TLE7269GXUMA3 - Dual 20 kbaud LIN Transceiver | Infineon
Teilenummer: TLE7269GXUMA3 ✓ AktivTLE7269GXUMA3 Übersicht
A LIN transceiver is an interface integrated circuit that connects a microcontroller or other host to a low-speed serial network. LIN, meaning Local Interconnect Network, is a lower-cost vehicle-network architecture typically used for sensors, actuators, door modules, climate controls, and other distributed body-electronics functions. The broader hierarchy is LIN transceiver → automotive serial interface → interface IC → integrated circuit, with the transceiver handling physical-layer communication rather than application protocols or host processing.
The TLE7269GXUMA3 provides two stand-alone LIN channels, allowing one device to connect two LIN networks or two physical segments. Its supported data rate of up to 20 kbaud aligns with conventional LIN communication rates. The verified data also identifies 8 kV ESD robustness according to IEC 61000-4-2, optimized electromagnetic emission, and high immunity against interference. These characteristics are particularly relevant in automotive environments where cable routing, nearby powertrain systems, and external body connectors can expose the network to electrostatic discharge and electromagnetic coupling.
The part is described as an AEC-Q100 automotive LIN transceiver in a PG-DSO-14-62 package. The available distributor records identify a two-channel, full LIN-bus transceiver configuration with gull-wing leads and automotive temperature grade. The verified sources do not provide the complete electrical limit table, so details such as supply voltage, receiver thresholds, TXD logic levels, sleep-current consumption, and exact thermal limits must be confirmed in the manufacturer datasheet before schematic release or production qualification.
Typical uses include automotive body-domain modules, door and seat controllers, climate-control gateways, sensor nodes, ambient-lighting controllers, and LIN-to-CAN or LIN-to-MCU interface boards. The twin-channel arrangement can reduce component count when two independent LIN segments are required, although channel-specific enable, sleep, wake-up, and fault-management behavior must be verified in the full datasheet.
PCB design should preserve the LIN transceiver's automotive ESD and EMC performance. Keep the LIN bus and ground-return paths appropriately coupled, minimize loop area, follow the manufacturer's application-circuit layout, and provide verified supply and input-decoupling networks. Do not infer external protection-component values or bus termination details from search snippets; use the complete manufacturer datasheet and reference application guidance.
This page consolidates verified distributor listings, LIN standards support, automotive qualification information, package details, and practical sourcing guidance. It also distinguishes confirmed facts from unavailable specifications and avoids presenting unverified substitute parts as drop-in replacements.
Drop-in-Alternativen für TLE7269GXUMA3 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Für dieses Produkt sind keine Drop-in-Alternativen verfügbar.
Alternativen anfordernTLE7269GXUMA3 Technische Daten
| Product Type | Twin LIN transceiver |
| Number of Transceiver Channels | 2 channels |
| LIN Bus Configuration | Full LIN bus |
| Maximum LIN Transmission Rate | 20 kbaud |
| Supported LIN Specification | LIN 1.3, 2.0, and 2.1 |
| Automotive Network Standard | SAE J2602 |
| ESD Robustness | 8 kV according to IEC 61000-4-2 |
| Electromagnetic Emission | Optimized for low electromagnetic emission (EME) |
| Electromagnetic Immunity | Optimized for high immunity against interference |
| Automotive Qualification | AEC-Q100 |
| Temperature Grade | Automotive grade |
| Gehäuse | PG-DSO-14-62 |
| Package Type | 14-terminal gull-wing SOP surface-mount package |
| Pin Compatibility Reference | Compatible with TLE7259-2GE and TLE7259-2GU single LIN transceivers |
TLE7269GXUMA3 14-terminal gull-wing sop surface-mount package Pinbelegungsleitfaden
Pinbelegung für TLE7269GXUMA3 (14-terminal gull-wing sop surface-mount package-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für TLE7269GXUMA3.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
TLE7269GXUMA3 ist geeignet für 6 Anwendungs: Automotive Body-Control Gateway, Door and Seat Control Module, Climate-Control Node, Automotive Sensor and Actuator Hub, Ambient Lighting Controller, LIN-to-MCU Interface Board.
Automotive Body-Control Gateway
The TLE7269GXUMA3 fits body-control gateways that must connect two independent automotive LIN networks to a higher-level MCU or communications controller. Its two stand-alone channels can reduce the number of separate physical-layer devices needed when a module handles multiple distributed loads. The verified maximum rate of 20 kbaud matches conventional LIN operation, while the low-EME optimization and high interference immunity support electrically noisy vehicle environments. The PG-DSO-14-62 package also offers a compact solution, but the board should follow the manufacturer's recommended decoupling, grounding, and bus-protection layout. Exact supply voltage, channel enable logic, and diagnostic behavior require confirmation in the full manufacturer datasheet.
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Door and Seat Control Module
A door or seat module often connects distributed switches, motors, position sensors, and indicators over LIN. The TLE7269GXUMA3 can serve two bus segments when the module needs separate links for, for example, a door zone and a seat zone. Its confirmed 20 kbaud capability is appropriate for conventional LIN nodes, and the automotive-grade AEC-Q100 designation supports use in vehicle electronics. Its 8 kV IEC 61000-4-2 ESD rating is valuable when wiring reaches body connectors, although external protection may still be required. Engineers must verify operating-temperature limits, sleep currents, wake-up behavior, and the complete 14-pin function map before final schematic approval.
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Climate-Control Node
The TLE7269GXUMA3 is applicable to climate-control nodes that connect panel controls, temperature sensors, fan commands, or actuator modules through LIN. Two channels can support separate cabin and external-temperature networks without requiring two discrete transceiver packages, provided both segments use compatible bus rates and isolation requirements. The device's confirmed LIN 1.3, 2.0, and 2.1 and SAE J2602 compliance provides a solid basis for conventional automotive LIN networks. Low electromagnetic-emission optimization is beneficial when the harness shares space with switching loads. The design must still account for ESD, reverse-battery, supply transients, thermal conditions, and bus termination according to the complete Infineon documentation.
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Automotive Sensor and Actuator Hub
The TLE7269GXUMA3 can serve as the physical-layer interface in a compact hub for automotive sensors and actuators distributed around the passenger compartment. Its two stand-alone LIN channels allow one controller to manage more than one low-speed bus segment while reducing PCB component count. The verified 20 kbaud maximum rate and support for LIN 1.3, 2.0, and 2.1 are well matched to typical body electronics. AEC-Q100 qualification and 8 kV ESD robustness according to IEC 61000-4-2 strengthen its suitability for connected harnesses, while optimized electromagnetic emission helps reduce interference in shared wiring environments. Supply limits, exact thermal ratings, and sleep-state specifications remain unavailable in the supplied excerpts.
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Ambient Lighting Controller
A LIN-based ambient-lighting controller can use the TLE7269GXUMA3 when separate lighting zones or vehicle sections are organized as independent LIN networks. The dual-channel arrangement may simplify PCB routing compared with two single-channel devices while retaining a maximum communication rate of 20 kbaud. The transceiver's optimized low electromagnetic emission is particularly useful near PWM-controlled lighting electronics, and its confirmed high immunity helps preserve communication in the presence of vehicle electrical transients. The AEC-Q100 automotive classification supports body-electronics deployment. Before release, engineers should confirm the device's exact operating-temperature range, TXD and RXD logic levels, wake-up strategy, and whether the selected LED driver shares the relevant LIN bus ground reference.
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LIN-to-MCU Interface Board
The TLE7269GXUMA3 is suitable for a dedicated LIN-to-MCU interface board used during prototype development, bench validation, or a compact vehicle accessory module. Two physical LIN channels give the host MCU access to two networks through one IC, and the 20 kbaud rate is adequate for standard LIN communication. The PG-DSO-14-62 gull-wing package is practical for inspection and manual rework during development. For production implementation, designers should incorporate the manufacturer's recommended ESD protection, supply filtering, grounding, and LIN bus routing. The verified 8 kV IEC 61000-4-2 rating, automotive qualification, and optimized EMC behavior support robust implementation, but the complete electrical limits and diagnostic functions must be obtained before schematic sign-off.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für TLE7269GXUMA3 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt |
|---|---|
| Product Type | Twin LIN transceiver |
| Number of Channels | 2 |
| Maximum Data Rate | 20 kbaud |
| Package | PG-DSO-14-62 |
| Brand | Infineon Technologies |
| Automotive Qualification | AEC-Q100 |
| ESD Robustness | 8 kV according to IEC 61000-4-2 |
| Supported Standards | LIN 1.3, 2.0, 2.1 and SAE J2602 |
| Pin Compatibility Reference | TLE7259-2GE and TLE7259-2GU |
Wichtigste Unterscheidungsmerkmale
- Two LIN channels in one package (vs. TLE7259-2GE)
- Confirmed automotive network compliance (vs. Generic LIN transceiver)
- Documented high ESD robustness (vs. Generic LIN transceiver)
- Automotive-grade qualification (vs. Non-automotive LIN transceiver)
Designhinweise
Follow the manufacturer application-circuit layout when placing the TLE7269GXUMA3. Keep the LIN transceiver close to the bus connector or harness branch, minimize the distance from bus pins to any verified protection network, and route LIN and ground-return conductors together where practical. Do not substitute generic external protection values for the manufacturer recommendations because the verified excerpts do not provide the required bus capacitance, slew-rate, or protection-component details.
The device is explicitly optimized for low electromagnetic emission and high immunity against interference, but those characteristics depend on the complete PCB and harness implementation. Use the manufacturer reference layout, minimize loop area around the LIN connection, maintain a low-impedance return path, and avoid routing sensitive or high-current paths immediately beside the bus. Confirm conducted and radiated emissions using the applicable automotive test plan because the verified data does not provide numeric EME limits.
Do not treat the single-transceiver TLE7259-2GE or TLE7259-2GU compatibility statement as proof that either device is a functional drop-in replacement for this two-channel IC. A true substitute must reproduce the PG-DSO-14-62 land pattern, pin functions, channel count, electrical behavior, and automotive qualification. Also verify whether the two LIN channels require independent wake-up, sleep, fault, or enable management before finalizing the PCB and firmware.
Compliance-Informationen
The verified datasheet summary identifies AEC-Q100 qualification and 8 kV ESD robustness according to IEC 61000-4-2. RoHS, REACH, lead-free, halogen-free, and conflict-minerals declarations were not present in the supplied evidence.
