variant, because the STM32F103RBH7 listing explicitly identifies TFBGA rather than LQFP.
This data page consolidates exact distributor listings, availability and pricing references, package information, interface context, and replacement-analysis limits for the STM32F103RBH7. Unverified technical values are deliberately identified as missing rather than inferred. Engineers should use the manufacturer datasheet for final pin assignments, timing, electrical characteristics, memory, errata, and qualification decisions before release to production.
Drop-in-Alternativen für STM32F103RBH7 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
Für dieses Produkt sind keine Drop-in-Alternativen verfügbar.
Alternativen anfordernSTM32F103RBH7 Grenzwerte & elektrische Eigenschaften
| Manufacturer | STMicroelectronics |
| Product Type | 32-bit ARM microcontroller |
| Processor Core | ARM Cortex-M3 |
| Word Size | 32 bit |
| Maximale Taktfrequenz | 72 MHz |
| Flash Memory | 128 KB (128K x 8) |
| Series | STM32F1 performance line |
| Gehäuse | 64-TFBGA (5 x 5 mm) |
| I2C Interfaces | 2 channels |
| SPI Interfaces | 2 channels |
| Available Connectivity | USB, CAN, LIN, I2C, SPI |
| Montageart | Surface mount |
STM32F103RBH7 64-tfbga (5 x 5 mm) Pinbelegungsleitfaden
Pinbelegung für STM32F103RBH7 (64-tfbga (5 x 5 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für STM32F103RBH7.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
STM32F103RBH7 ist geeignet für 6 Anwendungs: Vehicle Gateway Node, Industrial Automation Controller, USB Communication Controller, CAN Communication Module, Sensor Acquisition Hub, Serial Protocol Bridge.
Vehicle Gateway Node
STM32F103RBH7 fits an early vehicle gateway evaluation because the verified feature set includes a 72 MHz Cortex-M3 core, 128 KB Flash, and connectivity identified as USB, CAN, LIN, I2C, and SPI. The MCU can coordinate diagnostic traffic and peripheral routing while its 64-TFBGA package limits board area. Before production use, verify supply voltage, automotive temperature grade, transceiver interfaces, ESD requirements, and AEC-Q100 status; those qualification details were not provided.
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Industrial Automation Controller
The STM32F103RBH7 is a candidate for compact automation because its 72 MHz Cortex-M3 core provides control-processing headroom and the available interface set includes I2C, SPI, CAN, LIN, and USB. Two I2C and two SPI channels can connect sensors, actuators, and service peripherals. Firmware and BOM decisions still require confirmation of RAM, GPIO, timers, ADC, operating voltage, temperature range, and industrial qualification from the manufacturer datasheet.
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USB Communication Controller
STM32F103RBH7 can support a compact USB-capable embedded controller because the verified connectivity list includes USB alongside I2C and SPI. Its 128 KB Flash provides a defined firmware-storage budget for protocol handling, configuration storage, and diagnostics, while the Cortex-M3 core operates up to 72 MHz. USB electrical compliance still requires the correct transceiver, routing, protection, firmware stack, and detailed peripheral verification; only the MCU capability is confirmed here.
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CAN Communication Module
The STM32F103RBH7 is suitable for evaluation as the control MCU in a CAN-connected module because CAN is explicitly listed among available connectivity and the Cortex-M3 core reaches 72 MHz. It can run message filtering, protocol tasks, and local control while external transceivers provide the physical bus interface. The application must be qualified for bit timing, transceiver standby behavior, bus protection, isolation needs, temperature range, and EMC performance; those electrical details require datasheet verification.
Empfohlen
Sensor Acquisition Hub
STM32F103RBH7 can serve as a sensor-hub controller when the board uses I2C or SPI sensors and local processing must fit a compact 5 x 5 mm TFBGA footprint. The two-channel I2C and two-channel SPI availability described in the verified results allows multiple digital sensors to share the MCU, although exact simultaneous-channel limitations must be checked in the datasheet. ADC resolution, sampling capability, RAM, timing, and sensor-specific timing were not supplied and require confirmation.
Empfohlen
Serial Protocol Bridge
The STM32F103RBH7 can implement a protocol bridge using the verified availability of two SPI channels, two I2C channels, CAN, LIN, USB, and UART-class integration listed elsewhere in connectivity descriptions. Its 72 MHz Cortex-M3 core can handle framing and routing among multiple bus domains, while 128 KB Flash sets the application-storage ceiling. Production design requires exact peripheral inventory, DMA channels, pin multiplexing, bootloader behavior, and supported development tools.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für STM32F103RBH7 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt |
|---|---|
| Brand | STMicroelectronics |
| Package | 64-TFBGA (5 x 5 mm) |
| Processor Core | ARM Cortex-M3 |
| Maximum Clock | 72 MHz |
| Flash Memory | 128 KB |
| Word Size | 32 bit |
| I2C Interfaces | 2 channels |
| SPI Interfaces | 2 channels |
| Verified Connectivity | USB, CAN, LIN, I2C, SPI |
Wichtigste Unterscheidungsmerkmale
- Exact compact 64-TFBGA package identification (vs. Cited GD32F103 LQFP alternatives)
- 72 MHz verified Cortex-M3 performance target (vs. Cited GD32F103 claim)
- 128 KB Flash with broad serial-connectivity context (vs. STM32L151RBH6A comparison page)
Designhinweise
Treat the 64-TFBGA footprint as a fine-pitch BGA layout problem rather than adapting an LQFP64 drawing. Place the MCU close to its supply decoupling, preserve an uninterrupted ground reference, route sensitive interfaces away from switching nodes, and obtain the exact ball map and recommended land pattern from STMicroelectronics. Confirm via-in-pad, solder-mask, assembly, and inspection capabilities before committing the PCB to volume production.
Verify all STM32F103RBH7 supply pins, voltage domains, decoupling values, and sequencing requirements from the exact R-package datasheet because those electrical details were not supplied. Use low-impedance supply and ground planes, place required bulk and high-frequency decoupling at the relevant pins, and measure startup and operating current on final hardware. Do not infer a 3.3 V limit solely from the STM32F103 family name.
The most common sourcing error is treating an LQFP STM32F103 or GD32F103 pin-compatible claim as a replacement for this 64-TFBGA device. The cited cross-brand compatibility information concerns LQFP48 and LQFP64 parts, and one source notes a 108 MHz versus 72 MHz clock difference. Validate mechanical compatibility, pin multiplexing, peripherals, clock configuration, bootloader behavior, and firmware before approving any substitution.
For CAN, LIN, USB, I2C, or SPI routes, define edge-rate and topology requirements before assigning pins. Keep sensitive lines short, provide continuous reference planes, place termination or pull networks where the relevant standard requires them, and separate clocks or high-current switching paths from communication nets. The supplied data confirms interface availability but does not provide pin muxing or recommended layouts, so the manufacturer reference design should guide implementation.
Compliance-Informationen
The supplied verified data does not include RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations for this exact MPN. Compliance must be confirmed using the manufacturer declaration or distributor documentation.