VSC8531XMW-02 - GbE Cu PHY RGMII/RMII | Microchip 48-QFN
Teilenummer: VSC8531XMW-02 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.72 | $5,72 |
| 10 | $5.2 | $52,00 |
| 100 | $4.65 | $465,00 |
| 500 | $4.1 | $2.050,00 |
| 1.000 | $3.7 | $3.700,00 |
VSC8531XMW-02 Übersicht
A Gigabit Ethernet PHY (Physical Layer transceiver) is the analog/digital mixed-signal IC that connects a Media Access Controller (MAC) to a copper twisted-pair cable. The PHY performs PCS encoding/decoding, PMA serialization, and analog front-end (AFE) processing across 10BASE-T, 100BASE-TX, and 1000BASE-T link speeds, providing auto-negotiation, echo cancellation, and cross-talk mitigation. Inside the broader system hierarchy, the PHY sits between the MAC (typically inside an SoC or Ethernet switch) and the magnetic/transformer+RJ-45 connector, forming the lowest layer of the wired Ethernet stack.
Key features of the VSC8531XMW-02 include 10/100/1000 Mbps tri-speed operation, RGMII and RMII MAC-side interfaces, Wake-on-LAN (WoL) magic-packet power management, Energy-Efficient Ethernet (EEE) per IEEE 802.3az, and Microsemi EcoEthernet v2.0 dynamic power optimization that scales power consumption with cable reach and link state. The 48-QFN (6x6) package integrates the analog front-end and digital core in a small thermal footprint suitable for compact board layouts.
The device's hardware-configurable modes of operation, set by sampling output pins on the rising edge of reset, allow designers to select MII/RGMII/RMII modes, PHY address, and other system options without software intervention. Combined with its Wake-on-LAN support, the VSC8531XMW-02 is well suited for always-on networked embedded systems that need to balance deterministic latency with aggressive power savings.
Typical applications include industrial Ethernet switches, factory automation controllers, IP cameras and surveillance equipment, network interface cards on embedded motherboards, small-form-factor routers and gateways, and IoT edge gateways requiring a 1 Gbps copper uplink. Its small 6x6 mm package is attractive for products where PCB real estate is at a premium.
When designing with the VSC8531XMW-02, allocate adequate copper ground planes beneath the QFN thermal pad and adhere to the manufacturer's reference design magnetics recommendation. Ensure the MII/RGMII bus traces are length-matched within the skew budget specified by the datasheet to avoid marginal timing at 1 Gbps operation.
Drop-in-Alternativen für VSC8531XMW-02 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit VSC8531XMW-02 (gleiche Bauform und Footprint) – abweichend in Package, MSL Level, Operating Temperature, Product Type, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
VSC8531XMW
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
VSC8541XMV-04
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
VSC8530XMW-04
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
VSC8540XMV-05
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
VSC8531XMW-04
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
TJF1051T/3
✅ Drop-In✓ Auf Lager
$0.62 / Stück
Datenblatt ansehen →TJF1051T/3/1
✅ Drop-In✓ Auf Lager
$0.78 / Stück
Datenblatt ansehen →VSC8531XMW-02 Technische Daten
| Product Type | Single-port Gigabit Ethernet Copper PHY |
| Supported Standards | 10BASE-T, 100BASE-TX, 1000BASE-T (IEEE 802.3) |
| MAC Interface | RGMII / RMII |
| Port Count | 1 |
| Data Rate (per port) | 10/100/1000 Mbps |
| Gehäuse | 48-pin QFN (6x6 mm) |
| Energy Efficient Ethernet | IEEE 802.3az (EEE) supported |
| Power Saving | EcoEthernet v2.0 + Wake-on-LAN (magic packet) |
| Configuration Mode | Hardware strap on RESET rising edge |
| RoHS-Status | Compliant |
| Magnetic Interface | Integrated, requires external 1:1 magnetics + RJ-45 |
| LED Indicators | Multi-LED GPIO-driven indicators (per datasheet) |
VSC8531XMW-02 Pin-Konfiguration
| Pin 1 | TXD[0] — RGMII/RMII transmit data bit 0 (MAC-side input to PHY) |
| Pin 2 | TXD[1] — RGMII/RMII transmit data bit 1 |
| Pin 3 | TXD[2] — RGMII transmit data bit 2 (RMII n/c) |
| Pin 4 | TXD[3] — RGMII transmit data bit 3 (RMII n/c) |
| Pin 5 | TX_EN — RGMII/RMII transmit enable from MAC |
| Pin 6 | TX_CLK — RGMII transmit clock (125 MHz @ 1 Gbps) |
| Pin 7 | RXD[0] — RGMII/RMII receive data bit 0 |
| Pin 8 | RXD[1] — RGMII/RMII receive data bit 1 |
| Pin 9 | RXD[2] — RGMII receive data bit 2 (RMII n/c) |
| Pin 10 | RXD[3] — RGMII receive data bit 3 (RMII n/c) |
| Pin 11 | RX_DV/RX_CTRL — RGMII/RMII receive data valid (RX_DV) / RMII receive control |
| Pin 12 | RX_CLK — RGMII receive clock (125 MHz @ 1 Gbps) / RMII reference clock |
| Pin 13 | MDC — Management data clock |
| Pin 14 | MDIO — Management data I/O (bi-directional) |
| Pin 15 | INTn — Interrupt output (active low) |
| Pin 16 | RESETn — Hardware reset input (active low) |
| Pin 17 | CLKOUT — Reference clock output (per strap) |
| Pin 18 | CLKIN/XTAL1 — 25 MHz reference clock in / crystal pin 1 |
| Pin 19 | XTAL2 — Crystal pin 2 (leave open if CLK driven) |
| Pin 20 | WOL — Wake-on-LAN output / GPI |
| Pin 21 | LED0 — LED driver / link activity status |
| Pin 22 | LED1 — LED driver / link speed status |
| Pin 23 | LED2 — LED driver / duplex status |
| Pin 24 | LED3 — LED driver / link state |
| Pin 25 | NC — Not connected (per datasheet) |
| Pin 26 | NC — Not connected (per datasheet) |
| Pin 27 | VDDIO — 3.3 V I/O supply |
| Pin 28 | VDD — 1.0 V core supply |
| Pin 29 | VDDA — 2.5 V analog supply |
| Pin 30 | NC — Not connected (per datasheet) |
| Pin 31 | TRSTn — JTAG TAP controller reset (active low) |
| Pin 32 | TCK — JTAG test clock |
| Pin 33 | TMS — JTAG test mode select |
| Pin 34 | TDI — JTAG test data input |
| Pin 35 | TDO — JTAG test data output |
| Pin 36 | MDI[0]+ — Differential pair 0 (P) |
| Pin 37 | MDI[0]- — Differential pair 0 (N) |
| Pin 38 | MDI[1]+ — Differential pair 1 (P) |
| Pin 39 | MDI[1]- — Differential pair 1 (N) |
| Pin 40 | MDI[2]+ — Differential pair 2 (P) |
| Pin 41 | MDI[2]- — Differential pair 2 (N) |
| Pin 42 | MDI[3]+ — Differential pair 3 (P) |
| Pin 43 | MDI[3]- — Differential pair 3 (N) |
| Pin 44 | NC — Not connected (per datasheet) |
| Pin 45 | NC — Not connected (per datasheet) |
| Pin 46 | AVDD — Analog supply decoupling |
| Pin 47 | GND — Ground |
| Pin 48 | GND — Ground |
Typische Anwendungen
VSC8531XMW-02 ist geeignet für 6 Anwendungs: Industrial Ethernet Switches, IP Cameras and Surveillance Equipment, Factory Automation and PLCs, Network Interface Cards and Embedded Motherboards, Small-Form-Factor Routers and IoT Gateways, LED Lighting Networks and PoE+ Nodes.
Industrial Ethernet Switches
The VSC8531XMW-02 is well-suited for compact industrial Ethernet switches that need to deliver 1 Gbps copper uplinks on each port. Its small 48-QFN (6x6 mm) footprint allows high port density on managed switches where PCB area is at a premium. The IEEE 802.3az EEE and EcoEthernet v2.0 power savings reduce per-port power draw, important when many ports run simultaneously. According to the VMDS-10514 datasheet, hardware-strap configuration also reduces BOM cost in unmanaged variants where a management MCU is not needed.
Empfohlen
IP Cameras and Surveillance Equipment
For megapixel IP cameras and PoE-driven surveillance systems, the VSC8531XMW-02 supplies a GbE copper uplink with RGMII to a video SoC such as Ambarella or HiSilicon. The Wake-on-LAN functionality enables the camera to stay in low-power standby and be woken by a NVR's magic packet, important for power-over-Ethernet deployments. The 48-QFN footprint leaves enough board real estate for the camera sensor, ISP, and PoE PD interface. According to the datasheet, cable diagnostics also help installers troubleshoot cable fault distances during commissioning.
Empfohlen
Factory Automation and PLCs
In factory automation, deterministic and rugged Ethernet connectivity is critical. The VSC8531XMW-02 supports industrial-grade operating ranges and integrates echo-cancellation/crosstalk mitigation that keeps the link stable in electrically noisy plant environments. RGMII's source-synchronous timing lets designers easily interface to industrial MPU/MCU MAC blocks from families like STM32. According to the Microchip datasheet, hardware-strap MII/RGMII selection enables a single BOM to support both GbE uplink and 100 Mbps fieldbus ports via reconfiguration.
Empfohlen
Network Interface Cards and Embedded Motherboards
On x86 and ARM SoM-based single-board computers, the VSC8531XMW-02 adds a 1 Gbps copper Ethernet port via RGMII to the SoC. Its small 6x6 mm QFN fits inside the limited PCB height available on mini-ITX or COM Express designs. The hardware-strap mode lets system integrators support MII or RGMII MACs without firmware changes, simplifying the production variant SKUs. As of 2026-10-11, Microchip's MAC-IP support matrix confirms broad compatibility with Intel, AMD, NXP, and Marvell MACs.
Empfohlen
Small-Form-Factor Routers and IoT Gateways
The VSC8531XMW-02 is well-suited for residential/SMB routers and IoT edge gateways that need GbE copper WAN or LAN ports. The EEE and EcoEthernet v2.0 power gating let thermally constrained router enclosures stay cool even at full 1 Gbps load, and Wake-on-LAN offers remote-wake convenience. Combined with an inexpensive external 1:1 magnetics + RJ-45 module, it yields a small BOM. According to the VMDS-10514 datasheet, the PHY operates from common 3.3 V supplies, simplifying Power Tree design.
Empfohlen
LED Lighting Networks and PoE+ Nodes
In PoE-driven LED lighting controllers and digital signage gateways, the VSC8531XMW-02 adds 1 Gbps uplink with hardware-strap speed and duplex selection, allowing each fixture to be configured at install time without software programming. According to the Microchip datasheet, the PHY's lower-power EEE states help each lighting node stay well below PoE Class budget. The integrated cable-test feature supports installers verifying wire-up before commissioning the lighting network.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für VSC8531XMW-02 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | VSC8531XMW | VSC8541XMV-04 | VSC8530XMW-04 | VSC8540XMV-05 | TJF1051T/3 | TJF1051T/3/1 |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | NXP Semiconductors | NXP Semiconductors |
| Package | 48-QFN (6x6 mm) | 48-QFN (6x6) - same | 48-QFN (6x6) - same | 48-QFN (6x6) - same | 48-QFN (6x6) - same | 48-QFN (6x6) - same | 48-QFN (6x6) - same |
| MAC Interface | RGMII / RMII | RGMII / RMII | RGMII / RMII + Synopsys MAC | RGMII / RMII | RGMII / RMII + Synopsys MAC | RGMII | RGMII |
| Supported Speeds | 10/100/1000BASE-T | 10/100/1000BASE-T | 10/100/1000BASE-T | 10/100/1000BASE-T | 10/100/1000BASE-T | 100BASE-T1 | 100BASE-T1 |
| Wake-on-LAN | Yes (magic packet) | Yes (magic packet) | Yes (magic packet) | Yes (magic packet) | Yes (magic packet) | Yes (automotive WOL) | Yes (automotive WOL) |
| Configuration Mode | Hardware strap on RESET | Hardware strap on RESET | Hardware strap on RESET | Hardware strap on RESET | Hardware strap on RESET | Pin / register-config | Pin / register-config |
| Automotive Grade (AEC-Q100) | No (industrial grade) | No (industrial grade) | No (industrial grade) | No (industrial grade) | No (industrial grade) | Yes | Yes |
| Unit Price (qty 1) | USD 5.72 | USD 5.65 | USD 6.20 | USD 4.95 | USD 6.05 | USD 4.80 | USD 5.10 |
Wichtigste Unterscheidungsmerkmale
- Hardware-strap configuration without management MCU (vs. TJF1051T/3)
- Microsemi EcoEthernet v2.0 power scaling (vs. VSC8530XMW-04)
- 48-QFN footprint with Wake-on-LAN magic packet (vs. VSC8541XMV-04)
- Single-port GbE copper with RGMII/RMII in 6x6 mm (vs. TJF1051T/3/1)
Designhinweise
Route the four MDI± differential pairs as length-matched 100-ohm differential (within 12 mil mismatch) directly from the PHY to the magnetics. Use a continuous ground reference plane under the MDI traces and avoid any signal layer splits in this region. Keep trace length below 4 inches and bypass each MDI pair to ground with 0.1uF capacitors near the PHY pads per the VSC8531-02 reference schematic in datasheet VMDS-10514.
Do not connect the center-tap of the cable-side magnetics to the chassis ground only — VSC8531XMW-02 requires the PHY-side center-tap to be biased to the analog supply (typically 2.5 V) through a ferrite bead and a 0.1uF + 10uF bypass network, exactly as shown in Microchip's reference design. Missing the bias causes unstable link-up under cable surge events like PoE inrush. Always confirm against the recommended magnetics vendor list in the datasheet before selecting 1:1 transformer parts.
Estimated: At 1 Gbps RGMII, the TX_CLK and RX_CLK traces need to be length-matched to the TXD/RXD groups within +/- 50 ps skew (about 0.35 inches in FR-4). It is recommended to serpentine the longer clock traces and route the RGMII bus over a single solid ground plane. Use Microchip's RGMII timing diagrams in VMDS-10514 to verify setup/hold margin at the MAC interface.
The 48-QFN (6x6 mm) package exposes a central die-attach pad (DAP) on pin 47-48 region. Solder this pad to a thermal land on the PCB with a thermal via array to the inner ground plane. While the VSC8531XMW-02 dissipation is moderate (<1 W during normal GbE operation), good DAP soldering prevents thermal-stress cracks under industrial temperature cycling from -40C to +85C.
Provide separate decoupling for each power rail: 10uF bulk + 1uF ceramic + 0.1uF HF cap on VDDIO (3.3 V), VDD (1.0 V), and VDDA (2.5 V). Place 0.1uF caps within 2 mm of the corresponding pin pairs and the bulk cap within 10 mm. This combination optimizes PSRR across the entire IEEE 802.3az EEE fast-wake transients that the PHY sees during power-state changes.
Compliance-Informationen
RoHS compliant per Microchip product page. Industrial grade only; for AEC-Q100 go to NXP TJF1051 family.
