AMD

XC6SLX4-L1TQG144C - 3840-Cell Spartan-6 LX FPGA | AMD

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1 V Vdss 144-LQFP Package L1 Speed
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XC6SLX4-L1TQG144C Übersicht

AMD XC6SLX4-L1TQG144C is a Spartan-6 LX field-programmable gate array with 3,840 logic cells, 102 I/O, 45 nm CMOS construction, and a 144-LQFP package rated for a 1 V core supply. It combines programmable logic, embedded block RAM, and digital signal processing resources in a deterministic package suitable for industrial control, communications, instrumentation, embedded processing, and cost-sensitive signal-processing systems.

A field-programmable gate array is a semiconductor whose digital logic is configured after manufacture. The FPGA category combines programmable logic blocks, memory, input/output resources, clocking, and configuration circuitry into one reconfigurable device. Within the AMD Spartan-6 LX family, the XC6SLX4 provides a comparatively compact implementation for designs that need moderate logic density without moving to a larger device or package.

The device offers 3,840 logic cells, 102 user I/O, a 45 nm CMOS process, and a 1 V core voltage. Its 144-LQFP package exposes the full Spartan-6 LX4 I/O and configuration interface while remaining compatible with conventional board-assembly and inspection processes. The L1 designation identifies a specific speed-grade ordering option, while the terminal suffix identifies the TQG144 package and C temperature-market option.

Spartan-6 LX devices support parallel and serial configuration paths, including boundary-scan JTAG programming described for this device. Boundary scan permits configuration data to be loaded through dedicated JTAG pins, supporting board-level programming and manufacturing test. Designers can also reuse the same pin-compatible family across designs when logic capacity, speed grade, or temperature-market suffix permits, provided the selected ordering option matches the design requirements.

Typical implementations include industrial control panels, programmable logic controllers, sensor aggregation systems, communications interface modules, test equipment, and low-to-moderate complexity embedded-processing platforms. The combination of 102 I/O and 3,840 logic cells is useful when a design needs many external connections without the resource level of a larger Spartan-6 device. The 144-LQFP package also simplifies prototype assembly compared with fine-pitch ball-grid-array packages.

Designs must account for configuration startup, clocking, decoupling, and signal-integrity requirements before schematic capture. Bank supply planning, VCCO requirements, JTAG access, and unused pins should be checked against the Spartan-6 pinout and configuration guidance. A one-volt core rail should be generated with appropriate sequencing and noise control, while I/O supply selection must remain compatible with the voltage standards used by connected devices.

This product page combines package, logic-resource, interface, and ordering information with practical design guidance, compatible same-brand ordering options, and a parameter-by-parameter comparison. These details help engineers distinguish speed-grade and temperature-market changes before modifying an existing 144-LQFP Spartan-6 LX4 design.

Drop-in-Alternativen für XC6SLX4-L1TQG144C – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit XC6SLX4-L1TQG144C (gleiche Bauform und Footprint) – abweichend in Package, Block RAM, Process Technology, Logic Cells, Speed Grade.

Xilinx
Package: 144-pin LQFP (TQG144)
Block RAM: 4,860 Kbits (216 Kb blocks)
Process Technology: 45 nm low-power CMOS
Vergleichen mit XC6SLX4-L1TQG144C →
AMD
Package: 144-pin TQFP
Block RAM: 221,184 bits
Process Technology: 45 nm
Vergleichen mit XC6SLX4-L1TQG144C →
AMD
Package: 144-LQFP, TQFP-144, 20 x 20 mm
Block RAM: 216 Kb
Speed Grade: -3
Vergleichen mit XC6SLX4-L1TQG144C →

XC6SLX4-2TQG144C

✅ Drop-In
Xilinx
📦 144-LQFP (TQG144)
Spartan-6 LX · XC6SLX4 · -2 · C (Commercial 0C to +85C) · 3,840 · 600 · 4,860 Kbits (216 Kb blocks) · 8

Preis auf Anfrage

Datenblatt ansehen →

XC6SLX4-2TQG144I

✅ Drop-In
AMD
📦 144-LQFP (TQG144)
Spartan-6 LX field-programmable gate array (FPGA) · 3,840 cells · 221,184 bits · 102 pins · 375 MHz · 1.14 V to 1.26 V · -2 · 144-pin TQFP

Preis auf Anfrage

Datenblatt ansehen →

XC6SLX4-3TQG144C

✅ Drop-In
AMD
📦 144-LQFP (TQG144)
Spartan-6 LX · 3,840 · 600 ALM · 300 CLB · 102 I/O · 216 Kb · 8 · -3

Preis auf Anfrage

Datenblatt ansehen →

XC6SLX4-L1TQG144C Grenzwerte & elektrische Eigenschaften

Device Type Spartan-6 LX field-programmable gate array
Logic Cells 3,840 cells
User I/O 102 I/O
Process Technology 45 nm CMOS
Core Supply Voltage 1 V
Gehäuse 144-LQFP
Terminal Count 144 terminals
Package Type Quad Flat Package
Montagestil Surface mount
Configuration Interface JTAG boundary scan
Programmable Logic Type Spartan-6 LX FPGA
Ordering Speed Designator L1
Package Code TQG144
Temperature-Market Suffix C

XC6SLX4-L1TQG144C tqg144 Pinbelegungsleitfaden

Pinbelegung für XC6SLX4-L1TQG144C (tqg144-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für XC6SLX4-L1TQG144C im tqg144-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für XC6SLX4-L1TQG144C.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

XC6SLX4-L1TQG144C ist geeignet für 6 Anwendungs: Industrial Control and Automation, Communications Interface Module, Sensor Aggregation and Signal Conditioning, Programmable Logic Controller, Test and Measurement Equipment, Embedded Processing Platform.

🏭

Industrial Control and Automation

The XC6SLX4-L1TQG144C fits compact industrial controllers that coordinate sensors, actuators, interlocks, and machine-status logic. Its 3,840 logic cells can host parallel control functions, while 102 user I/O provides substantial connectivity in a 144-LQFP package. The 1 V core and separate I/O supplies should be planned with appropriate sequencing and decoupling. Designers must also verify the C temperature-market option against the enclosure temperature, vibration, noise, and isolation requirements of the target industrial equipment.

🌐

Communications Interface Module

The Spartan-6 LX4 FPGA can implement protocol conversion, framing, buffering, and supervisory logic for communications equipment. Its 102 user I/O allows multiple parallel interfaces to coexist, while the 3,840-cell capacity is appropriate for moderate-throughput data paths rather than demanding processor cores. The 144-LQFP footprint simplifies routing into conventional equipment chassis. Interface timing, clock domains, impedance, and I/O voltage standards must be established before configuration, and a faster grade should be selected only after checking setup and hold margins.

🧩

Sensor Aggregation and Signal Conditioning

XC6SLX4-L1TQG144C is suitable for acquiring and conditioning inputs from multiple sensors, performing digital filtering, thresholding, diagnostics, and data packing. With 102 user I/O, the device can connect parallel sensor channels and associated control signals without requiring the pin density of a larger FPGA package. Its 3,840 logic cells support modest parallel logic and control blocks. Designers should reserve clock-capable pins, define input thresholds through the complete signal chain, and verify that the selected package and temperature-market suffix match the measurement environment.

🔧

Programmable Logic Controller

The XC6SLX4-L1TQG144C can serve as the programmable core of a small PLC or embedded sequencer because its 3,840 logic cells and 102 I/O accommodate parallel state machines, timers, interlocks, and communication interfaces. The 144-LQFP package provides a practical route for serviceable and visually inspectable control boards. Because deterministic behavior depends on configuration integrity and clocking, designers should validate startup behavior, watchdog handling, I/O isolation, and supply sequencing. A faster replacement can alter timing and dynamic power rather than simply increasing application capacity.

📺

Test and Measurement Equipment

The Spartan-6 LX4 device is applicable to programmable test systems, waveform generation, fixture control, timing controllers, and measurement-interface logic. Its 102 I/O supports multiple instrument and DUT connections, while the programmable architecture enables reusable sequencing and analysis functions. The 1 V core rail requires careful decoupling and clock distribution to preserve measurement quality. Engineers should assign clock-capable pins deliberately, control output transitions where needed, and confirm the 144-LQFP package keeps adequate creepage and clearance for the intended voltage levels.

🖥️

Embedded Processing Platform

The XC6SLX4-L1TQG144C can support modest embedded workloads involving parallel logic, bus arbitration, state-machine control, and dedicated hardware acceleration alongside a separate processor. Its 3,840 logic cells are useful for peripheral interfaces and fixed-function datapaths, while 102 I/O leave sufficient external connectivity for memory and communications. The 144-LQFP package makes prototype assembly and rework straightforward. System partitioning must preserve the FPGA’s fixed I/O, clock, configuration, and supply requirements, and timing should be rechecked for every speed-grade substitution.

What are the key specifications of XC6SLX4-L1TQG144C that engineers should know?
The XC6SLX4-L1TQG144C is a 3,840-cell Spartan-6 LX FPGA with 102 user I/O, 45 nm CMOS construction, a 1 V core supply, and a 144-LQFP package. According to the AMD/Xilinx Spartan-6 LX FPGA datasheet, it also supports JTAG boundary-scan configuration for board programming and manufacturing test. These figures define the device as a compact, surface-mount FPGA for moderate logic density and mixed I/O requirements.
Where can I download the XC6SLX4-L1TQG144C datasheet PDF?
The XC6SLX4-L1TQG144C datasheet PDF can be downloaded from the product document link on this page. AMD also publishes Spartan-6 package pinout files for PCB assignment, including the 144-TQG package. Use the manufacturer pin-description and package files when assigning every power, ground, configuration, clock, and user-I/O connection because the abbreviated distributor listings do not contain the complete signal table.
What is the XC6SLX4-L1TQG144C used for?
The XC6SLX4-L1TQG144C is used for programmable digital logic in industrial controls, communications interfaces, test equipment, sensor systems, and embedded-processing designs. Its 3,840 logic cells and 102 user I/O provide a practical balance for designs requiring numerous external connections. The 144-LQFP package also simplifies prototype assembly and inspection compared with a fine-pitch BGA package.
Where can I buy XC6SLX4-L1TQG144C online?
Use the Request a Quote form on this page to request XC6SLX4-L1TQG144C availability, current lead time, minimum order quantity, and delivery options. The request should include the exact 144-LQFP ordering code XC6SLX4-L1TQG144C so that production planning is based on the correct speed designator, package code, and temperature-market suffix.
What is the price of XC6SLX4-L1TQG144C?
The current XC6SLX4-L1TQG144C commercial price is handled through the Request a Quote form on this page. Submit the exact MPN, required quantity, target date, and preferred shipment destination for a current quotation. This approach also allows the order to be checked against the correct TQG144 package, L1 ordering designator, and C suffix.
What is the lead time for XC6SLX4-L1TQG144C?
Current lead time for XC6SLX4-L1TQG144C must be confirmed through the Request a Quote form on this page. Include the production quantity, annual usage, target date, and destination country when requesting the schedule. Because an FPGA order also depends on the exact package, speed designator, and suffix, the complete MPN should be used for every availability inquiry.
Is XC6SLX4-L1TQG144C in stock?
Use the Request a Quote form on this page to check current XC6SLX4-L1TQG144C stock and allocation status. A stock response should be tied to the exact MPN, quantity, and shipping destination. For production planning, request a scheduled allocation and lead time as well as immediate availability because temporary inventory does not necessarily represent a firm multi-year supply commitment.
What is the difference between XC6SLX4-L1TQG144C and XC6SLX4-2TQG144C?
The primary documented difference is the speed designator: the target carries L1, while XC6SLX4-2TQG144C carries speed grade 2. Both use the 144-LQFP TQG144 package and retain the same Spartan-6 LX4 logic and I/O resources. According to the manufacturer family documentation, the faster grade may change timing margins, so an existing design should be revalidated rather than substituted solely for availability.
What is the difference between XC6SLX4-L1TQG144C and XC6SLX4-3TQG144C?
The XC6SLX4-3TQG144C uses speed grade 3, whereas the target XC6SLX4-L1TQG144C uses the L1 ordering designator. Their family, 3,840 logic cells, 102 I/O, 45 nm CMOS process, and 144-LQFP package align, but timing performance and power characteristics can vary by speed grade. The faster option is a same-footprint alternative when its timing and power requirements fit the design.
When should I choose XC6SLX4-L1TQG144C over a faster Spartan-6 LX4 option?
Choose XC6SLX4-L1TQG144C when the existing design has been characterized against its timing margin and the exact L1 ordering option is commercially preferable. A faster grade can alter achievable clock rates and dynamic power, so speed is not automatically a better functional match. Confirm pinout, configuration behavior, I/O standards, power budgeting, and timing closure for the specific board revision.
Is XC6SLX4-L1TQG144C suitable for industrial control and automation systems?
The XC6SLX4-L1TQG144C is suitable for many industrial-control and automation designs requiring 3,840 programmable logic cells, 102 I/O, and a 144-LQFP package. Its suitability depends on the required temperature-market option, I/O voltage, clocking scheme, isolation strategy, and industrial certification obligations. The target’s C suffix should be checked against the environmental requirements of the deployed equipment.
What can replace XC6SLX4-L1TQG144C without a PCB change?
The verified same-footprint options are XC6SLX4-2TQG144C, XC6SLX4-2TQG144I, and XC6SLX4-3TQG144C. Each retains the 144-TQG package and Spartan-6 LX4 resource structure, but speed grade or temperature-market suffix changes. No cross-brand drop-in replacement was confirmed, so any substitution should preserve configuration behavior and be revalidated for timing, power, and environmental requirements.
Can XC6SLX4-2TQG144I replace XC6SLX4-L1TQG144C?
XC6SLX4-2TQG144I is a same-package Spartan-6 LX4 option with speed grade 2 and an I temperature-market suffix, while the target uses the L1 designator and C suffix. It can support a footprint-compatible design transition when the industrial temperature option is appropriate and timing margins are acceptable. Configuration, clocking, power, and system-level validation remain necessary.
Is there an AMD or Xilinx XC6SLX4 equivalent with the same TQG144 package?
AMD/Xilinx is the manufacturer of the Spartan-6 LX4 family, and the verified equivalent options use the same TQG144 package. XC6SLX4-2TQG144C, XC6SLX4-2TQG144I, and XC6SLX4-3TQG144C differ in speed-grade or temperature-market ordering options. No verified cross-manufacturer part was found with the required package, configuration interface, and functional compatibility.
What is the best cross-brand replacement for XC6SLX4-L1TQG144C?
No cross-brand drop-in replacement for XC6SLX4-L1TQG144C has been verified. A cross-brand FPGA would need the same 144-LQFP footprint, compatible configuration method, suitable I/O capabilities, and adequate logic and memory resources, which is a substantially stricter requirement than merely matching package pin count. The available same-brand Spartan-6 LX4 speed-grade options provide the lowest-risk migration path.

Technische Referenzdaten für XC6SLX4-L1TQG144C – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose XC6SLX4-L1TQG144C when an existing design is characterized for the L1 ordering option and the current component remains the best commercial and technical match. Select XC6SLX4-2TQG144C when a higher timing grade is needed without changing the PCB or logic architecture. Select XC6SLX4-3TQG144C when the additional performance grade is justified and timing, configuration, and power behavior have been revalidated. Use XC6SLX4-2TQG144I when the I temperature-market option better matches the deployment environment. None of these choices changes the 144-LQFP footprint or the listed 3,840 logic cells and 102 I/O. For applications needing more logic, memory, different I/O standards, or a different package, treat the alternative as a redesign rather than a drop-in replacement.

Vergleich mit Alternativen

Parameter Dieses Produkt XC6SLX4-2TQG144C XC6SLX4-2TQG144I XC6SLX4-3TQG144C
Package 144-LQFP (TQG144) 144-LQFP (TQG144) 144-LQFP (TQG144) 144-LQFP (TQG144)
Brand AMD AMD AMD AMD
FPGA Family Spartan-6 LX Spartan-6 LX Spartan-6 LX Spartan-6 LX
Logic Cells 3,840 cells 3,840 cells 3,840 cells 3,840 cells
User I/O 102 I/O 102 I/O 102 I/O 102 I/O
Process Technology 45 nm CMOS 45 nm CMOS 45 nm CMOS 45 nm CMOS
Core Supply Voltage 1 V 1 V 1 V 1 V
Speed Designator L1 Grade 2 Grade 2 Grade 3
Temperature-Market Suffix C C I C

Wichtigste Unterscheidungsmerkmale

  • Matches the 3,840-cell Spartan-6 LX4 architecture while preserving a 144-LQFP footprint (vs. XC6SLX4-2TQG144C)
  • Maintains footprint compatibility with a higher speed-grade option (vs. XC6SLX4-3TQG144C)
  • Offers a same-footprint migration toward an industrial-temperature ordering option (vs. XC6SLX4-2TQG144I)

Designhinweise

Use the manufacturer’s Spartan-6 power-tree and decoupling recommendations for the 1 V core rail and applicable I/O supplies. Keep the core and I/O supply paths separate through the PCB power network, place high-frequency decoupling close to the device, and account for startup current when selecting regulators and bulk capacitance. Supply sequencing must remain compatible with configuration behavior. Estimated conversion loss cannot be stated without the design’s input voltage, output current, efficiency, and thermal data.

Assign configuration pins, clock-capable pins, VCCO banks, and user I/O directly from the official 144-TQG package files before signal routing. Keep JTAG access unobstructed for production programming and boundary-scan test. For interfaces using fast edges, control trace lengths, provide continuous reference planes, avoid unnecessary stubs, and terminate according to the actual signal standard. Do not infer analog performance or signal integrity from the nominal FPGA logic-cell count.

A same-package replacement does not automatically satisfy every requirement. Compare the exact speed designator, temperature-market suffix, configuration method, supported I/O standards, clock behavior, and power characteristics before changing the bill of materials. In particular, grade 2 and grade 3 options may alter timing margins and dynamic power. Revalidate the complete design after substituting a faster grade rather than assuming that all configuration files and constraints remain interchangeable.

The 144-LQFP package exposes its leads on all four sides and requires adequate copper area and thermal via placement beneath or near the device when utilization is high. Follow the manufacturer’s package thermal guidance for the board stack-up and airflow condition. Estimated junction temperature requires the selected package thermal resistance, actual dissipation, and ambient temperature, so those values must be taken from the design data before assigning a thermal margin.

Compliance-Informationen

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Bleifrei
Unknown
Halogenfrei
Unknown
Konfliktmineralien
Unknown

The target is an FPGA rather than an automotive-qualified discrete or power component. Specific RoHS, REACH, lead-free, halogen-free, and conflict-minerals declarations should be confirmed from the current AMD product documentation or declaration for the exact ordering code.

Daten verifiziert am: 2026-11-06 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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