TXG4122 - ±40V Bidirectional I2C Ground-Level Translator | TI
Teilenummer: TXG4122 ✓ Aktiv| Menge | Stückpreis | Gesamt |
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| 1 | $0 | $0,00 |
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TXG4122 Übersicht
A ground-level translator is a type of logic-level shifter within the broader family of signal interface and level-translation ICs. Unlike conventional voltage translators that shift logic thresholds between two supply domains, a ground-level translator tolerates a DC offset difference between the ground references of two subsystems while passing digital signals intact. This matters in systems where a shared I2C bus spans domains whose grounds sit at different potentials, such as battery-stacked architectures, grounded-inverter motor drives, shunt-referenced sensing, and isolated industrial networks where full galvanic isolation is not required but ground bounce or stacking offsets of tens of volts exist.
Key features of the TXG4122 include the ±40V common-mode ground-offset tolerance, true bidirectional I2C signaling without direction-control pins, dual channels in a compact 8-SOIC footprint, and an operating temperature range of -40C to +125C for industrial and automotive-adjacent environments. The non-galvanic topology passes signals resistively/capacitively rather than through a digital isolator barrier, avoiding the propagation delay, quiescent power, and cost of optocoupler or digital-isolator approaches while still blocking the ground offset.
Architecturally, the device supports two separate configurable power-supply rails, so the low-voltage controller side and the offset high-voltage side can each run at their own logic levels. Bidirectional open-drain I2C signaling (SDA and SCL) is preserved through the translator, keeping multi-master and clock-stretching behavior intact, which is essential for Standards-Mode (100 kHz) through Fast-Mode (up to the 2 Mbps supported rate) operation.
Typical applications include I2C communication across stacked battery modules in energy-storage and e-mobility systems, communication equipment and industrial control where grounds are offset, and interfacing to sense elements riding on a high-voltage rail. Distributor listings note demonstrated use in industrial control, automotive electronics, and communication equipment.
Design-wise, verify that the common-mode offset stays within the ±40V window under all fault and transient conditions, and keep pull-up resistor values appropriate for the 2 Mbps data rate so rise times remain within the I2C specification.
This page synthesizes distributor listings, TI product data, and practical engineering guidance not found in a single source, offering an engineer-oriented view of the TXG4122.
Drop-in-Alternativen für TXG4122 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
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Für dieses Produkt sind keine Drop-in-Alternativen verfügbar.
Alternativen anfordernTXG4122 Technische Daten
| Funktion | Dual bidirectional voltage and ground-level translator for I2C |
| Translator Type | Non-galvanic based, ground-level |
| Number of Channels | 2 (dual, 2-bit) |
| Signal Type | I2C bidirectional |
| Ground Offset Tolerance | ±40 V |
| Max Data Rate | 2 Mbps |
| Power-Supply Rails | Two separate configurable rails |
| Betriebstemperatur | -40C to +125C |
| Gehäuse | 8-SOIC (D) |
| Montageart | Surface Mount |
| Device Marking | TG4122 |
TXG4122 8-soic (d) Pinbelegungsleitfaden
Pinbelegung für TXG4122 (8-soic (d)-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für TXG4122.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
TXG4122 ist geeignet für 6 Anwendungs: Stacked Battery Module Communications, Industrial Control and PLC I2C Links, Automotive Electronics Networks, Communication Equipment Backplanes, Shunt-Referenced Sensing Front Ends, Motor Drive Control Interfaces.
Stacked Battery Module Communications
In battery management systems for energy storage and e-mobility, cell-monitoring electronics sit on stacked potentials that differ from the controller ground by tens of volts. The TXG4122's ±40V ground-offset tolerance allows the shared I2C bus (SDA and SCL) to cross these stacked grounds without a full galvanic isolator, saving cost, board area, and propagation delay. Each side uses its own configurable supply rail, so a 3.3V controller can talk to module-level logic at its local potential. At data rates up to 2 Mbps, the translator adds negligible timing overhead compared with isolator-based solutions, while the -40C to +125C range covers under-hood and outdoor cabinet environments. Designers must verify that cumulative stacking offsets, including fault and transient conditions, remain within the ±40V window.
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Industrial Control and PLC I2C Links
Industrial control cabinets often combine subsystems whose grounds are offset by wiring drops, switching transients, or different power supplies. The TXG4122 bridges I2C connections across such offset grounds with ±40V tolerance, as noted in distributor descriptions citing demonstrated use in industrial control. The dual-channel 8-SOIC device passes bidirectional I2C traffic at up to 2 Mbps, supporting fast sensor polling on PLC I/O modules. Because the part is non-galvanic, safety isolation must be provided elsewhere in the system where standards require it; the TXG4122 instead solves the ground-offset problem at lower cost and power than a digital isolator. The -40C to +125C temperature range and surface-mount 8-SOIC package suit standard industrial SMT assembly.
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Automotive Electronics Networks
Automotive 12V and 48V systems routinely exhibit ground offsets between electronic control units due to chassis resistance, load dumps, and high-current switching. The TXG4122 passes I2C between such offset domains within its ±40V window, and distributor descriptions cite demonstrated reliability in automotive electronics. The extended -40C to +125C operating range matches automotive cabin and under-hood ambient requirements. Its two configurable supply rails allow a 3.3V infotainment or body-controller domain to communicate with a sensor or actuator module referenced to a shifted ground. For newly qualified designs where AEC-Q100 certification is mandatory, verify the applicable TI qualification grade on the official product page before release, since this page's captured data does not state the automotive rating.
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Communication Equipment Backplanes
Telecom and data-communication equipment frequently uses distributed power architectures in which card grounds sit at different potentials relative to a central controller. The TXG4122 provides the dual-channel, ±40V ground-offset-tolerant I2C link needed for card-level telemetry, fan controllers, and optical module management across these offsets. Distributor descriptions of the part specifically reference communication equipment deployments. At 2 Mbps the translator keeps management-bus transactions fast, and the non-galvanic topology avoids the idle power and propagation delay of isolators across every card slot, which multiplies savings in multi-slot shelves. The 8-SOIC footprint is compact enough to place near the backplane connector where the offset appears.
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Shunt-Referenced Sensing Front Ends
When a microcontroller must read configuration or status registers of a device riding on a high-side shunt or a floating measurement node, the I2C lines cross a ground offset equal to the shunt voltage. The TXG4122, with its ±40V tolerance and bidirectional signaling, provides this bridge without direction-control handshaking, preserving multi-master and clock-stretching behavior of I2C. Its two separately configurable rails let the controller side run at standard 1.8V to 5V logic while the sensing side uses its local supply. Compared with an optocoupler-based approach, the non-galvanic translator reduces component count and eliminates optocoupler aging effects. Confirm that worst-case node offset, including transients, remains inside the ±40V rating.
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Motor Drive Control Interfaces
In motor inverters, gate-driver and sensing electronics referenced to the power-switching nodes move with large common-mode excursions, while the MCU sits at controller ground. The TXG4122 offers a practical path for I2C-based configuration and telemetry across ground offsets up to ±40V, complementing dedicated gate-drive isolation. The device's 2 Mbps capability supports rapid parameter updates and fault polling, and its -40C to +125C rating covers drive-enclosure environments. Because inverter transients can be fast and large, engineers should verify that switching transients at the translator pins stay within absolute maximum ratings, and provide local decoupling for each supply rail. This application suits auxiliary I2C traffic, not primary PWM gate control, which requires certified isolation.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für TXG4122 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | TXG4041QDBQRQ1 | TXG4042QDBQRQ1 |
|---|---|---|---|
| Package | 8-SOIC (D) | SSOP (DBQ) - different package, not drop-in | SSOP (DBQ) - different package, not drop-in |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments |
| Bit Width | 2-bit (dual) | 4-bit | 4-bit |
| Ground Offset Tolerance | ±40 V | ±40 V | ±40 V |
| Interface | I2C bidirectional | General-purpose ground-level translation | General-purpose ground-level translation |
| Drop-in Replacement | N/A (reference) | No - different package and pin count | No - different package and pin count |
Wichtigste Unterscheidungsmerkmale
- I2C-optimized bidirectional signaling (vs. TXG4041QDBQRQ1)
- ±40V offset tolerance at lower cost than isolation (vs. ISO1540)
- Two separately configurable supply rails (vs. TXG4042QDBQRQ1)
Designhinweise
The ±40V ground-offset rating is a continuous operating window, not a transient rating to lean on. In stacked-battery and inverter applications, verify worst-case offsets under charging peaks, fault conditions, and inverter switching events before finalizing the design. If the instantaneous offset can exceed ±40V even briefly, add series protection or move to a certified galvanic isolator. Also remember this is a non-galvanic part: it does not replace safety isolation required by standards; it only tolerates ground offsets.
Although the TXG4122 supports up to 2 Mbps, bus speed is usually limited by pull-up resistor values and total bus capacitance on the I2C lines. Size pull-ups for the longest bus and highest capacitance condition so rise times remain within the I2C specification; at Fast-Mode and above, this often means lower resistance pull-ups (1 kOhm to 2 kOhm range) and short traces. Keep the translator close to the point where the ground offset appears, and route SDA/SCL as a matched pair away from switching nodes.
The TXG4122 supports two separately configurable power-supply rails, one per side of the translation boundary. Decouple each rail with a 100 nF ceramic capacitor placed close to the device pins. Power-up sequencing considerations apply because each side sees its local ground; consult the manufacturer datasheet for the allowable supply sequencing order and valid rail voltage combinations, as these constrain which logic voltages can be used on each side of the translator.
Compliance-Informationen
Compliance details were not stated in the data captured for this page. The TXG404x-Q1 automotive variants in the same TI family indicate AEC-Q100 qualification exists in the product family, but no Q1 variant of the TXG4122 was confirmed in the available data. Consult the TI product page for current RoHS/REACH status.