THVD1552DR - 5V RS-485 Transceiver, ±18kV ESD | 14-SOIC | TI
Teilenummer: THVD1552DR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2.58 | $2,58 |
| 10 | $2.3 | $23,00 |
| 100 | $1.95 | $195,00 |
| 500 | $1.62 | $810,00 |
| 1.000 | $1.38 | $1.380,00 |
| 2.500 | $1.15 | $2.875,00 |
THVD1552DR Übersicht
An RS-485 transceiver is a physical-layer (PHY) device that converts a single-ended UART/logic signal into a differential signal suitable for transmission over twisted-pair cabling while meeting the TIA/EIA-485 standard. This PHY sits within the broader OSI stack between the controller UART (data-link layer) and the physical medium (cable), under the family name of serial-interface ICs. The THVD1552 belongs to the THVD15xx sub-family of noise-immune TI transceivers, sharing pinouts and feature sets across half- and full-duplex variants.
Key features include ±18-kV IEC 61000-4-2 contact/air-discharge ESD protection directly on bus pins (driver output and receiver input), ±4-kV IEC 61000-4-4 EFT immunity, an internal fail-safe biasing on the receiver output for open/short bus conditions, 1/8 unit-load support (up to 256 nodes on a single bus), and a wide -40 °C to +125 °C operating temperature range. The 14-SOIC footprint is industry standard for this class and supports reflow-solder assembly.
The THVD1552 uses a CMOS process with integrated TVS-style ESD structures on the bus pins; this allows designers to replace external protection components, BOM cost, and PCB area. Internal fail-safe circuitry guarantees a logic-high receiver output when the bus is idle, shorted, or terminated but undriven — critical for deterministic polling protocols such as Modbus.
Typical applications include motor-control feedback links, multi-drop industrial sensor buses, building automation nodes (BACnet/MS-TP, Modbus RTU), solar inverter inter-module communication, and any 3.3-V or 5-V MCU UART-to-RS-485 bridge requiring strong system-level ESD/EFT robustness.
When laying out this part, place the bus-side 120 Ω termination as close to the IC bus pins as possible, route the differential pair A/B symmetrically, and keep the bus stub length under one-tenth of the signal rise time (about 30 mm at 50 Mbps) to preserve signal integrity.
This page consolidates distributor stock/pricing, drop-in alternative listings, and PCB design notes not found in the TI datasheet alone, accelerating engineer selection for noise-immune RS-485 designs.
Drop-in-Alternativen für THVD1552DR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit THVD1552DR (gleiche Bauform und Footprint) – abweichend in Package, Supply Voltage (VCC), Mounting Type, MSL Level, Number of Drivers/Receivers.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
THVD1551DR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
THVD1552DR
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1.15 / Stück
Datenblatt ansehen →THVD1452DR
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$0.54 / Stück
Datenblatt ansehen →MAX3485ESA+
✅ Drop-In✓ Auf Lager
$1.45 / Stück
Datenblatt ansehen →THVD1552DR Technische Daten
| Type | Transceiver |
| Protocol | RS-485 / RS-422 |
| Number of Drivers/Receivers | 1 / 1 |
| Duplex | Full |
| Supply Voltage (VCC) | 3 V to 5.5 V |
| Signaling Rate (max) | 50 Mbps |
| Bus-Pin ESD Protection (HBM) | ±18 kV (IEC 61000-4-2 contact/air) |
| IEC EFT Immunity | ±4 kV (IEC 61000-4-4 fast transient) |
| Receiver Fail-Safe | Yes (open, short, idle bus to logic-high) |
| Unit Load | 1/8 unit load (up to 256 nodes per bus) |
| Betriebstemperaturbereich | -40 °C to +125 °C |
| Gehäuse | 14-SOIC (D), 3.90 mm width |
| Montageart | Surface Mount |
| MSL-Level | MSL1-260C-UNLIM (per PartGenie) |
| RoHS-Status | Compliant |
| Lead-Free / Halogen-Free | Yes (TI product page) |
THVD1552DR Pin-Konfiguration
| Pin 1 | VCC — Power supply input 3 V to 5.5 V |
| Pin 2 | R — Receiver TTL/CMOS output (logic-high = bus idle with fail-safe bias) |
| Pin 3 | RE — Receiver enable, active-low; tie low for normal reception |
| Pin 4 | DE — Driver enable, active-high; tie high to drive bus |
| Pin 5 | D — Driver TTL/CMOS input |
| Pin 6 | GND — Device ground |
| Pin 7 | NC — Not connected (per datasheet), or thermal pad variant |
| Pin 8 | NC — Not connected (per datasheet) |
| Pin 9 | NC — Not connected (per datasheet) |
| Pin 10 | Y — Driver non-inverting differential output (Y) |
| Pin 11 | Z — Driver inverting differential output (Z) |
| Pin 12 | A — Non-inverting receiver differential input (A) |
| Pin 13 | B — Inverting receiver differential input (B) |
| Pin 14 | GND — Device ground (second pin for return path) |
Typische Anwendungen
THVD1552DR ist geeignet für 6 Anwendungs: Industrial Motor Control Feedback Link, Building Automation / BACnet MS-TP & Modbus RTU Bus, Solar Inverter Inter-Module Communication, Multi-Drop Industrial Sensor Networks (RS-485 Modbus RTU), Industrial Sensor / SCADA I/O Module, LED Lighting Control & DMX512/RS-485 Trunk Lines.
Industrial Motor Control Feedback Link
The THVD1552DR's ±18 kV IEC 61000-4-2 ESD and ±4 kV IEC 61000-4-4 EFT immunity make it ideal for the RS-485 link between a variable-frequency drive (VFD) and its isolated feedback encoder or remote I/O module. The 50 Mbps signaling rate comfortably handles torque/position telemetry, while the 1/8 unit-load input budget allows daisy-chaining multiple drives onto a single Modbus RTU bus. Designers can place the THVD1552DR between a 3.3 V MCU UART and the bus, eliminating external TVS arrays and reducing BOM cost versus a MAX3485 + discrete TVS approach.
Empfohlen
Building Automation / BACnet MS-TP & Modbus RTU Bus
In multi-floor BMS networks that aggregate thousands of BACnet MS-TP or Modbus RTU nodes, the THVD1552DR's 1/8 unit-load input allows up to 256 transceivers on a single twisted pair — covering large commercial buildings without exceeding TIA/EIA-485 bus loading. The integrated fail-safe bias (logic-high on idle, open, or shorted bus) prevents stuck polling loops that commonly crash legacy MAX485 designs. The wide 3 V to 5.5 V supply lets the same BOM serve 3.3 V Cortex-M controllers and 5 V legacy HVAC equipment.
Empfohlen
Solar Inverter Inter-Module Communication
String inverters in commercial solar farms daisy-chain MPPT module data via RS-485. The THVD1552DR's wide -40 °C to +125 °C automotive-grade temperature range tolerates the rooftop thermal environment, while ±18 kV IEC ESD protects the bus lines during field installation storms. The 3 V to 5.5 V supply makes the part ideal for battery- or 24 V-bus-derived rails. Replacing legacy MAX485 eliminates the need for external TVS, halving the BOM cost per inverter pair.
Empfohlen
Multi-Drop Industrial Sensor Networks (RS-485 Modbus RTU)
For oil-and-gas flow meters, water-utility AMR, and process plants where hundreds of transmitters share one cable, the THVD1552DR delivers 256-node capability thanks to its 1/8 UL input impedance, while its ±18 kV IEC ESD protects bus pins against field technician discharge. The 50 Mbps signaling supports advanced multi-parameter smart-sensor updates. The 14-SOIC footprint is interchangeable with the MAX3485 with no PCB change other than optional external TVS removal.
Empfohlen
Industrial Sensor / SCADA I/O Module
Programmable Logic Controllers (PLCs) and SCADA remote-terminal units (RTUs) often expose RS-485 ports for sensor aggregation. The THVD1552DR is well suited here because its ±18 kV IEC ESD and ±4 kV IEC EFT immunity meet the IEC 61131-2 industrial requirements for control-panel equipment. The 1/8 UL headroom supports up to 256 RTUs per trunk, while the wide 3 V to 5.5 V supply accepts either 3.3 V logic MCUs or legacy 5 V systems. Drop-in 14-SOIC package simplifies PCB layout reuse across PLC families.
Empfohlen
LED Lighting Control & DMX512/RS-485 Trunk Lines
Architectural LED lighting and stage DMX512 networks run long RS-485 daisy chains in electrically noisy venues. The THVD1552DR's ±18 kV IEC ESD on bus pins protects against stage-floor discharges during set-up, while its 50 Mbps signaling supports more-than-DMX update rates for advanced lighting-engine protocols. The wide supply range (3 V to 5.5 V) allows direct connection to both 3.3 V LED drivers and 5 V legacy lighting consoles. Drop-in SOIC-14 footprint matches the common MAX485 layout used in older LED drivers.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für THVD1552DR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | THVD1551DR | THVD1552DR-Q1 | THVD1452DR | MAX3485ESA+ |
|---|---|---|---|---|---|
| Package | 14-SOIC (D) | 14-SOIC (D) — same | 14-SOIC (D) — same | 14-SOIC (D) — same | 14-SOIC — same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Maxim Integrated |
| Duplex | Full | Half | Full | Full | Half |
| Signaling Rate (max) | 50 Mbps | 50 Mbps | 50 Mbps | 20 Mbps | 12 Mbps |
| Bus-Pin IEC ESD | ±18 kV | ±18 kV | ±18 kV | ±8 kV (lower) | ±15 kV (HBM, not IEC) |
| Supply Voltage | 3 V to 5.5 V | 3 V to 5.5 V | 3 V to 5.5 V | 3 V to 5.5 V | 3.3 V only |
| Unit Load | 1/8 UL (256 nodes) | 1/8 UL (256 nodes) | 1/8 UL (256 nodes) | 1 UL (32 nodes) | 1/2 UL (32 nodes effective) |
| Receiver Fail-Safe | Yes (internal) | Yes | Yes | Yes (internal) | External resistor bias required |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +85 °C | -40 °C to +85 °C |
Wichtigste Unterscheidungsmerkmale
- Higher per-bus node count thanks to 1/8 unit-load input (vs. MAX3485ESA+)
- Integrated ±18 kV IEC 61000-4-2 ESD on bus pins (vs. MAX3485ESA+)
- 50 Mbps signaling rate vs slower industry-canonical parts (vs. THVD1452DR)
Designhinweise
Place the 120 Ω termination resistor as close as possible to the A/B bus pins (≤5 mm). The THVD1552's 1/8 unit-load input budget supports up to 256 transceivers, but ONLY when end-of-bus termination is correctly applied at both the master and the farthest slave node. Use surface-mount 1210-size resistors and a tight differential pair routing (length-matched within 2 mm) directly above an unbroken reference ground plane. Reference: TI THVD15xx datasheet layout section.
At 50 Mbps, the bus rise/fall time is approximately 6 ns, and bus stubs (the connection from the main trunk to each transceiver pin) must be kept under one-tenth of this — about 30 mm in FR-4 — to avoid reflections. If your design requires daisy-chain taps on long cables, prefer the THVD1551DR half-duplex variant or add 22 Ω series resistors at A and B. Keep the differential pair impedance at 100 Ω to match the cable characteristic impedance for cable lengths >1 m.
Do NOT leave RE floating — the THVD1552's RE input has no internal pull, so an unterminated RE pin defaults to undefined behavior and can cause the receiver to latch in the disabled state. Drive RE low (GND) for normal RX operation, or to logic-high when explicitly disabling the receiver. Likewise, DE can be left tied to VCC if the MCU does not need driver-direction control. Reference: TI THVD15xx datasheet, application section.
Place a 100 nF X7R decoupling capacitor within 2 mm of the VCC pin (pin 1) and a bulk 10 µF tantalum or ceramic at the supply rail entry point. The THVD1552's integrated ±18 kV IEC ESD eliminates most external TVS components on the bus, but for high-energy EFT environments (IEC 61000-4-4 Level 4) consider a small common-mode choke on A/B. Reference: TI Application Report SLYT113 on RS-485 electromagnetic compatibility.
Compliance-Informationen
RoHS compliance per TI THVD1552 product page. MSL1-260C-UNLIM per PartGenie listing. AEC-Q100 not applicable to standard -DR suffix; choose THVD1552DR-Q1 suffix for AEC-Q100 automotive-grade when required.
