TSM-106-01-L-SH - 6-Pin SMT Strip Header, Horizontal | Samtec
Teilenummer: TSM-106-01-L-SH ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1.2 | $1,20 |
| 10 | $1.05 | $10,50 |
| 100 | $0.86 | $86,00 |
| 500 | $0.72 | $360,00 |
| 1.000 | $0.58 | $580,00 |
TSM-106-01-L-SH Übersicht
A board-to-board connector header is a through-hole or surface-mount male pin strip that mates with a corresponding female socket or socket strip to carry signals and low-current power between printed circuit boards. Headers sit at the leaf level of the connector family taxonomy: connector -> board-to-board connector -> pin header -> breakaway header -> unshrouded header. The TSM series specifically targets surface-mount reflow soldering with horizontal or vertical entry, eliminating the need for plated through-holes on the host board and enabling placement on a single-sided SMT process. Engineers value unshrouded headers because their open pin field lets them key, mix, and trim the strip to any pin count at the bench, with mating sockets from the SSW, SSQ, ESW, ESQ, HLE, or HPM families.
Key features of the TSM-106-01-L-SH include a 0.025 inch (0.635 mm) square post that survives high mating cycles with a phosphor-bronze or brass body, optional alignment and locking features selected by suffix, and compatibility with both single and double-row boards when polarity allows. Samtec offers plating options from matte tin to 30 µin gold for engineer-grade versus production-grade reliability, and the part is rated for use across extended operating temperature ranges typical of industrial electronics. The horizontal right-angle orientation supports low-clearance applications where the board edge meets a parallel mating PCB inside a stacked assembly.
Typical applications include board-to-board stacking where one board sits parallel to another at a defined stand-off, point-to-point ribbon-cable headers for I/O and power, prototyping breakaway bus strips, test-point and programming-port headers, and discrete signal pass-through between mezzanine modules. Pairing with a Samtec SSW, SSQ, ESW, or BCS socket of the same pin count yields a complete signal path. Designers should verify the mating post length versus the socket stack height to avoid bottoming-out or float-out, and they should respect the recommended PCB land pattern in the TSM datasheet to keep solder joints robust under mechanical mating stress.
Drop-in-Alternativen für TSM-106-01-L-SH – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
TSM-106-01-L-SH-TR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TSM-106-01-L-SH-A
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TSM-106-01-L-SH-P-TR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TSM-106-01-L-SH-P-FR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TSM-106-02-L-SH-TR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
A-TSM-106-01-L-SH-A
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
TSM-106-01-L-SH Technische Daten
| Series | TSM |
| Number of Positions | 6 |
| Number of Rows | 1 |
| Pitch | 0.100 in (2.54 mm) |
| Montageart | Surface Mount, Right Angle (Horizontal) |
| Contact Mating Length | 0.230 in (5.84 mm) |
| Post Dimension | 0.025 in (0.635 mm) square |
| Connector Type | Header, Unshrouded |
| Contact Finish - Mating | 10 µin Gold |
| Contact Finish - Post | Tin |
| Color | Black |
| Insulation Height | 0.120 in (3.05 mm) |
| Betriebstemperatur | -55 °C to +125 °C (typical for TSM series) |
| RoHS-Status | Compliant |
| Lead Free | Yes |
TSM-106-01-L-SH Pin-Konfiguration
| Pin 1 | Pin 1 — Mating post 1 (gold-plated 10 µin), pin 1 identified by molded chamfer |
| Pin 2 | Pin 2 — Mating post 2, tin solder tail at PCB side |
| Pin 3 | Pin 3 — Mating post 3 |
| Pin 4 | Pin 4 — Mating post 4 |
| Pin 5 | Pin 5 — Mating post 5 |
| Pin 6 | Pin 6 — Mating post 6 (last position), pin numbering left-to-right viewing from above with mating posts facing engineer |
Typische Anwendungen
TSM-106-01-L-SH ist geeignet für 6 Anwendungs: Board-to-Board Stacking on SMT Modules, Signal Pass-Through on Sensor Breakout Boards, Programming and Debug Header Footprints, Power Module Output Headers, LED Array and Lighting Module Interconnects, Industrial I/O Breakout Strips.
Board-to-Board Stacking on SMT Modules
The TSM-106-01-L-SH enables short-distance board-to-board stacking between a master controller PCB and a daughter module using horizontal right-angle SMT pin headers. Its 0.230 inch post length mates with Samtec SSW or BCS right-angle sockets on the same 2.54 mm pitch to provide a parallel-mezzanine stack with 1.5 mm to 5.84 mm stand-off depending on socket choice. Unlike through-hole headers, no plated through-hole is required, enabling single-sided SMT assembly.
Empfohlen
Signal Pass-Through on Sensor Breakout Boards
Engineers use the TSM-106-01-L-SH as the input/output header on sensor breakout boards, where six exposed right-angle pins carry analog sensor signals, I2C, SPI, and ground return to a parent MCU. The unshrouded 0.025 inch square post mates with common 0.1 inch jumper wires, screw terminals, and IDC sockets, allowing rapid bench testing. Surface-mount construction eliminates the need for a mating cable assembly on production hardware.
Empfohlen
Programming and Debug Header Footprints
The TSM-106-01-L-SH serves as a programming, debug, or SWD header footprint on production MCU boards that must not expose programming pins on the production I/O socket. Its right-angle SMT orientation sits parallel to the MCU PCB edge, keeping the tooling footprint well away from the product enclosure. Pin 1 is identified by Samtec's molded chamfer, allowing fool-proof probe and tool alignment.
Empfohlen
Power Module Output Headers
When used as a power module output header, the TSM-106-01-L-SH provides 6 robust 0.025 inch square pins for high-current rails up to the datasheet maximum rating per pin, easily carrying 5 V/12 V power and ground between an isolated DC/DC module and its host board. The horizontal orientation keeps the header within an 11 mm board-side envelope, ideal for industrial DIN-rail and panel-mount designs.
Empfohlen
LED Array and Lighting Module Interconnects
The TSM-106-01-L-SH is ideal for LED array interconnect between a constant-current driver board and the LED light engine PCB, supporting 6 lines of pixel-level enable, power, and ground signals per chain. Its unshrouded breakaway design allows the strip to be trimmed to 6 pins if a longer chain is over-specified. Gold-over-tin plating ensures stable contact resistance through 250+ mating cycles required for serviceability.
Empfohlen
Industrial I/O Breakout Strips
Industrial PLC and industrial-IO cards use the TSM-106-01-L-SH as field-wireable I/O strips where 6 pins carry 24 V field-side discrete signals, opto-isolated grounds, and shield returns. Right-angle SMT mounting aligns the mating screws with the I/O enclosure panel for cable gland assembly. The unshrouded design supports custom insulation displacement or push-in terminal adapters from third parties.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für TSM-106-01-L-SH – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | TSM-106-01-L-SH-TR | TSM-106-01-L-SH-A | TSM-106-01-L-SH-P-TR | TSM-106-01-L-SH-P-FR | TSM-106-02-L-SH-TR | A-TSM-106-01-L-SH-A |
|---|---|---|---|---|---|---|---|
| Package | Surface Mount, Right Angle (SMT 6P) | Surface Mount, Right Angle (SMT 6P) - same | Surface Mount, Right Angle (SMT 6P) - same | Surface Mount, Right Angle (SMT 6P) - same | Surface Mount, Right Angle (SMT 6P) - same | Surface Mount, Right Angle (SMT 6P) - same | Surface Mount, Right Angle (SMT 6P) - same |
| Brand | Samtec | Samtec - same | Samtec - same | Samtec - same | Samtec - same | Samtec - same | Samtec - same |
| Number of Positions | 6 | 6 - same | 6 - same | 6 - same | 6 - same | 6 - same | 6 - same |
| Pitch | 2.54 mm (0.100 in) | 2.54 mm - same | 2.54 mm - same | 2.54 mm - same | 2.54 mm - same | 2.54 mm - same | 2.54 mm - same |
| Mating Post Length | 5.84 mm (0.230 in) | 5.84 mm - same | 5.84 mm - same | 5.84 mm - same | 5.84 mm - same | 5.84 mm - same | 5.84 mm - same |
| Mating Plating | 10 µin Gold | 10 µin Gold - same | 10 µin Gold - same | 10 µin Gold - same | 10 µin Gold - same | 10 µin Gold - same | 10 µin Gold - same |
| Orientation | Horizontal (Right Angle) | Horizontal - same | Horizontal - same | Horizontal - same | Horizontal - same | Horizontal - same | Horizontal - same |
| Special Feature / Suffix | Standard horizontal SMT | Tape & Reel packaging | Alignment pin | Pick-and-place pad + Tape & Reel | Pick-and-place pad + Full Reel | Longer lead style + Tape & Reel | Extended Life Product + Alignment pin |
| Mating Cycles Rating | Standard | Standard | Standard | Standard | Standard | Standard | 250 to 2500 cycles (MFG tested) |
Wichtigste Unterscheidungsmerkmale
- All six alternatives are drop-in compatible on the same 6-position 2.54 mm right-angle SMT footprint (vs. TSM-106-01-L-SH-TR)
- Extended Life Product variant with severe-environment reliability testing (vs. A-TSM-106-01-L-SH-A)
- Optional alignment pin aids high-density reflow placement (vs. TSM-106-01-L-SH-A)
Designhinweise
Use the recommended PCB land pattern from the Samtec TSM series datasheet for 6-position 0.100 inch pitch right-angle SMT headers. The land pads should be approximately 1.5 mm wide with sufficient copper tie-off to the host board to survive SMT reflow shear stress. A duplicate paste-mask pattern is recommended if a hand-rework option is needed, because hand-disassembling a TSM header is difficult without damaging the host PCB pads.
Estimate carefully: when the 0.230 inch mating post is inserted into a typical right-angle socket, the lowest possible stack-height (PCB top to PCB top) is roughly 5.84 mm (post) plus the socket's plastic-body height. For low-profile applications choose the HLE or BCS socket family; for taller stands-off, allow 2 to 3 mm vertical clearance above the TSM body for mating-side tooling.
Do not confuse the -SH (horizontal, right-angle SMT) suffix with -SV (vertical SMT) or -DH (double-row horizontal). Mixed-row -DH carries 12 positions versus SH's 6, and mounting a vertical header on a horizontal-footprint PCB land pattern will short the SMT pads to the host copper pour. Always cross-check the suffix code against the Samtec TSM series datasheet before ordering or assembling.
The 0.025 inch square post is adequate for low-speed signals (I2C, GPIO, UART, low-frequency SPI); at >50 MHz consider the Samtec FTSH or FTS series with better impedance control. For applications carrying 5 V/12 V power through the header, derate to roughly 1 A per pin and provide multiple parallel grounds to reduce inductance and temperature rise at the contact interface.
Compliance-Informationen
RoHS compliant and lead-free per Samtec product page. Connector products are not AEC-Q100 qualified; the TSM series is intended for commercial and industrial environments. REACH SVHC and conflict mineral disclosures are published by Samtec.