VSC8248YJH-02 - 4-Port 11.3 Gbps SFI-to-XFI CDR | Microchip
Teilenummer: VSC8248YJH-02 ✓ AktivVSC8248YJH-02 Übersicht
A clock and data recovery IC is a timing-recovery semiconductor used in high-speed serial links to recover the transmitted clock from the data stream and regenerate a synchronized data output. In the broader hierarchy, the VSC8248 belongs to clock and timing ICs, interface ICs, and application-specific clock/timing semiconductors. Its four-port architecture allows one device to serve multiple high-speed channels while centralizing configuration and diagnostics.
The principal operating capability is the supported 8.5 Gbps to 11.3 Gbps per-channel data-rate range. Four outputs support independent high-speed interface channels, while integrated EDC extends usable reach by compensating signal degradation. The manufacturer documentation also identifies programmable output and integrated diagnostics as major device features, making the IC suitable for systems where link health must be monitored during operation rather than only during manufacturing.
The VSC8248YJH-02 is intended for optical and copper Ethernet infrastructure equipment operating at multi-gigabit line rates. Its SFI-to-XFI conversion function allows a system to use different serial-interface conventions on the line-card and backplane sides. The 225-FCBGA package provides a high pin count for power distribution, high-speed differential signaling, configuration, monitoring, and diagnostic functions, but it also requires a dense multilayer PCB and careful high-speed layout practices.
Typical applications include Ethernet switches, routers, optical line cards, network-interface equipment, telecommunications aggregation systems, and high-speed backplane equipment. The four-channel organization can reduce the number of discrete conversion devices required in a multiport line card while providing consistent clock recovery and diagnostics across channels.
Designers should preserve controlled-impedance routing for every high-speed differential pair, maintain continuous reference planes, and place decoupling and clock-support components according to the manufacturer evaluation-board layout. Because the FCBGA has a dense pitch and numerous supply connections, power and ground planes require careful partitioning to prevent coupled noise from degrading CDR margin. Production designs should also validate the complete SFI and XFI channel in the target connector, cable, optical, or backplane environment.
This product page combines the verified device identity, package format, interface conversion, supported data-rate range, and EDC capability with practical PCB guidance, application guidance, and strict drop-in-replacement analysis. The component is positioned for engineers evaluating a four-port, 11.3 Gbps-capable CDR rather than a general-purpose clock generator or conventional low-speed clock buffer.
Drop-in-Alternativen für VSC8248YJH-02 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Für dieses Produkt sind keine Drop-in-Alternativen verfügbar.
Alternativen anfordernVSC8248YJH-02 Technische Daten
| Product Type | Ethernet clock and data recovery IC |
| Number of Ports | 4 ports |
| Anzahl der Ausgänge | 4 outputs |
| Minimum Data Rate | 8.5 Gbps |
| Maximum Data Rate | 11.3 Gbps |
| Input Interface | SFI |
| Output Interface | XFI |
| Electronic Dispersion Compensation | Integrated EDC |
| Programmable Output | Supported |
| Integrated Diagnostics | Supported |
| Gehäuse | 225-FCBGA (16 mm x 16 mm) |
| Pin-Anzahl | 225 pins |
| Montageart | Surface mount |
VSC8248YJH-02 225-fcbga (16 mm x 16 mm) Pinbelegungsleitfaden
Pinbelegung für VSC8248YJH-02 (225-fcbga (16 mm x 16 mm)-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für VSC8248YJH-02.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
VSC8248YJH-02 ist geeignet für 6 Anwendungs: Multi-Gigabit Ethernet Switch Line Cards, Optical Network Equipment, High-Speed Network Interface Equipment, Telecommunications Aggregation Platforms, High-Speed Backplane Interface Cards, Data-Center Ethernet Appliances.
Multi-Gigabit Ethernet Switch Line Cards
The VSC8248YJH-02 fits Ethernet switch line cards that require several high-speed serial channels to be recovered and translated from SFI to XFI. Its four-port architecture supports rates from 8.5 Gbps to 11.3 Gbps, while integrated EDC helps offset signal degradation in the implemented channel. The 225-FCBGA consolidates conversion, clock recovery, programmable outputs, and diagnostics into one device, reducing the need for separate multi-channel CDR components. The trade-off is a demanding PCB implementation: differential impedance, return paths, power partitioning, and thermal performance must be designed together rather than validated only after assembly.
Empfohlen
Optical Network Equipment
Optical routers, transmission systems, and aggregation platforms can use the VSC8248YJH-02 where SFI and XFI serial interfaces coexist across a channel. The supported 8.5 Gbps to 11.3 Gbps range provides a clear performance envelope for multi-gigabit links, while EDC offers compensation for signal integrity loss across the implemented path. Integrated diagnostics are especially valuable in fielded equipment because they can help identify channel behavior and system-level faults. Engineers should still characterize the complete optical, connector, and PCB path rather than assuming EDC alone guarantees a fixed distance or margin in every implementation.
Empfohlen
High-Speed Network Interface Equipment
The VSC8248YJH-02 is appropriate for network-interface modules and appliances that recover clocks from incoming serial data before forwarding it through an XFI interface. Its four outputs allow several 8.5 Gbps to 11.3 Gbps paths to use a consistent conversion architecture, reducing duplicated board area. Integrated EDC and diagnostics provide additional tools for maintaining link integrity, although they do not replace careful channel characterization. The 225-FCBGA package needs a multilayer board with carefully allocated power planes and short, impedance-controlled escape routes for every high-speed differential pair.
Empfohlen
Telecommunications Aggregation Platforms
Aggregation platforms handling multiple multi-gigabit channels can benefit from the four-port VSC8248YJH-02 architecture. The device converts SFI data to XFI while recovering timing, supporting 8.5 Gbps to 11.3 Gbps per interface, and adds EDC to help manage degradation. Programmable outputs and integrated diagnostics give system engineers additional control and observability compared with a passive retimer-only implementation. Because the device is a high-pin-count FCBGA, its benefit is strongest on high-channel-count boards where the savings in conversion components outweigh the additional routing and assembly complexity.
Empfohlen
High-Speed Backplane Interface Cards
The VSC8248YJH-02 can support SFI-to-XFI clock and data recovery on dense backplane interface cards operating between 8.5 Gbps and 11.3 Gbps. Four channels and integrated EDC can simplify signal-conditioning repetition across multiple links, while programmable outputs and diagnostics support configuration and fault monitoring. Backplane implementation is especially sensitive to loss, skew, reflections, and crosstalk, so the PCB stack-up and connector geometry must be modeled before layout release. The manufacturer's reference design and evaluation-board layout should guide via placement, return-path continuity, and power-plane partitioning.
Empfohlen
Data-Center Ethernet Appliances
Data-center Ethernet appliances can use the VSC8248YJH-02 when multiple high-speed line-side ports require clock recovery and SFI-to-XFI conversion. The four-port arrangement supports 8.5 Gbps to 11.3 Gbps operation, and integrated EDC supports channel margin in dense equipment with short but electrically complex routes. Diagnostics provide useful observability for production testing and deployed systems. Engineering teams should evaluate heat flow from the 225-FCBGA alongside signal integrity, because the four active channels and high-speed I/O can concentrate both switching activity and power delivery demands around the device.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für VSC8248YJH-02 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt |
|---|---|
| Brand | Microchip Technology |
| Package | 225-FCBGA (16 mm x 16 mm) |
| Product Type | Ethernet clock and data recovery IC |
| Number of Ports | 4 ports |
| Number of Outputs | 4 outputs |
| Minimum Data Rate | 8.5 Gbps |
| Maximum Data Rate | 11.3 Gbps |
| Input Interface | SFI |
| Output Interface | XFI |
| Electronic Dispersion Compensation | Integrated EDC |
| Programmable Output | Supported |
| Integrated Diagnostics | Supported |
Wichtigste Unterscheidungsmerkmale
- Four high-speed conversion channels in one device (vs. Conventional single-channel clock buffer)
- Integrated EDC for high-speed channel compensation (vs. Retimer without dispersion compensation)
- Programmable outputs and integrated diagnostics (vs. Fixed-function clock buffer)
Designhinweise
Route every SFI and XFI differential pair as a controlled-impedance structure with continuous reference planes and tightly matched length and delay characteristics. Avoid plane splits beneath high-speed pairs, use the manufacturer evaluation layout as the geometric baseline, and place vias symmetrically where lane transitions occur. The 225-FCBGA escape region requires especially short launch structures because loss and skew accumulated before the device can materially reduce link margin.
Follow the manufacturer reference schematic and PCB layer stack-up for supply decoupling and power-plane distribution around the 225-FCBGA. Place the required high-frequency bypass capacitors adjacent to their assigned power balls and preserve low-impedance connections from the package into the planes. Separate sensitive input-return paths from noisy output-return paths where the reference design recommends it, and verify voltage limits at the balls under worst-case data-rate and diagnostic activity.
Evaluate junction temperature and PCB copper spreading at the full operating data rate because four active CDR channels can create concentrated local heating in the 225-FCBGA. Use the manufacturer thermal information for the selected ambient and airflow conditions, preserve exposed package heat-transfer paths, and avoid placing heat-generating components directly beneath the device. Validate thermal performance in the final enclosure rather than relying only on an unshorted bench-top board.
Validate SFI and XFI compliance using the complete channel, including package transitions, PCB routes, connectors, and any optical or copper media in the design. Test at 8.5 Gbps and 11.3 Gbps because eye-width and jitter margin can change across the supported range. Use the integrated diagnostics as supporting evidence, but retain eye, jitter, and BER measurements in the qualification process because diagnostics do not replace channel testing.
Compliance-Informationen
No definitive RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statement is identified for this exact MPN. Check the Microchip product page and the latest manufacturer documentation for the applicable declarations.
