XC56L307VF160 - 24-Bit Fixed-Point DSP, 160MHz | NXP / Freescale
Teilenummer: XC56L307VF160 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.85 | $2.985,00 |
| 500 | $26.4 | $13.200,00 |
| 1.000 | $23.75 | $23.750,00 |
XC56L307VF160 Übersicht
What is a Fixed-Point DSP? A Digital Signal Processor is a specialized microprocessor whose architecture is optimized for the high-throughput, real-time numeric workloads of signal processing. Fixed-point DSPs represent samples as integers (here, 24-bit words) and execute multiply-accumulate operations in a single cycle, making them well-suited for cost-sensitive and power-sensitive signal chains. They sit within a broader hierarchy of: DSP -> microprocessor -> microcontroller -> semiconductor device.
Key features of the XC56L307VF160 include a 24 x 24-bit program RAM expansion area with a 24-bit instruction cache, a small 576-byte ROM area for boot/test code, and a memory architecture geared toward high-data-rate streaming applications. The 196-LBGA package and industrial temperature grade make it a common choice in densely-populated, thermally-contained systems.
Technically, the DSP56L307 uses a dual Harvard-style architecture with separate program and data memory spaces. The 24-bit datapath provides extended dynamic range for codec and modem algorithms, and the SSI (Synchronous Serial Interface) supports connection to common audio and voice codecs. The 160 MHz clock rate yields 160 MIPS of arithmetic throughput for typical MAC-heavy DSP kernels.
Typical applications include VoIP gateways, audio processing for conferencing systems, wireless baseband front-end processing, and industrial control loops where deterministic DSP performance is required. The combination of large on-chip memory and a strong peripheral set removes the need for an external SRAM, lowering system BOM cost.
When designing with this part, ensure your PCB layout provides adequate thermal dissipation through internal power/ground planes, because the LBGA package dissipates heat almost entirely through the PCB. Use the manufacturer reference design to validate ball-pin escape routing.
This page synthesizes distributor pricing, application context, drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für XC56L307VF160 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
XC56L307VF80
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSP56L307
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
XC56L307VF160 Technische Daten
| Type | Fixed-Point Digital Signal Processor |
| Core Clock Frequency | 160 MHz |
| Data Word Width | 24 bits |
| Instruction Word Width | 24 bits |
| On-Chip RAM | 576 KB |
| Non-Volatile Memory | ROM 576 B |
| I/O Voltage | 3.30 V |
| Interfaces | Host Interface, SSI, SCI |
| Gehäuse | 196-LBGA (15 x 15 mm) |
| Montageart | Surface Mount |
| Terminal Form | Ball |
| Number of Terminals | 196 |
| Package Code | LBGA |
| Package Shape | Square |
| Temperature Grade | Industrial |
| Packaging | Tray |
XC56L307VF160 square Pinbelegungsleitfaden
Pinbelegung für XC56L307VF160 (square-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für XC56L307VF160.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
XC56L307VF160 ist geeignet für 6 Anwendungs: VoIP Gateway and Conferencing, Wireless Infrastructure Baseband Front-End, Industrial Motor Control Loops, Audio Effects and Equalization, Medical Diagnostic Signal Processing, Automotive Audio Head Unit.
VoIP Gateway and Conferencing
The XC56L307VF160's 24-bit fixed-point DSP core at 160 MHz delivers the throughput required for multi-channel VoIP codecs (G.711/G.722/G.729) and acoustic-echo-cancellation in conferencing systems. The 576 KB on-chip RAM holds per-channel buffers and coefficient tables, eliminating external SRAM. The SSI peripheral interfaces directly to common audio codecs, while the SCI links to a host processor for signaling. Its 196-LBGA package supports compact, multi-channel gateway designs. Compared with a software-only ARM approach, the offloaded DSP yields deterministic latency required for packet-voice QoS.
Empfohlen
Wireless Infrastructure Baseband Front-End
The XC56L307VF160 fits wireless-infrastructure front-end preprocessing where deterministic DSP performance is required at low BOM cost. Its 160 MIPS throughput handles channel filtering and symbol-rate conversion tasks in small-cell baseband. The 576 KB of on-chip RAM buffers IQ data without external memory. The 3.30 V I/O matches legacy infrastructure supply rails. The 196-LBGA package and industrial temperature grade make it robust for outdoor equipment. Compared with a generic MCU, the dedicated MAC engine lowers cycle counts by 5-10x for typical baseband filters.
Empfohlen
Industrial Motor Control Loops
The XC56L307VF160 delivers deterministic, single-cycle MAC throughput for closed-loop motor-control algorithms such as FOC and PI current loops running at 10-20 kHz. The 24-bit datapath preserves precision over wide dynamic ranges required by torque estimation. The Host Interface allows a supervisory microcontroller to command setpoints, while the SCI delivers diagnostic telemetry. The 196-LBGA package sits comfortably on multi-axis servo drive boards. Compared with software-only control on an MCU, the DSP offload frees the MCU for commutation and safety tasks.
Empfohlen
Audio Effects and Equalization
The XC56L307VF160's 160 MHz core and large 576 KB on-chip RAM suit real-time audio effects such as reverb, parametric EQ, and dynamics processing across multiple channels. The SSI synchronously streams audio I/O to standard codecs, while the Host Interface accepts parameter updates from a host controller. The 24-bit datapath matches professional audio word lengths, preserving dynamic range through the processing chain. The LBGA package fits into 1U rack-mount audio processors. Compared with running the same algorithms on a fixed-point MCU, the DSP finishes each audio frame with margin for additional processing.
Empfohlen
Medical Diagnostic Signal Processing
The XC56L307VF160 is appropriate for medical diagnostic devices such as patient-monitoring filters and hearing-aid front-end processing where deterministic low-latency DSP is required. The 24-bit datapath preserves the dynamic range of low-amplitude physiological signals, and the 576 KB on-chip RAM accommodates adaptive filter coefficient storage. The Host Interface allows clinical-grade supervisory controllers to manage mode and alarm state. Industrial temperature grade supports portable instrument enclosures. Compared with a software DSP on a general-purpose MCU, the offloaded engine reduces bill-of-materials cost in regulated medical designs.
Empfohlen
Automotive Audio Head Unit
Although the XC56L307VF160 itself is not AEC-Q100 qualified, its wide availability in NRND channels and industrial temperature grade make it a candidate for non-safety audio-head-unit DSP functions in legacy automotive platforms. It handles multi-band EQ, active crossovers, and noise-cancellation algorithms in real time using its 24 x 24-bit MAC engine. The SSI streams to automotive-grade codecs, and the SCI provides diagnostic reporting. The 196-LBGA fits typical head-unit mainboards. Compared with a DSP-less head unit, the offloaded DSP frees the main MCU for HMI and connectivity tasks.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC56L307VF160 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC56L307VF80 | DSP56L307 |
|---|---|---|---|
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors |
| Package | 196-LBGA (15 x 15 mm) | 196-LBGA (15 x 15) - same | 196-LBGA - same |
| Core Clock Frequency | 160 MHz | 80 MHz | 160 MHz |
| Data Word Width | 24 bits | 24 bits | 24 bits |
| On-Chip RAM | 576 KB | 576 KB | 576 KB |
| Non-Volatile Memory | ROM 576 B | ROM 576 B | ROM 576 B |
| I/O Voltage | 3.30 V | 3.30 V | 3.30 V |
| Temperature Grade | Industrial | Industrial | Industrial |
| Lifecycle Status | NRND | NRND | NRND |
Wichtigste Unterscheidungsmerkmale
- Single-family lineage with same peripheral set across speed grades (vs. XC56L307VF80)
- Identical die family footprint across the marking scheme (vs. DSP56L307)
Designhinweise
The 196-LBGA package dissipates heat almost entirely through the PCB ball grid into internal power and ground planes. Designers must allocate at least four dedicated inner planes and stitch the thermal balls to the ground plane with a 4 x 4 via array beneath the die shadow. Without adequate plane copper and via stitching, junction temperature can rise above the industrial limit under sustained MAC workloads.
LBGA escape routing requires a 6+ layer stack-up with microvia or via-in-pad technology. Route signals on the top layer with the shortest possible fan-out to avoid stub effects that degrade the SSI and SCI timing margins. Use a matched 50-ohm impedance for the SSI clock line and length-match data signals within 0.5 mm to preserve setup/hold margins.
Decouple the XC56L307VF160 with one 0.1 uF X7R ceramic capacitor per power pin, placed within 2 mm of each ball. Add bulk 10 uF and 100 uF tantalum capacitors near each supply island. Because the device has multiple voltage rails (core, PLL, I/O), isolate them with a ferrite bead to prevent switching-noise coupling between the analog PLL supply and the digital rails.
Do not assume the 160 MHz core clock is freely user-programmable: the PLL reference and multiplier values are constrained by the silicon revision, and out-of-range settings can halt the part. Always consult the manufacturer's PLL configuration register map before reprogramming, and verify the boot-mode pins are pulled to the correct logic level at power-up to ensure proper ROM bootstrap.
Compliance-Informationen
RoHS, REACH, lead-free, and halogen-free status are not stated in the verified web data for this part. AEC-Q100 is not listed among the temperature/qualification grades; standard parts are industrial-grade only.
