TLF12501AUMA1 - 60A OptiMOS Power Stage 16V PQFN | Infineon
Teilenummer: TLF12501AUMA1 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.2 | $7,20 |
| 10 | $6.55 | $65,50 |
| 100 | $5.9 | $590,00 |
| 500 | $5.4 | $2.700,00 |
| 1.000 | $4.95 | $4.950,00 |
TLF12501AUMA1 Übersicht
What is an integrated power stage? An integrated power stage is a semiconductor building block that combines the high-side FET, low-side FET, and gate driver into a single co-packaged IC, placed next to a buck controller IC in multiphase or high-current VR topologies. Within the power management hierarchy, power stages sit one level below the voltage regulator controller and one level above discrete MOSFETs, reducing parasitic loop inductance, shrinking PCB area, and simplifying thermal design compared with discrete implementations.
Key features of the TLF12501AUMA1 include AEC-Q100 automotive qualification, integrated bootstrap FET, adaptive dead-time control, tri-state PWM input compatibility, and a current-sense output for telemetry. The PQFN 5x6 package exposes a top-side thermal pad delivering a junction-to-PCB thermal resistance suitable for 60A continuous airflow-cooled designs. The driver's optimized gate timing and internal Schottky-diode clamping minimize switch-node ringing when layout guidelines are followed.
Architecturally, the TLF12501 uses Infineon's OptiMOS power-MOSFET technology co-packaged with a low-IQ driver core. The driver accepts 3.3V tri-state PWM logic from external controllers such as the IR35215, XDPE132G5C, or IR3581. Internal adaptive dead-time circuitry prevents shoot-through while minimizing body-diode conduction loss. The exposed top pad and bottom-side leads maximize heat extraction directly into the PCB copper.
Typical applications include server/datacenter VR buck converters, telecommunications 48V-to-point-of-load stages, automotive ADAS power rails, graphics card and GPU core voltage regulators, and high-current ASIC/FPGA POL supplies. The AEC-Q100 qualification makes it well suited for automotive ECU power trees requiring 60-90A peak transient capability.
When designing with this device, allocate a 4-layer PCB with at least 2 oz copper on top/bottom layers directly under the thermal pad. Place input capacitors within 2 mm of the VIN/PGND pins to suppress switch-node overshoot. Keep the BOOT capacitor trace short to limit rise-time losses. Source-sink current handling is symmetric, so the part is suitable for bidirectional telemetry and POL applications requiring fast transient response.
Drop-in-Alternativen für TLF12501AUMA1 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit TLF12501AUMA1 (gleiche Bauform und Footprint) – abweichend in Package, RoHS Status, Automotive Qualification, Input Voltage Range, Output Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
TLF11251LDXUMA1
✅ Drop-In✓ Auf Lager
$0.98 / Stück
Datenblatt ansehen →TLF44773LAXUMA1
✅ Drop-In✓ Auf Lager
$0.92 / Stück
Datenblatt ansehen →TLF12501AUMA1 Grenzwerte & elektrische Eigenschaften
| Product Type | Integrated Synchronous Buck Power Stage |
| Topologie | Synchronous Buck (co-packaged HS/LS MOSFET + driver) |
| Output Current (Continuous) | 60 A |
| Output Current (Peak) | 90 A |
| Eingangsspannungsbereich | 4.25 V to 16 V |
| Switching Frequency (max) | 2000 kHz |
| PWM Input Logic | Tri-state 3.3 V compatible |
| Ausgangsspannungsbereich | 0.225 V to 5.5 V (controller dependent) |
| Gehäuse | 36-PowerVFQFN (PQFN 5 x 6 mm) |
| Montageart | Surface Mount |
| Betriebstemperaturbereich | -40 C to +125 C |
| AEC-Q100 Qualification | Yes (automotive grade) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
| Integrated Bootstrap FET | Yes |
| Current Sense Output | Yes (IMON pin) |
TLF12501AUMA1 36-powervfqfn (pqfn 5 x 6 mm) Pinbelegungsleitfaden
Pinbelegung für TLF12501AUMA1 (36-powervfqfn (pqfn 5 x 6 mm)-Gehäuse). Dieses Leistungsbauteil verfügt über Gate-, Drain- und Source-Anschlüsse. Bei nicht gepolten Gehäusen entnehmen Sie die genaue Ausrichtung von Pin 1 und Footprint-Details dem Herstellerdatenblatt. Typische Anwendungen sind Netzteilentwurf, Motoransteuerung und Lastschaltung.
Keine detaillierten Pinbelegungsdaten verfügbar für TLF12501AUMA1.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
TLF12501AUMA1 ist geeignet für 6 Anwendungs: Server & Datacenter VR Buck Converters, Telecom 48V-to-Point-of-Load Stages, Automotive ADAS Power Rails, Graphics Card / GPU Core Voltage Regulators, High-Current ASIC / FPGA POL Supplies, Industrial High-Power Motor Drive Auxiliary Rails.
Server & Datacenter VR Buck Converters
The TLF12501AUMA1's 60 A continuous and 90 A peak output make it well suited for server and datacom VR buck rails driving CPUs, GPUs, and ASICs. When paired with a VR13/VR14 controller such as the IR35215, it forms a multiphase point-of-loop stage with switching frequencies up to 2 MHz. The integrated driver/MOSFET co-package cuts loop inductance by an order of magnitude versus discrete FETs, reducing switch-node overshoot and improving efficiency above 90% at 12 V-to-1.8 V conversion. AEC-Q100 qualification is a bonus for hyperscale designs that also target edge-server and automotive-rack platforms.
Empfohlen
Telecom 48V-to-Point-of-Load Stages
In telecom intermediate-bus architectures, the TLF12501AUMA1 can be deployed on the second stage after a 48V-to-12V isolated bus converter to deliver 60 A directly to ASIC rails. Its 4.25-16V VIN window is compatible with standard 12V buses, while the integrated bootstrap FET removes one external component and shrinks the BOM. The IMON output supports per-phase current sharing in multiphase implementations, and the PQFN 5x6 footprint with top-side thermal pad allows compact lateral airflow designs. Designers should allocate at least 2 oz copper on the top layer under the thermal pad for 60 A continuous operation.
Empfohlen
Automotive ADAS Power Rails
The TLF12501AUMA1's AEC-Q100 qualification and 4.25-16V VIN range make it ideal for automotive ADAS power trees supplying radar, lidar, and high-resolution camera SoCs. The 60 A continuous rating handles transient load steps during sensor burst processing, while the -40 C to +125 C operating temperature meets under-hood and cabin-electronics requirements. The integrated adaptive dead-time control prevents shoot-through during cold-crank events when VIN sags below 6 V. Pairing the stage with a fault-tolerant controller supports ASIL-B functional-safety decomposition typical of front-camera ECUs.
Empfohlen
Graphics Card / GPU Core Voltage Regulators
GPU core voltage rails in graphics cards demand tens of amps with sub-millisecond transient response, which the TLF12501AUMA1 supplies in a compact PQFN 5x6 footprint. Its 2 MHz switching capability enables small inductor selection, freeing board area for memory and I/O. The integrated IMON output provides per-phase telemetry to the GPU's PMBus controller, supporting dynamic phase shedding at light loads to maintain efficiency curves above 85% from 5 A to 60 A. The exposed top thermal pad interfaces directly with a copper heat spreader, ideal for slot-cooled add-in-card layouts.
Empfohlen
High-Current ASIC / FPGA POL Supplies
FPGA and ASIC core voltages below 1 V require tightly regulated high-current point-of-load conversion, and the TLF12501AUMA1 with its adjustable 0.225 V output (controller dependent) addresses this need. The 36-pin PQFN 5x6 with top-side thermal pad integrates the high-side FET, low-side FET, and driver into a single optimized footprint, reducing parasitic inductance that would otherwise cause VOUT ripple at 60 A. Multiphase configurations using 2-3 stages deliver 120-180 A with current balancing via the IMON pins, suiting high-end networking ASICs and AI accelerator boards.
Empfohlen
Industrial High-Power Motor Drive Auxiliary Rails
Industrial motor drives require robust 24V-to-intermediate auxiliary rails for gate drivers and control logic, and the TLF12501AUMA1's 16V upper VIN limit combined with optional front-end boost stages supports these topologies. The 60 A capability delivers ample headroom for IGBT/SiC gate-driver banks during switching transients. AEC-Q100 stress testing exceeds industrial reliability expectations, and the -40 C to +125 C operating temperature suits factory-floor enclosures. The integrated current-sense IMON pin enables closed-loop monitoring of auxiliary rail health for predictive maintenance.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für TLF12501AUMA1 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | TLF11251LDXUMA1 | TLF44773LAXUMA1 |
|---|---|---|---|
| Brand | Infineon | Infineon | Infineon |
| Package | PQFN 5 x 6 (36-pin PowerVFQFN) | PQFN 5 x 6 (36-pin PowerVFQFN) | PQFN 5 x 6 (36-pin PowerVFQFN) |
| AEC-Q100 | Yes | Yes | Yes |
| Integrated Bootstrap FET | Yes | Yes | Yes |
| Topology | Synchronous Buck Power Stage | Synchronous Buck Power Stage | Synchronous Buck Power Stage |
Wichtigste Unterscheidungsmerkmale
- 60 A continuous / 90 A peak in compact PQFN 5x6 (vs. TDA38826XUMA1)
- Up to 2 MHz switching enables small magnetics (vs. TLF11251LDXUMA1)
- AEC-Q100 qualification with integrated bootstrap FET (vs. Discrete MOSFET + driver solutions)
Designhinweise
Estimated: at VIN=12 V, VOUT=1.0 V, 60 A continuous, power dissipation in the co-packaged MOSFETs can reach 6-9 W depending on RDS(on) and switching losses. The PQFN 5x6 top-side thermal pad must be soldered to a continuous copper pour of at least 1 square inch on the top layer and an equal area on inner layers via thermal vias (0.3 mm pitch, 12+ vias). Without this, junction temperature can exceed 150 C at full load with no airflow. For 60 A continuous in still air, consider 200 LFM forced airflow.
Place input ceramic capacitors (4x 22 uF X7R 25V) within 2 mm of the VIN/PGND pins to minimize high-frequency loop inductance. Use a single ground plane under the IC with the PGND pins stitch-via'd directly to it. The BOOT capacitor (0.1-1 uF) must be placed adjacent to the BOOT and SW pins with a short (< 5 mm) trace to prevent gate-amplitude droop. Source-sink current paths must be symmetric to keep current-sense accuracy within IMON spec.
Do not let the SW (switch node) trace exceed 10 mm in length - excessive parasitic inductance causes overshoot above 22V that can exceed the SW-pin abs max. Always populate the bootstrap capacitor; omitting it leads to HS-FET drive failure within microseconds. The tri-state PWM input requires a controller capable of mid-level detection for proper shutdown - incompatible controllers may leave HS drive floating during fault conditions.
The PWM input is sensitive to 3.3V logic edges; route the PWM trace as a 50-ohm microstrip on an inner layer with ground reference. Place a 33 ohm source-series resistor close to the controller output to damp reflections if trace length exceeds 25 mm. The IMON output is a current-source signal; route it on a quiet reference and add a 100 ohm series resistor plus 1 nF to ground at the controller input for noise filtering.
Compliance-Informationen
AEC-Q100 automotive qualified per Infineon product page. RoHS and lead-free confirmed via distributor listing. REACH compliance declared by manufacturer. Halogen-free status not explicitly stated in verified data.
