XC3S50A-4TQ144C - 50K Spartan-3A FPGA | AMD/Xilinx
Teilenummer: XC3S50A-4TQ144C ✗ AbgekündigtXC3S50A-4TQ144C Übersicht
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interconnect, and I/O resources are configured after manufacture. An FPGA sits within the programmable-logic hierarchy above simple fixed logic devices and below software-configured processors. Unlike a mask-programmable ASIC, an FPGA allows design revisions, field updates, and logic changes without fabricating a new custom chip. The XC3S50A-4TQ144C combines a moderate logic capacity with 108 user I/Os in a surface-mount TQFP package.
The primary headline features are 55,296 system gates, 1,584 logic elements, and 108 user I/Os. Search results also describe the device as a 50,000-system-gate Spartan-3A FPGA. Its 144-pin TQFP package provides 108 user I/Os for external interfaces and board-level connections, making this device suitable for compact embedded systems requiring substantial parallel connectivity.
The Spartan-3A architecture combines configurable logic, programmable I/O, dedicated memory resources, and clock-management resources within a single programmable device. The 90 nm fabrication process supports a compact and cost-sensitive implementation compared with larger, more complex programmable-logic devices. The device’s combination of moderate gate capacity and high I/O availability allows designers to consolidate control, interface, and state-machine functions without using a discrete combination of multiple smaller devices.
Typical applications include industrial control, instrumentation, communications equipment, consumer peripherals, embedded control, and general-purpose I/O expansion. The 108 user I/Os are especially useful for systems that need parallel data acquisition, digital control, display interfaces, or external memory connections. In these designs, the FPGA can implement parallel processing and control logic while its configuration system preserves update flexibility.
A primary design consideration is supply voltage and I/O compatibility. The available source material specifies a 1.2 V core but does not provide the complete recommended operating ranges, I/O standard options, configuration memory requirements, or power-loss configuration behavior. These values must therefore be confirmed against the complete manufacturer datasheet before schematic capture, pin assignment, and PCB layout are released.
This product data consolidates verified distributor specifications, package information, pricing, availability, and same-family replacement options with practical selection guidance. It adds value beyond a basic distributor listing by separating confirmed parameters from missing technical data and explaining where each Spartan-3A option is appropriate.
Drop-in-Alternativen für XC3S50A-4TQ144C – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit XC3S50A-4TQ144C (gleiche Bauform und Footprint) – abweichend in Device Type, Package Type, Speed Grade, System Gates.
XC3S50A-3TQ144C
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC3S50A-5TQ144C
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC3S50A-4TQ144I
✅ Drop-In ⚠️ Spezifikationen ungeprüftPreis auf Anfrage
Datenblatt ansehen →XC3S50A-3TQ144I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC3S50A-5TQ144I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC3S50A-4TQ144C Grenzwerte & elektrische Eigenschaften
| Device Type | Spartan-3A field-programmable gate array (FPGA) |
| System Gates | 55,296 gates |
| Nominal System Gate Density | 50,000 gates |
| Logic Elements | 1,584 logic elements |
| User I/O Count | 108 I/Os |
| Package Pin Count | 144 pins |
| Package Type | 144-pin TQFP |
| Montageart | Surface mount |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V |
| Speed Grade | -4 speed grade |
| Temperature Grade | Commercial grade |
| Architecture Blocks | 176 logic array blocks (LABs) or configurable logic cells (CLBs) |
| Programmability | Field-programmable digital logic and user I/O |
XC3S50A-4TQ144C 144-pin tqfp Pinbelegungsleitfaden
Pinbelegung für XC3S50A-4TQ144C (144-pin tqfp-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für XC3S50A-4TQ144C.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
XC3S50A-4TQ144C ist geeignet für 6 Anwendungs: Industrial Control and Automation, Test and Measurement Instrumentation, Communications Interface Consolidation, Embedded Control and Data Acquisition, Consumer and Peripheral Consolidation, Programmable I/O Expansion.
Industrial Control and Automation
The XC3S50A-4TQ144C fits industrial control equipment that requires parallel digital control, machine-state monitoring, and deterministic programmable logic. Its 108 user I/Os can connect sensors, actuators, limit switches, interlocks, and status indicators, while 1,584 logic elements can implement state machines and control protocols. The 90 nm Spartan-3A implementation also provides a practical cost and integration balance for high-volume control products. Because the target is a commercial-temperature option, the enclosure temperature must remain within the manufacturer’s commercial limits. An XC3S50A-4TQ144I alternative is more appropriate when the same control architecture must operate in a wider industrial temperature environment.
Empfohlen
Test and Measurement Instrumentation
The XC3S50A-4TQ144C is suitable for measurement and test systems that must coordinate many parallel channels while retaining precise timing and flexible logic. The 55,296-system-gate Spartan-3A device can implement acquisition control, trigger logic, timing generators, and data-routing functions, while 108 user I/Os reduce the need for separate multiplexing devices. Its 1.2 V core and 144-pin TQFP package support compact, high-density instrument boards. Engineers should budget board area for configuration storage, power conditioning, and I/O voltage compatibility. The commercial-grade suffix must also be checked against the internal temperature conditions of the instrument enclosure.
Empfohlen
Communications Interface Consolidation
The XC3S50A-4TQ144C can consolidate protocol handling, channel control, and packet routing in communications equipment where 108 user I/Os and moderate logic density are advantageous. It is appropriate for control-plane logic, legacy interface adaptation, and custom framing or synchronization functions surrounding standard communication transceivers. The programmable architecture permits protocol changes without a custom ASIC tape-out, which is valuable during product qualification. Timing closure and I/O standard selection remain critical because the verified source identifies the device but does not enumerate its complete I/O capability matrix. Validate every external interface against the manufacturer pinout and electrical tables before assigning pins.
Empfohlen
Embedded Control and Data Acquisition
The XC3S50A-4TQ144C fits embedded systems that combine parallel acquisition with FPGA-based filtering, decoding, or state-machine control. Its 1,584 logic elements can support moderate-width datapaths and control logic, and its 108 user I/Os provide substantial connectivity to sensors, counters, displays, and memory devices. The 144-pin TQFP package supports conventional surface-mount assembly while avoiding the complexity of a large ball-grid package. Power budgeting should account separately for the 1.2 V core and configurable I/O supplies because the verified data does not provide complete current ratings. Confirm signal-integrity requirements, termination, and supported I/O standards before final schematic release.
Empfohlen
Consumer and Peripheral Consolidation
The XC3S50A-4TQ144C is appropriate for high-volume commercial peripherals where programmable logic can replace several fixed-function devices and simplify product revisions. Potential uses include display-control glue logic, printer and copier sequencing, keyboard or interface controllers, and custom peripheral adapters. With 55,296 system gates and 108 user I/Os, the device provides meaningful integration without the cost of a much larger FPGA. Its commercial-grade classification is consistent with many indoor products, but actual ambient conditions must be checked. Because configuration requirements and supported I/O standards are absent from the supplied excerpts, schematic and PCB teams should use the complete manufacturer datasheet rather than rely on generic board assumptions.
Empfohlen
Programmable I/O Expansion
The XC3S50A-4TQ144C can provide a high-density programmable I/O layer for legacy systems that need more parallel control lines, custom decoding, or asynchronous interface coordination. Its 108 user I/Os are useful for collecting switch states, driving indicators, multiplexing legacy buses, and implementing protocol-aware control that would otherwise consume multiple programmable logic devices. The commercial temperature range makes it suitable for indoor commercial equipment when those limits are respected. The key design benefit is update flexibility: routing and control behavior can be changed in the FPGA configuration while preserving the 144-pin TQFP footprint. Verify all pins, supply rails, and configuration interfaces against the complete datasheet before production release.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC3S50A-4TQ144C – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC3S50A-3TQ144C | XC3S50A-5TQ144C | XC3S50A-4TQ144I | XC3S50A-3TQ144I | XC3S50A-5TQ144I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Device Family | Spartan-3A | Spartan-3A | Spartan-3A | Spartan-3A | Spartan-3A | Spartan-3A |
| Speed Grade | -4 | -3 | -5 | -4 | -3 | -5 |
| Temperature Grade | Commercial | Commercial | Commercial | Industrial | Industrial | Industrial |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Wichtigste Unterscheidungsmerkmale
- Balanced logic density and I/O availability (vs. XC3S50A-4TQ144I)
- Commercial-temperature target with three available same-family speed levels (vs. XC3S50A-3TQ144C)
- More timing performance than the -3 grade without moving to -5 (vs. XC3S50A-5TQ144C)
- Verified commercial availability and price reference (vs. XC3S50A-4TQ144I)
Designhinweise
Budget the 1.2 V core rail and every configurable I/O supply separately. The verified source confirms a 1.2 V core but does not provide core-current limits, I/O current limits, or recommended operating ranges. Before schematic release, obtain the complete manufacturer electrical tables and calculate worst-case supply current for the selected I/O standards, speed grade, configuration mode, and utilization. Decouple each supply close to the device and provide adequate bulk energy for configuration switching.
Use a manufacturer-referenced TQFP-144 land pattern and preserve the specified power, ground, configuration, clock, and I/O assignments. The supplied excerpts confirm a 144-pin TQFP package but do not contain the complete pin table, so engineers must not infer pin numbers from adjacent-package examples. Place configuration and programming interfaces so they remain accessible, route sensitive clocks away from fast I/O returns, and provide solid ground-plane continuity under the package.
Select I/O standards only after checking the manufacturer’s supported I/O matrix, voltage domains, drive strength, slew rate, and input thresholds. The target offers 108 user I/Os, but a large parallel interface can create simultaneous-switching-noise and return-path issues. Keep external drivers and ESD protection close to the connector, use short reference-plane return paths, and validate edge rates with signal-integrity simulation or measurement when long traces or demanding loads are present.
Do not treat the commercial “C” ordering suffix as proof of RoHS, REACH, lead-free, or automotive qualification, because those statuses are not stated in the supplied data. Likewise, a same-package alternative is only a drop-in candidate after checking configuration startup, power sequencing, I/O standards, timing constraints, and software support. Preserve the original device configuration and verify the replacement bitstream before using an industrial or different speed grade.
Compliance-Informationen
The supplied verified sources do not explicitly state RoHS, REACH, lead-free, halogen-free, conflict-minerals, or automotive qualification status. AEC-Q100 is marked not applicable because this commercial-temperature ordering option is not identified as an automotive-qualified variant.
