USB2660I-JZX-03 - USB 2.0 Hub & Multi-Format Flash Controller | Microchip
Teilenummer: USB2660I-JZX-03 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $11.45 | $11,45 |
| 10 | $10.31 | $103,10 |
| 100 | $9.18 | $918,00 |
| 500 | $8.2 | $4.100,00 |
| 1.000 | $7.45 | $7.450,00 |
USB2660I-JZX-03 Übersicht
A USB 2.0 Hi-Speed hub controller is a category of USB peripheral that aggregates multiple downstream ports and card-reader functions behind a single upstream port, while a flash media controller is a class of storage interface IC that bridges a host processor to removable flash memory cards using standardized protocols such as SD, MMC, and MSPro. The USB2660I sits at the intersection of these two product types, forming part of the broader USB interface IC hierarchy: USB peripheral controller -> USB hub controller -> combo hub + media reader -> Microchip USB264x/2660 family. This combination reduces PCB area, BOM count, and design complexity for system integrators that would otherwise need a separate hub chip and card-reader chip.
Key features of the USB2660I-JZX-03 include 2 downstream USB 2.0 Hi-Speed ports, an internal transaction translator for mixed-speed USB environments, multi-format flash card support with dual SD interfaces, integrated card power FETs, on-board 24 MHz crystal driver, and USB-IF certified hub silicon. The chip is USB 2.0 compliant and supports Suspend and low-power modes per the USB specification. Programmable through an external I2C EEPROM, the device enables custom vendor/product IDs, string descriptors, and manufacturer-specific behavior.
Internally the USB2660I uses Microchip's proven UTMI+ compliant physical layer and a hardened Hi-Speed USB 2.0 hub topology that delivers industry-leading data throughput in mixed-speed environments where some downstream devices run at Full-Speed (12 Mbps) and others at Hi-Speed (480 Mbps). The integrated media controller supports USB Mass Storage class and SDIO bridging, enabling SDIO peripherals to enumerate over USB with custom firmware.
Typical applications include desktop and notebook PCs, multi-function printers with card reader slots, docking stations, set-top boxes, and industrial panel PCs that expose SD card slots and multiple USB ports to end users. Designers use the USB2660I-JZX-03 to consolidate USB expansion and media reading onto a single 9x9 mm QFN.
When designing with the USB2660I-JZX-03, allocate at least four PCB layers for clean USB signal routing, route the differential DP/DM pair as a 90-ohm impedance-matched pair, and provide a local 0.1 uF decoupling cap adjacent to every power pin. The exposed thermal pad must be soldered to a contiguous ground pour to meet USB-IF Hub Certification thermal-rise limits.
Drop-in-Alternativen für USB2660I-JZX-03 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
USB2660I-JZX
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
USB2660-JZX
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
USB2660I-JZX-03-TR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
USB2640I-JZX
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
USB2630-JZX
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
USB2660I-JZX-03 Technische Daten
| Product Type | USB 2.0 Hi-Speed Hub + Multi-Format Flash Media Controller |
| USB Specification | USB 2.0 Hi-Speed (480 Mbps) |
| Number of Downstream Ports | 2 |
| Upstream Ports | 1 (Hi-Speed) |
| Supported Flash Card Formats | SD, MMC, Memory Stick, xD-Picture Card, MSPro |
| SD Interfaces | Dual SD |
| SDIO Bridging | Supported (with custom firmware) |
| Transaction Translator | Internal (per-port TT for mixed-speed environments) |
| Versorgungsspannung | 3.0 V to 3.6 V |
| I/O Voltage | 3.3 V |
| Clock Input | 24 MHz crystal or external clock |
| Betriebstemperaturbereich | -40 C to +85 C (industrial grade) |
| Gehäuse | 64-QFN (JZX) 9 x 9 mm with exposed thermal pad |
| Montageart | Surface Mount |
| RoHS-Status | Compliant (per Microchip product page) |
| USB-IF Certification | Yes (hub silicon certified) |
USB2660I-JZX-03 Pin-Konfiguration
| Pin 1 | DP1 — USB Port 1 D+ signal |
| Pin 2 | DM1 — USB Port 1 D- signal |
| Pin 3 | VBUS1 — USB Port 1 VBUS sense |
| Pin 4 | DP2 — USB Port 2 D+ signal |
| Pin 5 | DM2 — USB Port 2 D- signal |
| Pin 6 | VBUS2 — USB Port 2 VBUS sense |
| Pin 7 | OC1 — Over-current sense Port 1 |
| Pin 8 | OC2 — Over-current sense Port 2 |
| Pin 9 | PRTPWR1 — Port 1 power switch control |
| Pin 10 | PRTPWR2 — Port 2 power switch control |
| Pin 11 | VDD33 — 3.3V supply |
| Pin 12 | VDD33 — 3.3V supply |
| Pin 13 | VDD12 — 1.2V core supply (from internal LDO) |
| Pin 14 | GND — Ground |
| Pin 15 | GND — Ground |
| Pin 16 | XTAL1 — 24 MHz crystal input |
| Pin 17 | XTAL2 — 24 MHz crystal output |
| Pin 18 | RBIAS — External bias resistor |
| Pin 19 | RESET — System reset, active low |
| Pin 20 | TEST — Test mode (tie to GND in production) |
| Pin 21 | SDA — I2C EEPROM data |
| Pin 22 | SCL — I2C EEPROM clock |
| Pin 23 | SD_CLK1 — SD card 1 clock |
| Pin 24 | SD_CMD1 — SD card 1 command |
| Pin 25 | SD_DAT0_1 — SD card 1 data 0 |
| Pin 26 | SD_DAT1_1 — SD card 1 data 1 |
| Pin 27 | SD_DAT2_1 — SD card 1 data 2 |
| Pin 28 | SD_DAT3_1 — SD card 1 data 3 |
| Pin 29 | SD_CLK2 — SD card 2 clock |
| Pin 30 | SD_CMD2 — SD card 2 command |
| Pin 31 | SD_DAT0_2 — SD card 2 data 0 |
| Pin 32 | SD_DAT1_2 — SD card 2 data 1 |
| Pin 33 | SD_DAT2_2 — SD card 2 data 2 |
| Pin 34 | SD_DAT3_2 — SD card 2 data 3 |
| Pin 35 | SD_CD1 — SD card 1 detect |
| Pin 36 | SD_CD2 — SD card 2 detect |
| Pin 37 | SD_WP1 — SD card 1 write protect |
| Pin 38 | SD_WP2 — SD card 2 write protect |
| Pin 39 | MS_BS — Memory Stick bus state |
| Pin 40 | MS_SDIO — Memory Stick SDIO |
| Pin 41 | MS_CLK — Memory Stick clock |
| Pin 42 | MS_DAT0 — Memory Stick data 0 |
| Pin 43 | MS_DAT1 — Memory Stick data 1 |
| Pin 44 | MS_DAT2 — Memory Stick data 2 |
| Pin 45 | MS_DAT3 — Memory Stick data 3 |
| Pin 46 | xD_D0 — xD-Picture card data 0 |
| Pin 47 | xD_D1 — xD-Picture card data 1 |
| Pin 48 | xD_D2 — xD-Picture card data 2 |
| Pin 49 | xD_D3 — xD-Picture card data 3 |
| Pin 50 | xD_CD — xD-Picture card detect |
| Pin 51 | xD_RDY — xD-Picture card ready |
| Pin 52 | MMC_CLK — MMC clock |
| Pin 53 | MMC_CMD — MMC command |
| Pin 54 | MMC_DAT0 — MMC data 0 |
| Pin 55 | MMC_DAT1 — MMC data 1 |
| Pin 56 | MMC_DAT2 — MMC data 2 |
| Pin 57 | MMC_DAT3 — MMC data 3 |
| Pin 58 | GND — Ground |
| Pin 59 | GND — Ground |
| Pin 60 | DP_UP — Upstream USB D+ |
| Pin 61 | DM_UP — Upstream USB D- |
| Pin 62 | VBUS_UP — Upstream VBUS sense (5V detect) |
| Pin 63 | GND — Ground |
| Pin 64 | VDD33 — 3.3V supply |
| Pin 65 | EP — Exposed thermal pad - tie to ground |
Typische Anwendungen
USB2660I-JZX-03 ist geeignet für 6 Anwendungs: Desktop PC Front-Panel Card Reader, Notebook PC Media Reader Bay, Multi-Function Printer (MFP) Card Reader, Docking Station USB + Card Reader, Industrial Panel PC and HMI, Set-Top Box Media Reader.
Desktop PC Front-Panel Card Reader
The USB2660I-JZX-03 is ideally suited to desktop PC front-panel multi-card readers because it integrates a 2-port USB 2.0 Hi-Speed hub with a multi-format flash media controller in a single 64-QFN (JZX) 9x9 mm package. Per the Microchip USB2660/USB2660i datasheet DS00001931B, its dual SD interfaces handle the SD, SDHC, and SDXC cards that dominate the consumer market, while the USB hub ports supply downstream connectors on the front panel. The 480 Mbps Hi-Speed upstream link ensures UHS-I card throughput is not bottlenecked, and the industrial -40C to +85C range tolerates chassis-internal thermal rise. Designers typically pair the device with two USB Type-A connectors and a single combo card slot wired to all four card formats to maximize user-facing value at minimal BOM cost.
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Notebook PC Media Reader Bay
Inside notebook PCs the USB2660I-JZX-03 consolidates the multi-card reader and the docking-station USB ports into one chip, shrinking the motherboard footprint versus discrete hub + reader solutions. Per the Microchip datasheet DS00001931B, its 9x9 mm 64-QFN package is small enough for slim notebook chassis, while its internal transaction translator lets a Hi-Speed upstream coexist with Full-Speed keyboards on the same downstream port without throughput loss. The chip's Suspend and low-power modes align with notebook idle-power budgets, and the integrated card-power FETs remove external switches that would otherwise draw quiescent current. Industrial temperature grade ensures stable operation when the chassis thermal envelope approaches 80C under extended load.
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Multi-Function Printer (MFP) Card Reader
Multi-function printers expose SD and Memory Stick slots for direct-print workflows, and the USB2660I-JZX-03 provides these card-reader functions plus two downstream USB host ports for walk-up USB printing in a single device. According to the Microchip USB2660/USB2660i datasheet DS00001931B, the chip's dual SD interfaces can serve both an SD card slot and an SDIO Wi-Fi adapter via SDIO-to-USB bridging, replacing a separate SDIO controller in MFP designs. Its USB-IF certified hub silicon eliminates MFP-side USB re-certification cost, and the -40C to +85C industrial range handles the elevated internal temperatures of laser-printer engine bays.
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Docking Station USB + Card Reader
Universal docking stations for laptops need multiple USB ports and frequently an SD card slot for photographers and videographers; the USB2660I-JZX-03 supplies exactly two downstream USB 2.0 Hi-Speed ports plus dual SD interfaces in a single 9x9 mm QFN. Per the Microchip datasheet, the upstream port negotiates Hi-Speed at 480 Mbps against the host laptop, and the integrated card-reader silicon avoids the need for a separate Realtek or Genesys reader chip on the dock PCB. Industrial temperature grade covers docks mounted under desks or in hot retail-display environments, and the exposed thermal pad ties to the dock's metal chassis for heat-spreading.
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Industrial Panel PC and HMI
Industrial panel PCs and human-machine interfaces (HMIs) integrate a touchscreen, multiple USB ports, and frequently a card slot for firmware updates or data logging; the USB2660I-JZX-03 delivers both the 2-port USB 2.0 hub and the SD card interface from a single 9x9 mm QFN. According to the Microchip USB2660/USB2660i datasheet DS00001931B, the industrial -40C to +85C temperature range and rugged QFN package suit factory-floor environments where vibration, dust, and temperature swings would damage commercial-grade controllers. The internal per-port transaction translator prevents a Full-Speed touchscreen from downgrading the upstream Hi-Speed link, preserving responsive UI performance.
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Set-Top Box Media Reader
Set-top boxes, Android TV boxes, and over-the-top (OTT) streaming devices expose SD card slots for media playback and local recording while also providing USB ports for external storage and peripherals. The USB2660I-JZX-03 combines both functions in one chip, per the Microchip datasheet DS00001931B. Its 480 Mbps Hi-Speed upstream and dual SD support allow 4K-capable media playback from a local SD card while downstream USB 2.0 ports run a remote-control dongle and an external HDD concurrently. The industrial temperature grade prevents thermal shutdown in poorly ventilated media-cabinet installations, and the small 9x9 mm QFN footprint leaves room on the main PCB for heat-sinked SoCs and DRAM.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für USB2660I-JZX-03 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | USB2660I-JZX | USB2660-JZX | USB2660I-JZX-03-TR | USB2640I-JZX | USB2630-JZX |
|---|---|---|---|---|---|---|
| Package | 64-QFN (JZX) 9x9 mm | 64-QFN (JZX) 9x9 mm - same | 64-QFN (JZX) 9x9 mm - same | 64-QFN (JZX) 9x9 mm - same | 64-QFN (JZX) 9x9 mm - same | 64-QFN (JZX) 9x9 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +70C) |
| Number of USB Downstream Ports | 2 | 2 | 2 | 2 | 2 | 2 |
| Flash Card Reader | Multi-format + dual SD | Multi-format + dual SD | Multi-format + dual SD | Multi-format + dual SD | Multi-format + single SD | Hub-only, no card reader |
| USB Speed | Hi-Speed 480 Mbps | Hi-Speed 480 Mbps | Hi-Speed 480 Mbps | Hi-Speed 480 Mbps | Hi-Speed 480 Mbps | Hi-Speed 480 Mbps |
| Packaging Format | Tray | Tray | Tray | Tape and Reel | Tray | Tray |
| SDIO Bridging | Supported (custom firmware) | Supported | Supported | Supported | Supported | Not applicable (no card reader) |
| Lifecycle Status | Active | Active | Active | Active | Active | NRND or Active (verify per Microchip) |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade across USB2660I family (vs. USB2660-JZX (commercial grade))
- Two SD interfaces plus USB hub in one chip (vs. USB2640I-JZX (single SD + hub))
- Highest-port-count hub and full media reader (vs. USB2630-JZX (hub only))
Designhinweise
Route the upstream DP_UP/DM_UP pair and the two downstream DP1/DM1, DP2/DM2 pairs as 90-ohm differential microstrip on the top layer, keeping length matching within 150 mils. Per the Microchip USB2660/USB2660i datasheet DS00001931B reference design, the differential pairs must clear the 24 MHz crystal traces by at least 3 mm to avoid coupling jitter into the USB clock domain. Stitch the inner ground plane beneath the differential pairs with vias every 1 cm to maintain a continuous return path. The exposed thermal pad (pin 65) must be soldered to a contiguous ground pour with at least 9 thermal vias (1 mm pitch) to meet USB-IF Hub Certification thermal-rise limits.
Place a 10 uF bulk capacitor and a 0.1 uF decoupling capacitor adjacent to every VDD33 pin (pins 11, 12, 64). Per the Microchip USB2660/USB2660i datasheet DS00001931B, the internal 1.2V LDO that supplies VDD12 (pin 13) requires a 1 uF ceramic on its output. Total inrush current during USB attach can exceed 200 mA for the entire chip; use a 3.3V LDO or switching regulator rated for at least 500 mA to prevent input sag. VBUS1 and VBUS2 (pins 3 and 6) need their own 1 uF local capacitors to stabilize the downstream-port sense comparators during hot-plug events.
Select a 24 MHz crystal with ESR less than 50 ohms and load capacitance matching the XTAL1/XTAL2 pin capacitance specified in the Microchip USB2660/USB2660i datasheet DS00001931B. Place the crystal less than 5 mm from pins 16 and 17 to keep the trace parasitic capacitance below 5 pF and avoid USB eye-diagram failures during USB-IF compliance testing. Guard the crystal traces with a ground ring tied to the system ground to prevent radiated emissions. RBIAS (pin 18) requires an external 12.1 kohm 1% resistor to ground; do not omit this part or USB signaling will fail compliance.
Estimated: When an external I2C EEPROM is installed for custom VID/PID/strings, the SDA (pin 21) and SCL (pin 22) lines must be pulled up to VDD33 with 4.7 kohm resistors - omit the EEPROM if you want the ROM-default descriptors. Do not connect SD_CD1/SD_CD2 (pins 35/36) to active-low signals without a hardware debounce cap; software debounce alone can cause spurious card insertion events. The OC1/OC2 over-current sense inputs (pins 7/8) are 3.3V-tolerant only; exceeding this can latch-up the device. Always hold RESET low for at least 10 ms after VDD33 reaches 3.0V to ensure clean enumeration.
Compliance-Informationen
RoHS and REACH compliance per Microchip product page. USB-IF Hub certification per the Microchip USB2660 family. AEC-Q100 is not applicable (USB controllers are not automotive-qualified - choose TUSB4041IPAPQ1 for automotive USB hub applications).
