ULC0502P3 - 5V 2-Line Ultra-Low Capacitance TVS | Leiditech
Teilenummer: ULC0502P3 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0.19 | $0,19 |
| 10 | $0.17 | $1,70 |
| 100 | $0.13 | $13,00 |
| 500 | $0.1 | $50,00 |
| 1.000 | $0.08 | $80,00 |
| 3.000 | $0.06 | $180,00 |
ULC0502P3 Übersicht
A TVS (Transient Voltage Suppressor) diode is a solid-state semiconductor device designed to clamp voltage spikes and divert transient currents away from sensitive downstream ICs. Within the protection hierarchy (TVS diode -> ESD suppressor -> surge protector -> circuit protection component), TVS diodes sit at the IC-port level and are routinely placed next to USB, HDMI, MIPI, and antenna connectors. Ultra-low capacitance variants like the ULC0502P3 specifically target high-speed signal lines where conventional TVS diodes would degrade signal integrity.
Key features of the ULC0502P3 include ultra-low leakage at the nA level, a low 5V operating (working) voltage, low clamping voltage during transient events, and a miniature 3-pin leadless DFN1006-3 footprint. The device is compliant with IEC 61000-4-2 ESD immunity testing at +/-30kV air discharge and +/-25kV contact discharge, with IEC 61000-4-4 EFT immunity at 40A (5/50ns) and IEC 61000-4-5 surge immunity at 5A (8/20us). Lead finish is NiPdAu (nickel-palladium-gold) for reliable soldering and corrosion resistance, and the device is RoHS compliant.
The ULC0502P3 is best understood as a two-channel unidirectional low-capacitance ESD diode in a sub-millimeter package, optimized for high-speed signal routing. Compared with general-purpose TVS diodes that may add tens of picofarads of junction capacitance, ultra-low capacitance parts such as this one preserve signal eye-diagram margins on USB 2.0, USB 3.0, HDMI, MIPI DSI/CSI, and other GHz-class interfaces.
Typical applications include USB 2.0/3.0 data line protection, HDMI/MIPI display and camera interfaces, smartphone and wearable charging port protection, wireless antenna RF feed protection, and general-purpose I/O protection on microcontrollers and SoCs. Designers frequently pair the ULC0502P3 with common-mode chokes, ferrite beads, and bulk decoupling capacitors to form a complete port protection network.
When designing in this part, place it as close as possible to the connector body or IC pin to minimize the parasitic inductance of the protection loop. Use wide, short ground traces to the PCB ground plane to ensure the lowest impedance return path for transient currents, and follow the layout recommendation to keep the protected traces directly under the device body without stubs or vias.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the Leiditech product page or datasheet, helping engineers shorten the selection cycle and avoid common port-protection pitfalls.
Drop-in-Alternativen für ULC0502P3 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ULC0502P3L
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ESD5V3U2U-03LRH
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
D5V0F2U3LP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ESD5302N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
UAD8A05L02
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ULC0502P3 Technische Daten
| Device Type | TVS / ESD Protection Diode Array |
| Number of Protected Lines | 2 |
| Directionality | Unidirectional |
| Working Voltage (VRWM) | 5 V |
| Leakage Current | nA level (ultra-low) |
| Clamping Voltage | Low (per datasheet transient curve) |
| ESD Air Discharge | +/-30 kV (IEC 61000-4-2) |
| ESD Contact Discharge | +/-25 kV (IEC 61000-4-2) |
| EFT Rating | 40 A (5/50 ns, IEC 61000-4-4) |
| Lightning Surge | 5 A (8/20 us, IEC 61000-4-5) |
| Gehäuse | DFN1006-3 (1.0 x 0.6 x 0.5 mm) |
| Lead Finish | NiPdAu |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
ULC0502P3 Pin-Konfiguration
| Pin 1 | IO1 — Protected line 1 (input/output to data line) |
| Pin 2 | GND — Common ground reference (exposed pad on bottom of package) |
| Pin 3 | IO2 — Protected line 2 (input/output to data line) |
Typische Anwendungen
ULC0502P3 ist geeignet für 6 Anwendungs: USB 2.0 / USB 3.0 Data Line Protection, HDMI / MIPI Display and Camera Interfaces, Smartphone and Wearable Charging Port Protection, Wireless Antenna RF Feed Protection, Industrial MCU GPIO and Sensor I/O Protection, IoT and Smart Home Device Port Protection.
USB 2.0 / USB 3.0 Data Line Protection
The ULC0502P3 is purpose-built for protecting USB 2.0 (480 Mbps) and USB 3.0 (5 Gbps) data pairs where ultra-low parasitic capacitance is mandatory to preserve signal eye-diagram margins. Its 5V working voltage matches USB VBUS-adjacent signaling levels, and the +/-30 kV air-discharge IEC 61000-4-2 rating easily absorbs cable-discharge transients during hot-plug events. Place the device within 3 mm of the USB connector body with a direct ground via to the PCB ground plane; this minimizes loop inductance and ensures the lowest clamping voltage. Pair the ULC0502P3 with a common-mode choke and ferrite bead for a complete EMI/ESD solution.
Empfohlen
HDMI / MIPI Display and Camera Interfaces
The ULC0502P3 protects high-speed HDMI, MIPI DSI, and MIPI CSI-2 lanes on smartphones, tablets, and display modules where signal frequencies reach 1-2.5 GHz per lane. The device's ultra-low capacitance (<1 pF typical, per datasheet) preserves rise/fall times and prevents eye-diagram closure, while its 5V VRWM is compatible with standard low-voltage differential signaling. Place one ULC0502P3 across each differential pair (D+/D-) as close as possible to the connector, with each protected trace routed through the device body and a wide, short ground return. Designers typically use one ULC0502P3 per pair to keep symmetry intact.
Empfohlen
Smartphone and Wearable Charging Port Protection
Smartphones, TWS earbuds, and smartwatches require miniature, high-performance ESD protection on USB-C, Lightning, and proprietary charging/data ports. The ULC0502P3's 1.0 x 0.6 x 0.5 mm DFN1006-3 footprint saves critical PCB real estate in space-constrained mobile designs, while its 5V working voltage suits low-voltage signaling. Place the device adjacent to the connector pads and use a 4-layer PCB stack-up with continuous ground pour under the connector area for lowest ground impedance. NiPdAu lead finish is compatible with ENIG pads and supports lead-free reflow profiles up to 260 C peak.
Empfohlen
Wireless Antenna RF Feed Protection
The ULC0502P3 protects antenna feeds on Wi-Fi, Bluetooth, GPS/GNSS, sub-GHz RF, and NFC interfaces from ESD events during antenna handling, manufacturing, and field use. Its ultra-low capacitance is critical here because antenna matching networks and SAW/LNA front-end filters are tuned to within fractions of a picofarad; any excess loading detunes the match and degrades sensitivity. Place the ULC0502P3 downstream of the antenna matching network but before the first LNA/SAW filter, with controlled-impedance traces (typically 50 ohm coplanar waveguide) maintained through the device.
Empfohlen
Industrial MCU GPIO and Sensor I/O Protection
Industrial PLCs, sensor modules, and embedded MCUs require robust ESD/EFT protection on GPIO, RS-232/RS-485, SPI, and I2C lines exposed to factory floor transients. The ULC0502P3's 5V working voltage suits 3.3V and 5V logic rails, and its IEC 61000-4-4 EFT rating at 40A handles the harsh switching transients common in motor-drive and relay-control environments. Place the device between the connector and the MCU pin, with bulk TVS on the power rail and ferrite beads on supply feeds. Designers should add a 100k pull-down resistor on each protected line to guarantee defined state during ESD recovery.
Empfohlen
IoT and Smart Home Device Port Protection
IoT endpoints - smart speakers, security cameras, smart thermostats, and connected sensors - frequently expose USB-C, micro-USB, or proprietary debug/programming ports that are vulnerable to ESD during installation and service. The ULC0502P3 provides cost-effective, sub-pF-capacitance protection that does not interfere with USB-serial debug throughput or low-speed wireless co-existence. Place the ULC0502P3 across each exposed data line with a ground return via placed immediately adjacent to the device's GND pin to minimize ground inductance. Combined with a PTC resettable fuse and bulk TVS on VBUS, the design achieves robust port-level protection at minimal BOM cost.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ULC0502P3 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ULC0502P3L | ESD5V3U2U-03LRH | D5V0F2U3LP | ESD5302N | UAD8A05L02 |
|---|---|---|---|---|---|---|
| Package | DFN1006-3 (1.0 x 0.6 x 0.5 mm) | DFN1006-3 (1.0 x 0.6 x 0.5 mm) - same | DFN1006-3 (1.0 x 0.6 x 0.5 mm) - same | DFN1006-3 (1.0 x 0.6 x 0.5 mm) - same | DFN1006-3 (1.0 x 0.6 x 0.5 mm) - same | DFN1006-3 (1.0 x 0.6 x 0.5 mm) - same |
| Brand | Shanghai Leiditech | Shanghai Leiditech | Infineon | Diodes Incorporated | WILLSEMI | BrightKing |
| Working Voltage (VRWM) | 5 V | 5 V | 5.3 V | 5.0 V | 5.0 V | 5.0 V |
| Number of Protected Lines | 2 | 2 | 2 | 2 | 2 | 2 |
| Directionality | Unidirectional | Unidirectional | Unidirectional | Unidirectional | Unidirectional | Unidirectional |
| Leakage Current | nA level (ultra-low) | nA level | Low (per datasheet) | Low (per datasheet) | Low (per datasheet) | Low (per datasheet) |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Wichtigste Unterscheidungsmerkmale
- Explicit manufacturer-published cross-reference list to 5 cross-brand equivalents (vs. ESD5V3U2U-03LRH (Infineon))
- Sub-millimeter DFN1006-3 package saves PCB area (vs. D5V0F2U3LP (Diodes Incorporated))
- Confirmed compatibility across 5 cross-brand drop-in sources (vs. ESD5302N (WILLSEMI))
- Cost-competitive with published pricing at $0.06-$0.19 per unit (vs. UAD8A05L02 (BrightKing))
Designhinweise
Place the ULC0502P3 within 3 mm of the connector body to minimize the parasitic inductance of the protection loop, which directly determines the residual clamping voltage seen by the protected IC. Use a direct ground via placed immediately adjacent to the GND pin (pin 2 / exposed pad) to ensure the lowest impedance return path for transient currents. Avoid routing protected traces as stubs - the protected trace should pass directly through the device from connector to IC with no branch or tee.
Use a 4-layer PCB stack-up with a continuous, unbroken ground plane beneath the connector and protection area. Stitch the ground pour around the connector with multiple vias to suppress radiated EMI during ESD events. For double-sided boards, place a ground pour on the bottom layer directly under the ULC0502P3 footprint and stitch with at least two vias to the top-side ground.
Do not place bulk decoupling capacitors or ferrite beads between the ULC0502P3 and the connector - they add series inductance that lets ESD voltage overshoot past the TVS clamping level. The ULC0502P3 must be the first component the transient current sees after the connector pins. Also avoid using the ULC0502P3 to protect signals above 5V continuous; for 12V or 24V signaling select a higher VRWM part such as the Leiditech ULCxxxxP series with appropriate working voltage.
During IEC 61000-4-5 surge events the ULC0502P3 absorbs up to 5 A peak current for short durations, which causes localized heating at the silicon junction. The DFN1006-3 package dissipates this heat through the GND pad (exposed thermal pad) to the PCB. Maximize the copper area connected to the GND pad to keep junction temperature rise under 50 C; a copper pour of at least 10 mm x 10 mm on top and bottom layers is recommended for surge-rated designs.
Although the ULC0502P3 is specified as ultra-low capacitance, the exact loading varies with bias voltage and frequency - confirm eye-diagram compliance in your specific high-speed interface. For USB 3.0 SuperSpeed (5 Gbps) and HDMI 2.0 (6 Gbps) lines, request eye-diagram plots from Leiditech or perform TDR measurements on your prototype. If the ULC0502P3 capacitance is borderline, consider the lower-capacitance Leiditech ULCxxxx family variants or a 1-line per channel layout using two devices.
Compliance-Informationen
RoHS compliant per Leiditech datasheet. NiPdAu lead finish supports lead-free reflow profiles. Not AEC-Q100 qualified - not intended for automotive safety-critical applications. Halogen-free status and conflict-minerals declaration should be confirmed with Leiditech directly for production qualification.
