STM32L4S9ZIJ6 - 120MHz 2MB Cortex-M4 MCU | STMicroelectronics
Teilenummer: STM32L4S9ZIJ6 ✗ AbgekündigtSTM32L4S9ZIJ6 Übersicht
An ultra-low-power microcontroller is a semiconductor that balances processing performance with minimized energy consumption. The STM32L4+ architecture integrates an Arm Cortex-M4 RISC core, embedded Flash, RAM, analog and digital peripherals, and security-oriented control functions. This places the STM32L4S9ZIJ6 in the hierarchy of embedded microcontroller, 32-bit MCU, Arm Cortex-M4 MCU, and energy-efficient power-management application.
The primary verified features include a 120 MHz operating frequency, 2 MB of Flash storage, USB OTG, DFSD, a 3 V supply indication, and a 144-UFBGA package measuring 10 x 10 mm. The 120 MHz Cortex-M4 core provides substantially greater compute headroom than lower-frequency microcontrollers for control workloads, while the 2 MB Flash capacity supports larger firmware, data logging, and protocol stacks. USB OTG can simplify direct host, device, and peripheral connectivity when the required board-level implementation is provided.
The STM32L4S9ZI product family is positioned for energy-sensitive embedded systems. Its Arm Cortex-M4 core supports efficient control processing, while integrated peripherals can reduce the need for discrete components in industrial, communications, sensing, and human-interface designs. Exact RAM capacity, analog converter performance, operating-temperature limits, supply-voltage limits beyond the verified 3 V indication, and individual peripheral configurations are not present in the supplied source excerpts.
Typical uses include industrial monitoring equipment, USB-connected data-acquisition units, low-power embedded controllers, sensor-hub designs, and compact communication equipment. The 112 reported I/O positions provide extensive connectivity for sensors, actuators, communications, and human-interface signals, while the compact 10 x 10 mm UFBGA package supports space-constrained designs that can be assembled with appropriate manufacturing processes.
Designers should verify the exact pin assignments, exposed-pad connection, decoupling requirements, clock configuration, boot options, and peripheral routing against the official STM32L4S9ZI documentation before layout. A 144-ball footprint also requires careful escape routing and adequate thermal management because dense UFBGA assembly can limit repairability and complicate inspection.
This product record consolidates verified distributor specifications, manufacturer-family information, commercial availability references, and defensible cross-reference findings. It also distinguishes true same-footprint alternatives from related devices that require different packages or firmware validation, helping engineers shorten component-selection and sourcing work.
Drop-in-Alternativen für STM32L4S9ZIJ6 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
STM32F423ZHJ6
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
STM32L476JEY6VTR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
STM32L4S9ZIJ6 Grenzwerte & elektrische Eigenschaften
| Product Type | 32-bit ultra-low-power microcontroller |
| CPU Core | Arm Cortex-M4 with FPU |
| Maximum CPU Frequency | 120 MHz |
| Instruction Set | 32-bit Arm RISC |
| Flash Memory | 2 MB (2M x 8) |
| USB Interface | USB OTG |
| DFSD Support | Yes |
| General-Purpose I/O | 112 I/O |
| Nominal Supply Voltage | 3 V |
| Gehäuse | 144-UFBGA (10 x 10 mm) |
| Pin-Anzahl | 144 pins |
| Montageart | Surface Mount |
| Series | STM32L4+ Series, STM32L4S9ZI family |
| RoHS-Status | unknown |
| REACH Status | unknown |
STM32L4S9ZIJ6 144-ufbga (10 x 10 mm) Pinbelegungsleitfaden
Pinbelegung für STM32L4S9ZIJ6 (144-ufbga (10 x 10 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für STM32L4S9ZIJ6.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
STM32L4S9ZIJ6 ist geeignet für 6 Anwendungs: USB Connected Data Acquisition, Industrial Sensor Hub, Low-Power Environmental Monitor, DFSD Storage Control, Human Interface Controller, Embedded Communication Controller.
USB Connected Data Acquisition
The STM32L4S9ZIJ6 suits compact USB-connected acquisition equipment because its verified specifications include a 120 MHz Arm Cortex-M4 core, 2 MB of Flash, USB OTG, and 112 I/O. The Cortex-M4 FPU supports signal-processing workloads, while the large peripheral complement can accommodate sensors, counters, and status lines around a USB interface. A practical architecture places the MCU beside sensor front ends, connects USB through the required transceiver and connector implementation, and retains USB firmware in the 2 MB Flash region. Compared with a low-frequency MCU, the 120 MHz core provides more headroom for filtering, calibration, and protocol handling. The UFBGA-144 footprint also supports dense boards, although designers must plan escape routing, decoupling, exposed-pad thermal management, and firmware-compatible USB clock configuration before release.
Empfohlen
Industrial Sensor Hub
The STM32L4S9ZIJ6 is suitable for industrial sensor aggregation where a controller must combine several low-speed sensors with local data processing. Its 112 reported I/O positions provide substantial connectivity for digital sensor channels, interrupt lines, status indicators, and actuators, while the 120 MHz Cortex-M4 core can filter and prepare measurements before they are transmitted. The 2 MB Flash capacity is useful for firmware, calibration tables, and communication stacks. In a typical installation, the MCU samples sensor inputs, applies digital compensation, and records events locally before sending data through USB or another serial interface. Because the verified excerpts do not specify the exact ADC ratings or operating-temperature limits, analog front-end selection and environmental qualification must remain separate engineering decisions. Firmware should also use low-power modes where appropriate rather than assuming a specific current figure not provided in the source data.
Empfohlen
Low-Power Environmental Monitor
The STM32L4S9ZIJ6 fits battery-operated environmental monitoring because STMicroelectronics positions the STM32L4S9ZI family as ultra-low-power and provides both a 120 MHz Cortex-M4 core and 2 MB Flash. The high clock rate allows the device to complete sensor readings, filtering, and local event processing quickly, which can help the system spend more time in a low-energy state. Its 112 I/O positions can support environmental sensors, radio-control signals, status indicators, and recovery inputs. A typical product would sample temperature, humidity, gas, or motion sensors, store calibration and event data in local memory, and transmit results through a communications module. The exact sleep currents and wake-up timing are not available in the supplied excerpts, so battery-life calculations must use the manufacturer datasheet rather than estimated numbers. Firmware validation should include wake sources, sensor-settling intervals, and data-retention behavior.
Empfohlen
DFSD Storage Control
The STM32L4S9ZIJ6 is applicable to embedded systems that need local file-based storage because the verified product description explicitly identifies DFSD capability alongside a 120 MHz Cortex-M4 core and 2 MB Flash. The MCU can coordinate a memory card or external storage interface, maintain file structures, and exchange information with a host. Its 112 I/O positions provide room for card-related control signals, status LEDs, user inputs, and communications. In an implementation, application firmware would configure the supported DFSD interface, manage file access through the appropriate peripheral library, and coordinate writes with power-loss-sensitive data handling. The actual supported card characteristics, bus width, transfer rates, and pin mapping are not supplied in the excerpts and therefore should not be inferred. Hardware layout should preserve the manufacturer's recommended impedance, decoupling, and signal-routing guidance, while firmware should use safe shutdown procedures before power removal.
Empfohlen
Human Interface Controller
The STM32L4S9ZIJ6 can serve as the central controller in a compact industrial or medical-device user interface because it combines a 120 MHz Cortex-M4 processor with 112 I/O positions. Buttons, indicators, encoders, displays, and communication transceivers can be managed from one low-power MCU. The 2 MB Flash provides room for interface firmware, fonts, diagnostic logic, and communication protocols, while the FPU assists with smoothing and scaling operations. A practical implementation would debounce controls, update indicators, manage alarms, and relay commands to a communications interface. The UFBGA-144 package supports dense integration but requires careful escape routing and assembly capability. Because the supplied data does not verify the exact LCD, touch-controller, or USB transceiver integration requirements, those companion components must be selected from the final schematic and pin assignment rather than implied by the MCU designation.
Empfohlen
Embedded Communication Controller
The STM32L4S9ZIJ6 is well suited to protocol-heavy embedded communications because the verified specification provides a 120 MHz Arm Cortex-M4 core, 2 MB Flash, USB OTG, and extensive I/O. Protocol processing, packet handling, status monitoring, and local data buffering can run on the Cortex-M4 FPU, while USB OTG provides a direct interface path where the board implementation supports the required USB roles. The 112 reported I/O positions allow connection to radios, transceivers, status LEDs, and service interfaces. In a practical design, the MCU frames messages, controls the external communications device, and monitors activity through interrupt-capable pins. The source data does not provide Ethernet MAC, CAN, or transceiver capabilities, so those functions should not be assumed without checking the exact STM32L4S9ZI variant documentation. Firmware qualification should cover timing margins, packet loss, brownout behavior, and restart-state recovery.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für STM32L4S9ZIJ6 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | STM32F423ZHJ6 | STM32L476JEY6VTR |
|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | 144-UFBGA (10 x 10 mm) | 144-UFBGA | 144-UFBGA |
| Product Series | STM32L4+ Series | STM32F4 family | STM32L4 family |
| CPU Core | Arm Cortex-M4 with FPU | Arm Cortex-M4 with FPU | Arm Cortex-M4 with FPU |
Wichtigste Unterscheidungsmerkmale
- Verified 2 MB Flash capacity (vs. STM32F423ZHJ6)
- Ultra-low-power STM32L4+ family positioning (vs. STM32F423ZHJ6)
- Large 144-UFBGA integration and 112 reported I/O (vs. STM32L476JEY6VTR)
- Verified DFSD and USB OTG feature combination (vs. STM32L476JEY6VTR)
Designhinweise
Plan the 144-UFBGA escape routing before committing to the board layout. Keep high-speed signals short, provide continuous ground references, follow the manufacturer's ball and thermal-pad requirements, and reserve fabrication and assembly capability for this dense package. The supplied excerpts establish the 10 x 10 mm package but do not include the recommended land pattern, so the official package drawing must control dimensions and exposed-pad treatment.
Do not treat the verified 3 V description as a complete operating range. Determine minimum, maximum, and regulated supply limits for the exact temperature grade from the manufacturer documentation, then size local decoupling for the selected power architecture. Validate brownout, startup sequencing, and USB suspend behavior in hardware because these values and timing requirements are not present in the supplied data.
A matching UFBGA outline alone does not guarantee a drop-in substitution. The STM32F423ZHJ6 and STM32L476JEY6VTR require checks of pin multiplexing, clock sources, USB configuration, DFSD routing, memory organization, peripheral availability, bootloader behavior, and firmware initialization. Perform a symbolic pin comparison and run the existing application against the candidate before approving it as a production alternative.
Thermal performance depends on the internal and external copper implementation as well as ambient temperature. Use the official exposed-pad and via-array guidance, verify the assembled land pattern, and measure junction-temperature rise under worst-case processing and USB activity. No thermal resistance or maximum junction temperature is included in the supplied excerpts, so an estimated thermal result must not be treated as a device specification.
Compliance-Informationen
The supplied excerpts do not contain manufacturer declarations for RoHS, REACH, AEC-Q100, lead-free status, halogen-free status, or conflict minerals. The ETEI comparison pages are listed as data sources, but their compliance details were not included in the retrieved snippets.