SVF312R3K1CKU2 - Vybrid VF3xxR 1.5MB SRAM 266MHz | NXP
Teilenummer: SVF312R3K1CKU2 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.75 | $167,50 |
| 100 | $14.2 | $1.420,00 |
| 500 | $12.1 | $6.050,00 |
| 1.000 | $10.55 | $10.550,00 |
SVF312R3K1CKU2 Übersicht
A microprocessor is a single-chip CPU subsystem that integrates a processing core, memory controllers, peripherals, and I/O. The Vybrid family sits within NXP's automotive/industrial processor portfolio between traditional MCUs and higher-end application processors, designed to combine MPU-class GUI capability with MCU-class deterministic real-time control.
Key features include dual-core heterogeneous architecture (Cortex-A5 + Cortex-M4), 1.5MB on-chip SRAM, integrated LCD controller for instrument cluster displays, dual 12-bit ADCs for analog sensor acquisition, and a wide peripheral set including CAN, LIN, Ethernet, and FlexRay. The Cortex-A5 runs the HMI/OS layer while the Cortex-M4 handles time-critical motor/sensor control, eliminating the need for a separate companion MCU.
Architecturally the VF3xxR uses NXP's heterogeneous multicore platform with hardware semaphore-based inter-core communication, shared SRAM, and dedicated peripheral bus access for each core. The Cortex-A5 runs the rich-OS stack; the Cortex-M4 runs an RTOS or bare-metal firmware, with deterministic interrupt latency for safety-critical cluster functions.
Typical applications include automotive instrument clusters, entry-level infotainment head units, industrial HMI panels, body controller gateways, and telematics control units. The combination of cluster graphics capability plus real-time control makes it purpose-built for cost-sensitive connected dashboards.
When designing with this device, allocate boot configuration via the boot mode pins early, and ensure both cores' firmware images are managed in the flash partition layout. Power sequencing must respect the A5/M4 power domain requirements documented in the reference manual.
This page synthesizes distributor pricing, drop-in alternatives from the same Vybrid family, and practical design notes not found in the manufacturer datasheet. Specifications last verified against NXP product page on 2026-10-17.
Drop-in-Alternativen für SVF312R3K1CKU2 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
SVF312R3K2CKU2
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
SVF322R3K1CKU2
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
SVF311R3K2CKU2
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCIMX6L2EVN10AB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SVF312R3K1CKU2 Grenzwerte & elektrische Eigenschaften
| Core Architecture | ARM Cortex-A5 + ARM Cortex-M4 (heterogeneous dual-core) |
| Family | Vybrid VF3xxR |
| Core Count | 2 (1x A5 + 1x M4) |
| Datenbusbreite | 32-bit |
| Maximum CPU Frequency | 266 MHz |
| On-chip SRAM | 1.5 MB |
| On-chip Flash | ROMless (external flash required) |
| Versorgungsspannung | 3.3 V (typical I/O) |
| Package Type | 176-HLQFP (24x24 mm) |
| Package Code | HLFQFP |
| Terminal Form | GULL WING |
| Number of Terminals | 176 |
| Temperature Grade | INDUSTRIAL |
| Montageart | Surface Mount |
| Application Domain | Automotive instrument clusters, entry-level infotainment |
SVF312R3K1CKU2 hlfqfp Pinbelegungsleitfaden
Pinbelegung für SVF312R3K1CKU2 (hlfqfp-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für SVF312R3K1CKU2.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
SVF312R3K1CKU2 ist geeignet für 6 Anwendungs: Automotive Instrument Cluster, Entry-Level Infotainment Head Unit, Industrial HMI Control Panels, Body Controller Gateway, Telematics Control Unit (TCU), Connected Radio Base Unit.
Automotive Instrument Cluster
The SVF312R3K1CKU2 is purpose-built for automotive instrument cluster applications per NXP's product page. The Cortex-A5 core runs the cluster graphics and connectivity stack with up to 266MHz performance, while the Cortex-M4 real-time co-processor handles gauge stepper motor control, warning lamp driving, and CAN message processing with deterministic interrupt latency. The 1.5MB on-chip SRAM supports full graphical gauge animations without external memory, and the integrated LCD controller directly drives TFT cluster displays. The dual-core architecture eliminates the need for a companion MCU, reducing PCB area and BOM cost for cost-sensitive cluster designs that still require ASIL-relevant real-time behavior.
Empfohlen
Entry-Level Infotainment Head Unit
The SVF312R3K1CKU2 supports entry-level infotainment head units that need both rich application processing and real-time control without the cost of higher-tier application processors. The Cortex-A5 core runs the infotainment OS (typically Linux or QNX) and handles Bluetooth, Wi-Fi, and radio DSP tasks, while the Cortex-M4 manages audio mixing, volume control, and HVAC actuator timing. The 176-HLQFP package provides the pin count needed for dual CAN-FD, Ethernet AVB, external DRAM, and parallel NAND flash interfaces typically required by mid-range head units.
Empfohlen
Industrial HMI Control Panels
The SVF312R3K1CKU2 is suitable for industrial HMI control panels that combine a graphical touchscreen interface with real-time machine control. The Cortex-A5 runs the HMI graphics stack with LVDS/RGB display support and web-based configuration UIs, while the Cortex-M4 handles real-time EtherCAT or CANopen communication with motor drives and I/O modules. Industrial temperature variants of the Vybrid VF3xxR extend the operating range to factory floor conditions. The 1.5MB SRAM allows complex GUI screens with alpha-blended graphics without external framebuffer memory, simplifying PCB layout.
Empfohlen
Body Controller Gateway
The SVF312R3K1CKU2 fits automotive body controller gateway applications where multiple in-vehicle networks (CAN, LIN, FlexRay) must be bridged and routed. The Cortex-A5 runs the gateway routing logic and diagnostic services including UDS over CAN-FD and DoIP over Ethernet, while the Cortex-M4 manages LIN master scheduling and low-speed body network timing. The wide peripheral set of the VF3xxR family supports up to 6 CAN-FD channels plus Ethernet MAC for central gateway architectures in modern vehicles.
Empfohlen
Telematics Control Unit (TCU)
The SVF312R3K1CKU2 powers telematics control units that require cellular modem connectivity, GPS processing, and CAN bus diagnostics in a single SoC. The Cortex-A5 manages the cellular modem protocol stack, GNSS position calculation, and cloud connectivity, while the Cortex-M4 handles CAN bus monitoring, ignition sensing, and crash event logging with real-time guarantees. The 176-HLQFP package exposes the necessary pins for SDIO Wi-Fi modules, UART cellular modems, and SPI GPS receivers commonly used in telematics designs.
Empfohlen
Connected Radio Base Unit
The SVF312R3K1CKU2 serves as the host processor in connected radio base units where basic radio tuning plus smartphone-mirroring and voice assistant features are required. The Cortex-A5 runs the connected radio stack with Bluetooth hands-free, Wi-Fi hotspot, and basic smartphone projection protocols, while the Cortex-M4 handles real-time audio routing and RDS decoding. The reduced cost-down variant SVF311R3K2CKU2 in the same footprint offers the lower SRAM option for entry-level radios. The platform supports both analog and digital radio standards with flexible peripheral routing.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für SVF312R3K1CKU2 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | SVF312R3K2CKU2 | SVF322R3K1CKU2 | SVF311R3K2CKU2 | MCIMX6L2EVN10AB |
|---|---|---|---|---|---|
| Package | 176-HLQFP (24x24 mm) | 176-HLQFP (24x24 mm) - same | 176-HLQFP (24x24 mm) - same | 176-HLQFP (24x24 mm) - same | 176-LQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | Cortex-A5 + Cortex-M4 (heterogeneous) | Cortex-A5 + Cortex-M4 | Cortex-A5 + Cortex-M4 | Cortex-A5 + Cortex-M4 | Cortex-A7 single-core |
| Max CPU Frequency | 266 MHz (Cortex-A5) | 266 MHz | 266 MHz | 266 MHz | 528 MHz |
| On-chip SRAM | 1.5 MB | 1.5 MB | 1.5 MB | 1 MB (reduced) | 128 KB L2 cache |
| Core Count | 2 (1x A5 + 1x M4) | 2 (1x A5 + 1x M4) | 2 (1x A5 + 1x M4) | 2 (1x A5 + 1x M4) | 1 (single-core A7) |
| On-chip Flash | ROMless | ROMless | ROMless | ROMless | ROMless |
| Target Application | Instrument cluster | Instrument cluster (extended peripherals) | Entry infotainment / cluster | Connected radio | General-purpose MPU |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Industrial |
Wichtigste Unterscheidungsmerkmale
- Heterogeneous dual-core A5+M4 architecture (vs. MCIMX6L2EVN10AB (i.MX6 single-core Cortex-A7))
- 1.5MB on-chip SRAM for full graphical cluster without external memory (vs. SVF311R3K2CKU2 (cost-down variant))
- Purpose-built for automotive instrument clusters (vs. General-purpose i.MX6 application processors)
Designhinweise
Estimated: The SVF312R3K1CKU2 Vybrid VF3xxR requires multiple voltage rails (typically 1.2V core, 1.5V DDR3L, 3.3V I/O) with specific sequencing per the NXP reference manual. Use a dedicated multi-rail PMIC such as the PF0100 or PF3000 to ensure proper power-up sequencing between the Cortex-A5 and Cortex-M4 power domains. Inrush current at cold boot can exceed 1A on the core rail, so bulk decoupling of at least 47uF ceramic plus 220uF electrolytic is recommended at the PMIC output. Do not power the Cortex-A5 domain before the Cortex-M4 domain is stable, or inter-core communication will fault.
The 176-HLQFP package has limited thermal dissipation. At 266MHz on both cores with full peripheral activity, junction temperature can rise 30-40C above ambient on the standard 4-layer JEDEC test board. For automotive instrument cluster designs with elevated ambient (cabin temperatures up to 85C), provide a copper pour of at least 2 square inches on the top layer beneath the package, plus thermal vias to an internal ground plane. The package's exposed pad (if present) should be soldered to the ground pad for maximum heat transfer.
Route the DDR3L external memory bus with matched-length traces (within 25 mils) and 50-ohm controlled impedance. The Vybrid VF3xxR DRAM controller expects fly-by topology with termination at the DRAM chip. Keep the LCD data/clock traces short and impedance-matched to avoid display artifacts at high color depths. Place the external flash memory as close as possible to the QSPI/parallel bus pins to minimize boot time and reduce EMI. Provide a JTAG header (10-pin ARM standard) accessible at the board edge for debug access.
Common pitfalls when designing with the SVF312R3K1CKU2: (1) Forgetting to configure the boot mode pins before reset release will leave the part in serial downloader mode; (2) Sharing external memory bus between A5 and M4 firmware images requires careful linker script partition management; (3) The Cortex-M4 real-time core must be initialized BEFORE the Cortex-A5 OS starts, or shared SRAM access will fault; (4) Do not assume the part is pin-compatible with the i.MX6 series even though both use 176-LQFP - the peripheral pinout differs significantly.
Compliance-Informationen
Compliance information not present in the verified web data; recommend confirming with the manufacturer datasheet or your NXP representative. The part is automotive-targeted and typically supplied as RoHS-compliant lead-free, but official certification status was not confirmed from the retrieved data.
