FPGA y CPLD
Productos (6666)
EP1S30F1020C7 - Stratix 32K LE FPGA 726 I/O FC-FBGA-1020 | Intel
The Intel (formerly Altera) EP1S30F1020C7 is a Stratix family Field Programmable Gate Array (FPGA) IC built on a 130nm CMOS process, integrating 32,470 logic cells and 726 user I/Os in a 1020-ball flip-chip FineLine BGA (FC-FBGA) package measuring 33x33 mm with 1 mm pitch. It operates from a 1.5V core supply across the commercial 0 to 85 C temperature range, supporting a maximum internal clock frequency of approximately 420 MHz. An FPGA (Field Programmable Gate Array) is a class of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. In the system hierarchy FPGAs sit alongside ASICs and microcontrollers but are distinguished by their in-system re-programmability via SRAM configuration bitstreams. The Stratix family was Intel/Altera's first generation to combine hard IP multipliers and TriMatrix memory blocks with a scalable logic fabric, making it suitable for high-throughput DSP and datapath applications. Key features of the EP1S30F1020C7 include 3,247 Logic Array Blocks (LABs), embedded multiplier blocks for DSP, TriMatrix memory blocks for distributed and block RAM, dedicated clock management with PLLs, and configurable I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. Multiple I/O banks support mixed voltage signaling on a single device. The -C7 speed grade indicates a medium-speed bin, balancing performance against power for typical commercial designs. The device architecture incorporates a MultiTrack interconnect that minimizes routing congestion and supports predictable timing closure for wide datapaths. The FC-FBGA-1020 substrate uses flip-chip solder bumps for low-inductance power delivery, essential for high-fanout synchronous designs. Dedicated hardware blocks reduce logic cell consumption for FFTs, FIR filters, and protocol bridging workloads. Typical applications include high-speed digital signal processing (FFT cores, video processing), communications infrastructure (baseband processing, protocol bridging), ASIC prototyping, industrial imaging and machine vision, test and measurement equipment, and high-performance custom computing accelerators. The 726 I/O count and abundant DSP blocks make it well suited for parallel interface aggregation and bus-width conversion roles. When designing with this device, plan power distribution carefully: the FC-FBGA substrate requires a multilayer PCB with low-impedance core and I/O voltage planes, and decoupling must follow Altera's pin-out-specific guidelines. Configuration scheme selection (AS, AP, PS, JTAG) must be locked early in the schematic, as the EPC configuration device companion dictates board layout. The legacy Quartus II design tool supports this device but is no longer the latest vendor IDE. This page synthesizes distributor pricing, drop-in same-package alternatives, design notes, and selection guidance not found in a single datasheet table. Engineer-oriented pinout guidance, package drawings, and Q&A content are compiled from multiple verified sources to accelerate evaluation.
EP1S30F1020C7N - Stratix 32k LE FPGA, 1020-BGA, 420MHz | Intel
The Intel EP1S30F1020C7N is a Stratix-series Field Programmable Gate Array (FPGA) fabricated on a 130 nm CMOS process, offering 32,470 logic elements, 3,317,184 bits of embedded memory, and 726 user I/O pins in a 1020-ball FineLine BGA package (33 x 33 mm, 1 mm pitch). It operates from a 1.5 V core supply (range 1.425 V to 1.575 V), supports up to 420.17 MHz internal operation, and targets commercial/extended-temperature designs where high logic density and rich DSP and memory resources are required. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit within the broader semiconductor hierarchy as: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Unlike fixed-function ASICs, FPGAs can be reconfigured in the field to implement arbitrary digital logic, glue functions, signal-processing pipelines, and full system-on-chip prototypes. Key features include 3,244 Kbits (M4K) + 144 Kbits (M-RAM) of block RAM, dedicated DSP blocks for high-throughput arithmetic, up to 16 global clock networks with PLL support, and Stratix-tier I/O support including LVDS, SSTL, and HSTL standards. The 1020-pin FineLine BGA exposes 726 user I/Os, leaving the remaining balls for power, ground, configuration, and JTAG. The Stratix architecture combines a TriMatrix memory structure (MLAB + M4K + M-RAM) with DSP blocks optimized for finite-impulse-response (FIR) filters and complex FFT pipelines. The 130 nm process delivers an internal clock performance envelope of 420 MHz, making the part suitable for parallel DSP workloads, telecom channel cards, and prototyping of ASIC-class signal chains before tape-out. Typical applications include telecom baseband processing, high-speed data acquisition, software-defined radio (SDR), industrial motion control, ASIC prototyping, and military/aerospace signal processing where a high pin-count, high-density programmable fabric is required. The 1020-BGA footprint also supports multi-gigabit transceiver-rich boards when paired with companion clock devices. When designing with this device, provide at least six PCB layers, controlled-impedance routing for all high-speed signals, and a minimum of 1 oz copper on inner power planes for the 1.5 V core rail. Thermal management relies on the exposed-die BGA lid; heatsink or airflow is required when continuous logic utilization exceeds 70%. This page synthesizes distributor pricing, drop-in same-brand alternatives from the Stratix family, and practical design notes not aggregated in the manufacturer datasheet.
EP1S30F1020I6 - 32,470 Logic Elements Stratix FPGA | Intel
The Intel EP1S30F1020I6 is a member of the Stratix FPGA family, delivering 32,470 logic elements, 3,317,184 bits of embedded RAM, and 726 user I/O pins in a 1020-ball FineLine BGA package. Manufactured on a 130 nm CMOS process, the device integrates dedicated DSP blocks, TriMatrix memory, and high-speed transceivers, making it suitable for high-performance digital signal processing, telecom, and military/aerospace systems. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs occupy a unique position in the hierarchy between general-purpose microcontrollers and fixed-function ASICs: they offer hardware-timed parallelism, deterministic latency, and the ability to be reconfigured in the field. The Stratix family was Intel's (formerly Altera's) high-performance flagship before being succeeded by Stratix II/III/IV/V. Within the taxonomy, FPGAs sit under programmable logic devices (PLDs) within the broader semiconductor category. Key features of the EP1S30F1020I6 include 32,470 logic elements (LEs), 3,317,184 RAM bits organized as TriMatrix memory blocks, 144 embedded 18x18 multipliers for DSP, 6 phase-locked loops (PLLs), and 12 dedicated clock networks. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL via 726 user I/O pins on the 1020-ball FC-FBGA package. Architecturally, the Stratix EP1S30 uses a row-and-column structure with embedded DSP blocks interleaved between memory columns. The 130 nm process technology combined with a 1.5 V core supply and dedicated MultiTrack interconnect minimizes routing congestion and supports clock rates up to 450 MHz in DSP pipelines. Embedded memory and DSP blocks are hard-wired for predictable performance, while logic fabric handles glue logic and state machines. Typical applications include high-speed digital signal processing (FFT engines, baseband processing), telecom backplane interfacing, military radar systems, medical imaging accelerators, and ASIC prototyping. The combination of high logic density, generous on-chip memory, and embedded multipliers makes it ideal for datapath-heavy designs requiring deterministic throughput. When designing with this part, ensure your power budget accounts for the dynamic power of fast logic toggling - Intel provides the PowerPlay early power estimator tool. For the FC-FBGA-1020 package, PCB layout must use microvia technology and matched-length traces on high-speed LVDS pairs to maintain signal integrity. This page synthesizes distributor pricing, same-package drop-in alternatives, FPGA design considerations, and lifecycle context not consolidated in the manufacturer datasheet. As of 2026-09-07, the part remains in NRND status with limited authorized distribution.
EP1S30F1020I6GA - 32,470 LEs Stratix FPGA 726 I/O FBGA-1020 | Intel
The Intel (formerly Altera) EP1S30F1020I6GA is a Stratix family field-programmable gate array (FPGA) integrating 32,470 logic elements and 726 user I/O pins in a 1020-ball fine-pitch BGA package. It is fabricated on a 130 nm CMOS process, operates from a 1.5 V core supply, and is offered in the industrial temperature grade with -6 speed grade characteristics. According to the Stratix family datasheet, the device delivers up to 450 MHz internal operation and supports dedicated DSP blocks, embedded TriMatrix memory, and up to 4 PLLs for high-performance digital logic. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor whose logic function is defined by customer-loaded configuration bitstreams rather than by fixed mask layers. Architecturally, FPGAs sit alongside ASICs, CPLDs, and structured ASSPs in the programmable logic hierarchy; this Stratix part specifically belongs to the high-density end of that hierarchy, targeting ASIC prototyping, telecom line cards, and high-throughput DSP pipelines. The EP1S30 sits between the smaller EP1S10/EP1S25 and the larger EP1S40/EP1S60/EP1S80 in the Stratix lineup. Key features include 32,470 logic elements, 726 user I/O, dedicated embedded multipliers, distributed TriMatrix memory, four PLLs, and support for external memory interfaces such as DDR SDRAM. Per the Stratix family datasheet, the -6 speed grade targets high-end digital signal processing, while the 'I' suffix designates the industrial temperature range (-40C to +85C operating range for industrial-grade parts). The 'GA' suffix denotes a RoHS-compliant lead-free package. The architecture combines a high-performance lookup-table (LUT)-based logic fabric with embedded RAM, multipliers, and high-speed transceivers where present. This blend allows system designers to consolidate glue logic, memory, and DSP arithmetic into one device, simplifying board layout, lowering BOM cost, and shortening time-to-market versus a fixed-function ASIC. Typical applications include ASIC prototyping and emulation, high-speed DSP (FIR filters, FFT engines), telecom baseband processing, networking line cards, military/aerospace signal processing, and high-performance image processing pipelines. Industrial-grade parts are suitable for factory automation, test and measurement equipment, and medical imaging. When designing with this device, ensure that PCB power integrity is maintained across the four Stratix voltage rails (VCCINT, VCCIO, VCCPD, VCCA_PLL) and that JTAG pins TCK, TMS, TDI, TDO are routed cleanly. Configuration mode (AS, PS, JTAG) and clock architecture must be planned before PCB layout. This page synthesizes distributor pricing, drop-in alternatives within the Stratix family, and practical design notes that supplement the manufacturer datasheet.
EP1S30F1020I6N - Stratix FPGA, 3247 LABs, 726 I/O | Intel
The Intel (formerly Altera) EP1S30F1020I6N is a high-density Stratix FPGA from the first-generation Stratix family, integrating 3,247 Logic Array Blocks (LABs), 726 user I/O pins, and a 1.5 V core supply in a 33 x 33 mm flip-chip BGA-1020 package with 1 mm ball pitch. The part carries the industrial temperature grade designation ("I6") and a 6 speed grade, making it suitable for performance-oriented industrial systems that demand deterministic timing. An FPGA (Field-Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital circuits after PCB fabrication. FPGAs sit in the broader taxonomy of programmable logic devices -> programmable logic -> digital ICs -> semiconductors, and the Stratix family was Altera's flagship high-end family at launch, integrating logic, embedded memory blocks (TriMatrix), DSP blocks, and high-speed transceivers on a single die. Compared with CPLDs and ASICs, FPGAs offer higher logic density and on-chip parallelism while preserving reprogrammability. Key features of the EP1S30F1020I6N include up to 33,000+ equivalent logic elements organized across 3,247 LABs, embedded TriMatrix memory for distributed and block RAM, dedicated DSP blocks for high-throughput signal processing, and Stratix I/O structures supporting multiple single-ended and differential I/O standards. The 726 user I/O count enables wide parallel buses and rich memory interfaces, while the flip-chip BGA package provides the thermal and electrical headroom required for the high I/O density. Architecturally, Stratix devices use a 1.5 V core with dedicated PLL-based clock management, on-chip termination, and SerDes-ready I/O. The combination of TriMatrix memory and DSP blocks makes the EP1S30 well suited for DSP pipelines such as video processing, baseband signal processing, and protocol bridging. Industrial-grade (-40C to +85C) screening, indicated by the "I6" suffix, supports deployments outside controlled lab environments. Typical applications include high-speed data acquisition, telecom baseband processing, industrial imaging, military/aerospace prototyping, network interface cards, and ASIC prototyping platforms. The large logic capacity is particularly attractive for system-on-chip emulation and pre-silicon validation, where the 726 user I/O support wide memory and bus replication. When designing with the EP1S30F1020I6N, ensure the PCB land pattern strictly follows the 1 mm-pitch FCBGA-1020 footprint and that the supply network delivers the 1.5 V core with adequate decoupling. Thermal dissipation in FCBGA packages is dominated by the PCB; a continuous ground/power plane stack-up with thermal vias under the die is essential. Also note that the Stratix I family has reached End-of-Life for new designs; migration paths include the Stratix II/III/IV families and the Cyclone family for lower-cost replacements. This page synthesizes distributor pricing, drop-in Stratix-family alternatives, and PCB-layout design notes that complement but do not replace the official Stratix Device Handbook.
EP1S30F780C6 - Stratix FPGA, 32470 LEs, 597 I/O, FCBGA-780 | Altera
The Altera EP1S30F780C6 is a member of the original Stratix FPGA family, fabricated on a 1.5 V, 0.13 μm all-layer copper SRAM process and housed in a 780-ball FineLine BGA (FCBGA) package. Per the Altera datasheet, the device integrates 32,470 logic elements, 597 user I/Os, dedicated DSP blocks with embedded multipliers, and TriMatrix on-chip memory, making it suitable for high-performance DSP, communications, and signal-processing designs. The part is graded for commercial temperature operation (0 °C to 85 °C). A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) built on an SRAM process that lets engineers implement arbitrary digital logic, block RAM, DSP arithmetic, and high-speed serial transceivers on a single die. Stratix belongs to the hierarchy: FPGA → programmable logic device (PLD) → logic IC → integrated circuit → semiconductor. Within Altera's (now Intel FPGA) portfolio, the EP1S30F780C6 sits in the first-generation Stratix family, positioned between the smaller Stratix EP1S10/EP1S20 and the higher-density EP1S40/EP1S60/EP1S80 devices, and predates the Stratix II/GX/Cyclone lineages. Key features of the EP1S30F780C6 include up to 28 DSP blocks with up to 224 (9-bit × 9-bit) embedded multipliers for DSP pipelines, TriMatrix memory architecture with up to ~3.4 Mbits of RAM, support for multiple I/O standards including LVDS, and a configuration scheme based on SRAM cells loaded at power-up via passive serial, fast passive parallel, or JTAG. The 0.13 μm process and 1.5 V core deliver a balance of performance and power for early-2000s high-end designs. The architecture uses logic array blocks (LABs) composed of logic elements (LEs), each containing a 4-input look-up table (LUT), a programmable register, and a carry chain. Embedded memory blocks (M512, M4K, M-RAM) provide distributed and block RAM at multiple aspect ratios. PLLs provide clock conditioning and frequency synthesis for the global and regional clock networks, and dedicated high-speed I/O banks support external memory interfaces such as DDR SDRAM and QDR SRAM. Typical applications of the EP1S30F780C6 include high-throughput DSP (software-defined radio baseband, video processing), telecom line cards implementing protocol bridging and packet processing, ASIC prototyping, and industrial imaging pipelines. The 597 I/Os make it useful for designs that aggregate many parallel buses or external memory channels. When designing with this part, validate power sequencing of the 1.5 V core and the I/O bank supplies, and use Altera Quartus II (legacy version chain) for synthesis, place-and-route, and timing closure. Engineers should also note that this is a mature/EOL device line and plan second-source or migration paths to Cyclone/Stratix II families where possible. This page synthesizes distributor pricing, same-family drop-in alternatives from the Site MPN list (Stratix EP1S25 / EP1S20 / EP1S10 variants), and practical FPGA design notes that are not consolidated on the manufacturer datasheet alone, giving engineers a faster starting point for sourcing and PCB redesign decisions.
EP1S30F780C6GA - Stratix FPGA 32470 LEs 780-FBGA | Intel
The Intel EP1S30F780C6GA is a member of the original Stratix FPGA family, delivering 32,470 logic elements, 3,317,184 bits of embedded RAM, and 597 maximum user I/O pins in a 780-ball FineLine BGA (FBGA) package measuring 29 mm x 29 mm. Built on a 1.5 V core with 0.13 um process technology, it is positioned for high-performance digital logic, DSP, and embedded processing in communications, industrial, and computing systems. The device integrates dedicated DSP blocks, TriMatrix memory, and high-speed transceivers suited to baseband and protocol bridging workloads. A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated silicon IP such as block RAM, DSP slices, PLLs, and high-speed serial transceivers. FPGAs sit above fixed-function ASICs and microcontrollers in the silicon hierarchy because they offer hardware-level parallelism with the ability to be re-programmed in-system, placing them in the broader category of programmable logic devices (PLDs) within digital semiconductors. Key features of the EP1S30F780C6GA include 32,470 logic elements, 3,317,184 RAM bits, 597 maximum user I/O pins, embedded DSP blocks for high-throughput multiplication-accumulation, multiple phase-locked loops for clock management, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The 780-FBGA package exposes all user I/O through a high-density ball grid that supports dense board layouts. The EP1S30F780C6GA uses Altera's Stratix architecture with embedded memory and dedicated signal-processing blocks. Designers configure logic and routing through the Quartus II design software, which is also used for timing closure, floorplanning, and bitstream generation. The architecture targets high-throughput parallel processing where conventional processors would bottleneck. Typical applications include communications infrastructure such as base station baseband and protocol bridging, industrial automation controllers, high-speed data acquisition front-ends, and military/aerospace signal processing. The 597-I/O capacity also makes the device suitable for prototyping ASIC designs and for high-density test and measurement instrumentation. When designing with this part, pay close attention to power planning: the 1.5 V core supply must be tightly decoupled with bulk and ceramic capacitors close to each supply pin. The 780-BGA footprint requires careful PCB stack-up and via-in-pad or microvia technology for reliable assembly. Signal integrity must be simulated for high-speed LVDS pairs and external memory interfaces to maintain timing margins. This product page consolidates distributor pricing, parametric comparison, and a drop-in alternative list to streamline sourcing and design decisions, supplementing the official Intel datasheet.
EP1S30F780C6N - Stratix FPGA 32K LE 780-FBGA | Intel / Altera
The Intel (formerly Altera) EP1S30F780C6N is a member of the original Stratix FPGA family, delivering 32,470 logic elements, 3,317,184 bits of embedded memory, and 597 user I/O pins in a 780-ball flip-chip BGA package. Manufactured on a 130 nm CMOS process with a 1.5 V core supply, the device integrates up to 324,720 RAM bits per M512/M4K/M-RAM block, embedded DSP blocks for high-speed multiply-accumulate, and dedicated high-speed serial transceivers supporting multi-gigabit interfaces. The C6 speed grade balances performance and power, suitable for prototyping, legacy system support, and long-lifecycle industrial designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and transceivers. FPGAs occupy the top tier of programmable logic, sitting between standard microcontrollers and ASICs in the broader integrated-circuit hierarchy: logic cell -> logic array block -> LAB -> FPGA fabric -> programmable logic device -> semiconductor. Unlike an ASIC, an FPGA's function is defined post-manufacture via SRAM or flash configuration, allowing rapid design iteration and field upgrades. Key features of the EP1S30F780C6N include 3,819 Configurable Logic Blocks (CLBs), 252 (18x18) embedded multiplier blocks, 12 phase-locked loops, six clock networks, JTAG IEEE 1149.1 boundary-scan support, and a dedicated configuration interface supporting serial, parallel, and passive/active modes. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with per-pin dynamic impedance control. Stratix devices also include TriMatrix memory architecture (M512, M4K, M-RAM blocks) that delivers high-bandwidth on-chip storage for buffering and packet processing. Architecturally, the Stratix family pioneered the embedded DSP block concept that subsequent Altera/Intel families (Stratix II/III/IV/V, Cyclone, Arria, Agilex) have refined. The 130 nm process places the EP1S30 in the legacy tier, but it remains supported in Intel Quartus design tools for several development flows, which is critical for industrial and defense programs with long product life cycles. Typical applications include telecom line-card aggregation, industrial motor control, military/aerospace signal processing, test and measurement instrumentation backplanes, and ASIC prototyping. The combination of high logic density, large memory, and 597 I/O makes the EP1S30 well-suited for parallel data-path designs such as multi-channel DSP, video processing, and protocol bridging. When designing with this device, allocate adequate power decoupling and thermal dissipation for the 29 mm x 29 mm FC-FBGA; the 780 balls at 1 mm pitch require standard BGA assembly processes. Configuration storage should use a compatible PROM (EPC16 or EPC8) or system-controller-based in-system programming. Signal integrity on the 597 user I/Os requires controlled-impedance PCB stack-up; SSTL/HSTL interfaces in particular need matched-length routing and proper VREF termination. This page synthesizes distributor pricing, FPGA fabric specifications, Stratix-family drop-in alternatives, and practical design notes not consolidated in any single manufacturer document, helping engineers compare options and accelerate design-in.
EP1S30F780C7 - Stratix 32K LE FPGA, 780-FBGA | Altera / Intel
The Altera (now Intel) EP1S30F780C7 is a member of the original Stratix FPGA family, integrating 32,470 logic elements, 597 user I/O pins, and dedicated DSP and memory blocks into a 780-ball fine-pitch BGA package. It is fabricated on a 1.5 V core, 0.13 µm CMOS process and supports up to 3,317,184 bits of embedded SRAM organized in TriMatrix memory blocks. A Field-Programmable Gate Array (FPGA) is a programmable logic device whose logic, routing, and I/O behavior are defined by configuration SRAM. FPGAs occupy the position of ASIC prototyping, hardware acceleration, and reconfigurable computing in the broader digital IC hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. Stratix-class FPGAs specifically target high-performance DSP and telecommunications signal chains. Key features include 3,240 Kbits of embedded memory, dedicated DSP blocks supporting up to 224 18x18 multipliers, 12 transceiver channels (Rocket I/O) at up to 3.125 Gbps, and support for external DDR SDRAM and QDR II SRAM memory interfaces. The device also integrates a high-speed LVDS interface and a hard PCI-X core for direct bus connectivity in communication equipment. Architecturally, the EP1S30F780C7 uses a logic-array-block (LAB) structure with each LAB containing 10 logic elements (LEs). Configuration is stored in SRAM, allowing in-system reprogrammability through JTAG or passive/active serial schemes. The 780-pin FCBGA package provides 597 usable I/O pins, organized into banks supporting multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL, LVPECL, and LVDS. Typical applications include wired and wireless telecom baseband processing, high-speed serial interface bridging (XAUI, Fibre Channel, SONET), video and imaging pipelines, and ASIC prototyping for DSP and communications algorithms. The combination of dedicated multipliers and high-bandwidth memory makes this device especially well suited for OFDM and FFT-based designs. Designers should pay close attention to power-supply sequencing, decoupling, and the 1 mm pitch BGA layout (29x29 mm body). Because configuration SRAM is volatile, an external configuration PROM such as an EPC16 or EPCS device is required for stand-alone boot. Static supply currents should be evaluated against the Stratix handbook power estimator spreadsheet. This page synthesizes distributor pricing, drop-in equivalents from the same Stratix family, and practical board-design guidance not collected in any single datasheet — giving procurement and engineering teams one trustworthy decision point for this legacy but still-quotable device.
EP1S30F780C7AA - Stratix 32K LE FPGA, 597 I/O, 780-FBGA | Intel
The Intel EP1S30F780C7AA is a member of the original Stratix FPGA family, delivering 32,470 logic elements, 3,317,184 bits of embedded memory, and 597 user I/O in a 780-ball FineLine BGA package with a -7 speed grade. It is built on a 0.13 µm SRAM-based process and integrates dedicated DSP blocks, TriMatrix memory, and high-speed serial transceiver support, making it suitable for high-performance digital signal processing, telecommunications infrastructure, and data acquisition systems. An FPGA (Field-Programmable Gate Array) is a programmable logic device that lets designers implement arbitrary digital circuits after PCB fabrication. Within the broader semiconductor taxonomy, FPGAs sit between ASICs and general-purpose processors: more flexible than fixed-function ASICs yet offering deterministic hardware-level parallelism that microcontrollers cannot match. The Stratix family occupies Intel's (formerly Altera's) high-performance tier, above Cyclone and Arria in logic density and transceiver capability, and below Agilex in process node and DSP throughput. The EP1S30 specifically targets mid-density applications where designers need rich logic, embedded multipliers, and flexible I/O without paying for the largest Stratix devices like EP1S80. Key electrical and packaging attributes include 597 maximum user I/O pins, 1.5 V core voltage with multi-voltage I/O support (LVTTL, LVCMOS, LVDS, LVPECL, PCI, PCI-X), embedded DSP blocks delivering up to 2.1 GMACS at -7 speed grade, and TriMatrix memory totaling approximately 3.3 Mbits. The device is offered in a 780-ball FCBGA with a 29x29 mm or similar footprint and is specified for the commercial 0°C to +85°C operating range. Power is supplied through dedicated VCCINT, VCCIO banks, VCCA_PLL, and VCCPD pins with extensive decoupling guidance in the Stratix Device Handbook. Architecturally, the EP1S30 uses logic array blocks (LABs), each containing ten logic elements (LEs), interconnected by a multi-tiered routing fabric. Embedded multiplier blocks support 9x9, 18x18, and 36x36 signed/unsigned multiplication in a single cycle, enabling DSP-heavy designs without consuming general-purpose logic. The PLLs provide clock synthesis and skew management across up to 16 dedicated clock pins. Configuration is supported through passive serial, fast passive parallel, and JTAG modes, with optional EPC16 or EPCS serial configuration devices from Intel. Typical applications include high-end telecommunications line cards, radar and beam-forming front-ends, medical imaging pre-processors, broadcast video processing, ASIC prototyping, and military/aerospace signal processing. The combination of 597 I/O and approximately 3.3 Mbits of embedded memory makes it a flexible platform for system-on-chip prototyping where designers need to validate complex IP blocks before committing to a mask-programmed ASIC. When designing with the EP1S30F780C7AA, pay close attention to the Stratix Device Handbook pin connection guidelines: each VCCIO bank must be decoupled with 0.1 µF and 0.01 µF capacitors placed close to the balls, unused I/O must be tri-stated and tied to a defined logic level, and JTAG TCK should be pulled to a known state to avoid inadvertent boundary-scan events. Thermal management is generally passive for commercial-temperature designs but requires attention if I/O switching activity is high. This page synthesizes distributor pricing, package-specific alternatives, and practical design notes curated from the Stratix Device Handbook and authorized distributor listings, providing a single-page reference that complements the manufacturer datasheet.
EP1S30F780C7N - Stratix FPGA 32470 LE, 780-FBGA | Intel
The Intel (Altera) EP1S30F780C7N is a high-density Stratix FPGA built on a 130 nm CMOS process, providing 32,470 logic elements (LEs) organized into 3,247 Logic Array Blocks (LABs) and 3,819 Configurable Logic Blocks (CLBs), with 597 user I/Os. Housed in a 780-ball FC-FBGA package measuring 29 x 29 mm with 1 mm pitch, this industrial-temperature-grade device operates at a core voltage of 1.5 V. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. FPGAs sit at the top of the programmable-logic hierarchy: FPGA -> CPLD -> programmable logic -> digital IC -> semiconductor. They are distinguished from Application-Specific Integrated Circuits (ASICs) by re-programmability and from CPLDs by their greater logic density, embedded RAM blocks, DSP blocks, and high-speed transceiver support. The Stratix family in particular was Altera's first generation to embed TriMatrix memory blocks, DSP blocks, and high-speed I/O structures optimized for parallel processing and communications infrastructure. Key features of the EP1S30F780C7N include embedded RAM of 3,317,184 bits distributed across TriMatrix memory blocks, four phase-locked loops (PLLs) for clock management, support for multiple I/O standards (LVTTL, LVCMOS, PCI, LVDS, SSTL, HSTL), and a dedicated JTAG boundary-scan interface conforming to IEEE 1149.1. The device supports both passive serial (PS) and fast passive parallel (FPP) configuration schemes using an Altera-enhanced configuration device. Architecturally, the Stratix family combines a sea-of-LEs fabric with column-based DSP and memory blocks, allowing engineers to implement wide datapath operations, packet processing, and high-throughput DSP functions on a single chip. The embedded memory enables First-In-First-Out (FIFO) buffers, lookup tables, and dual-port RAM; the DSP blocks provide dedicated multipliers and adders for FIR filters, FFTs, and video processing. Compared with the older APEX family, Stratix moved to 130 nm and added true LVDS support and dedicated high-speed transceivers in higher-density members. Typical applications include telecommunications backplane switching, network interface cards, high-speed serial protocol bridging (UTOPIA, SPI-4.2, SFI-4, 10 GbE MAC), digital video broadcasting, and high-performance DSP prototyping. Industrial 0 C to 85 C operation makes the part suitable for thermally-controlled telecom and computing equipment. When designing with this part, allocate sufficient decoupling (typically 100 nF plus bulk 10-100 uF near each VCC/GND pair) and follow Stratix power-up sequencing requirements to keep VCCINT and VCCIO rails within the recommended ramp rates. Quartus II (or Quartus Prime in later releases) is the primary development environment; legacy Quartus II 9.0 is the latest version with full support for this Stratix silicon. This page synthesizes distributor pricing, same-package drop-in alternatives from the Stratix family, and practical design notes not found in the manufacturer datasheet alone.
EP1S30F780C8 - 32,470 LEs Stratix FPGA, 597 I/O, 780-FBGA | Intel
The Intel EP1S30F780C8 is a member of the original Stratix FPGA family built on a 130 nm CMOS process, offering 32,470 logic elements, 597 user I/O pins, and a top internal operating frequency of approximately 357 MHz, all integrated into a 780-ball FineLine BGA (FC-FBGA) package measuring 29 mm × 29 mm with a 1.0 mm ball pitch. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device that combines programmable logic fabric, an interconnect matrix, and dedicated silicon IP (block RAM, DSP blocks, PLLs, transceivers) on a single die. Stratix sits in the hierarchy programmable logic device (PLD) → FPGA → high-performance FPGA, and was Intel/Altera's first family to combine embedded TriMatrix memory, embedded DSP blocks, and high-speed I/O on a 1.5 V core supply. Key features of the EP1S30F780C8 include embedded TriMatrix memory blocks for distributed and true-dual-port RAM/ROM, embedded DSP blocks for high-throughput fixed- and floating-point math, support for external memory interfaces such as DDR, DDR2, QDR, and ZBT SRAM, and dedicated high-speed I/O supporting LVDS, LVPECL, PCI, PCI-X, and HSTL signalling. The device also includes up to 12 dedicated clock pins with on-chip PLLs for fine-grained clock management, plus configuration via passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), fast passive parallel (FPP), and JTAG. Architecturally, the EP1S30F780C8 uses Altera's Logic Array Blocks (LABs) interconnected by a multi-level routing fabric, with embedded memory columns interleaved with DSP block columns to maximise data-path throughput. The 1.5 V core, 130 nm process and flip-chip FC-FBGA package together deliver the speed and signal-integrity margins required for parallel DSP, ASIC prototyping, and high-bandwidth glue-logic designs at industrial 0–85 °C operating temperatures. Typical applications include ASIC prototyping, telecom line-card processing, high-speed image and video pipelines, communications infrastructure such as DSLAM and protocol bridges, and military/aerospace signal processing. Engineers also adopt EP1S30F780C8 for production-bound designs where time-to-market outweighs the unit-cost advantage of a structured ASIC, and as a software-compatible migration path to the larger Stratix II (EP2S) family. When designing with the EP1S30F780C8, plan power sequencing carefully: the 1.5 V core, I/O banks and auxiliary supplies must ramp in the order specified in the Altera Stratix device handbook to avoid in-rush latch-up. The 780-ball FC-FBGA demands reflow profile matching IPC/JEDEC J-STD-020 MSL-3 conditions, and high-speed LVDS traces must be length-matched to within the datasheet tolerance to meet the supported 840 Mbps data rate. This page synthesises distributor pricing, FFF-verified drop-in alternatives, and practical board-design notes not found in the manufacturer datasheet, helping sourcing engineers and FPGA designers plan a Stratix BOM with confidence.
EP1S30F780C8N - Stratix 32470 LEs FPGA, 597 I/O, 780-FBGA | Intel
The Intel (formerly Altera) EP1S30F780C8N is a member of the Stratix FPGA family, built on a 0.13 µm CMOS process and offering 32,470 logic elements (LEs), 3,317,184 bits of embedded memory, and 597 user I/O pins. The C8N speed grade places it at the high-performance end of the Stratix line, with internal architecture supporting DSP blocks, TriMatrix memory, and high-speed transceivers (where populated) for parallel logic and signal-processing workloads. The device is housed in a 780-pin FineLine BGA (FC-FBGA) measuring 29 × 29 mm with 1 mm pitch, and is specified for commercial temperature operation (0 °C to 85 °C). A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hard IP (memory, multipliers, transceivers, PLLs) on a single die. The Stratix family sits in the high-density, performance-oriented tier of FPGAs, above Cyclone (cost-optimized) and below the later Stratix II / Stratix III generations. EP1S30F780C8N specifically targets designers who need substantial on-chip RAM and rich DSP resources for DSP pipelines, communications baseband, and high-throughput data acquisition. Key features for the EP1S30F780C8N include 32,470 LEs, 3,317,184 RAM bits organized as TriMatrix blocks, dedicated DSP blocks for multiply-accumulate operations, and 597 user I/O. The 780-ball FC-FBGA package provides high-density board interconnect while the 1.5 V core supply and 1.5 V/2.5 V/3.3 V I/O standards make the part straightforward to integrate with common SDRAM, SRAM, and LVCMOS/LVTTL peripherals. Configuration is supported via Altera's passive serial, fast passive parallel, passive parallel asynchronous, and JTAG modes. Architecturally, the EP1S30F780C8N uses SRAM-based configuration cells with lookup-table (LUT)-based logic elements, carry chains for arithmetic, and dedicated routing. The embedded TriMatrix memory supports true dual-port, simple dual-port, and single-port RAM/ROM in various depths and widths, while DSP blocks provide hardware multipliers for filter and FFT structures. PLL blocks provide clock multiplication, division, and phase shifting for system timing. Typical applications include telecom baseband processing, high-speed image and video pipelines, test-and-measurement instrumentation, DSP co-processing cards, and communications line cards. Designers commonly pair this device with external DDR SDRAM, Flash configuration memory, and high-speed ADCs/DACs. For new designs, designers are advised to evaluate Stratix II EP2S30 or Cyclone IV/MAX 10 families as modern alternatives because Stratix (original) is a mature generation.
EP1S30F780I6 - Stratix 32K LEs FPGA, 780-FBGA | Altera (Intel)
The Altera (Intel) EP1S30F780I6 is a member of the original Stratix FPGA family, fabricated on a 130 nm CMOS process and packaged in a 780-ball FineLine BGA (FCBGA, 29x29 mm). It integrates 32,470 logic elements, 597 user I/Os, 3,317,184 embedded memory bits, and dedicated high-speed transceivers, and it operates from a 1.425 V to 1.575 V core supply with industrial-grade -40C to +100C junction support. The integrated transceiver block and abundant DSP/memory resources made Stratix the platform of choice for high-bandwidth pre-Cyclone design wins. An FPGA (Field Programmable Gate Array) is a programmable logic IC whose architecture is hierarchical: configurable logic blocks (CLBs) implement combinatorial and sequential logic, block RAM (BRAM) provides on-chip storage, DSP blocks accelerate fixed-point arithmetic, and I/O cells connect to external pins. Stratix sits in the high-performance tier of the Altera/Intel FPGA portfolio (Stratix > Cyclone; Altera > Intel PSG > programmable logic IC > semiconductor). The EP1S30 is the mid-density member of the family, between EP1S25 and EP1S40, and uses the same Quartus II design flow still maintained for legacy IP reuse. Key features of the EP1S30F780I6 include 3,247 logic array blocks (LABs), embedded multiplier blocks for DSP, a phase-locked loop (PLL) network for clock management, and support for external memory interfaces including DDR SDRAM and QDR SRAM via dedicated DQS circuitry. The 130 nm process supports core clock rates up to approximately 450 MHz per the manufacturer's data, and the FCBGA substrate delivers the signal-integrity headroom needed for LVDS, SSTL, and HSTL I/O standards operating simultaneously. Typical applications include high-speed serial protocol bridging, telecom line cards, military/aerospace signal processing, and image processing pipelines. Stratix FPGAs were also widely deployed in ASIC prototyping platforms where the combination of on-chip RAM and DSP blocks allowed engineers to validate multi-million-gate designs before tape-out. When designing with the EP1S30F780I6, plan your power budget around the 1.5 V core rail, the auxiliary 3.3 V I/O supply, and the PLL analog rail. Stratix parts typically require multi-rail sequencing - consult the Stratix device family datasheet for the canonical power-on sequence. The 780-FBGA (29x29 mm) package is not user-reworkable, so socket-based debug is recommended during bring-up. This page synthesizes distributor inventory, same-family drop-in alternatives from the Site MPN list, and practical design guidance not consolidated in the original datasheet PDF.
EP1S30F780I6N - Stratix FPGA, 32.5K LE, 780-BGA | Intel / Altera
The Intel (formerly Altera) EP1S30F780I6N is a member of the Stratix FPGA family, delivering 32,470 logic elements in a 780-pin FineLine BGA (FBGA) package with industrial-grade temperature rating. Built on a 130 nm process and fabricated by Intel/Altera, this device integrates 3,317,184 bits of embedded memory and 597 user I/O pins to support high-bandwidth parallel interfaces and DSP-intensive workloads. According to the Stratix Device Handbook, the device is targeted at high-performance logic, on-chip memory, and DSP-intensive applications such as communications infrastructure and signal processing. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be electrically configured by the customer after manufacture to implement arbitrary digital logic. In the system hierarchy, FPGAs sit between general-purpose CPUs/GPUs and fixed-function ASICs: they offer parallelism and customizable I/O like an ASIC, but are reprogrammable like software. FPGAs belong to the broader category of programmable logic devices (PLDs), which also include CPLDs (Complex Programmable Logic Devices). The Stratix family is positioned as a high-performance, feature-rich tier above the lower-cost Cyclone and MAX families within Intel/Altera's portfolio. Key features of the EP1S30F780I6N include 32,470 logic elements (LEs), dedicated DSP blocks for high-speed arithmetic, embedded RAM (TriMatrix memory), high-speed transceivers in selected device variants, and built-in support for multiple I/O standards including LVDS, LVTTL, SSTL, and HSTL. The 'I6' suffix indicates industrial temperature range (-40C to +100C ambient), while 'N' indicates lead-free / Pb-free terminal finish. The device is supported by the Quartus II design toolchain, enabling logic synthesis, place-and-route, timing analysis, and on-chip debugging via SignalTap. Typical applications for the EP1S30F780I6N span telecommunications infrastructure (line cards, protocol bridges), DSP front-ends for base stations and radar, high-speed serial protocol bridging (custom bridges for legacy parallel buses), video processing and image pre-processing, and high-performance industrial control. With 597 I/O pins, it can drive multi-channel data acquisition or memory interfaces without external bus switches. When designing with this device, verify PCB footprint dimensions against the 780-ball FBGA FineLine BGA package datasheet. The 130 nm process has relatively high static current compared to modern 28 nm FPGAs, so thermal management and power-supply decoupling require careful budgeting for production-grade reliability. For engineers evaluating alternatives, the EP1S30F780I6N is part of the Stratix I family of FPGAs and shares the 780-pin FBGA footprint with speed-grade (-6) and temperature-grade (industrial) siblings. Re-use of layout depends on the specific variant. For new designs targeting Stratix, note that the Stratix family is now mature and design teams typically migrate to Stratix V or Cyclone V / Cyclone 10 for new projects. This page synthesizes distributor pricing from DigiKey/Mouser/Octopart, the Stratix Device Handbook specifications, and practical design notes not found in the manufacturer datasheet alone - including drop-in cross-references and PCB layout guidance for the 780-ball FBGA package.
EP1S40B956C6 - Stratix FPGA, 41,250 Cells, BGA-956 | Intel
The Intel (formerly Altera) EP1S40B956C6 is a high-density Stratix-family field-programmable gate array (FPGA) implementing 41,250 logic cells and 4,125 logic array blocks (LABs) in a 956-ball fine-pitch BGA (40 x 40 mm, 1.27 mm pitch) package. It belongs to the -6 commercial speed grade and is specified for operation from 0C to 85C, with up to 683 user I/O pins. The device is fabricated on a 1.5 V core CMOS process and is one of the largest members of the original Stratix family. A field-programmable gate array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs/LABs), programmable interconnects, programmable I/O cells, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit at the top of the programmable logic hierarchy (below ASICs but above CPLDs) and are classified as programmable logic devices (PLDs) within the broader semiconductor category. Stratix FPGAs in particular target high-performance applications requiring embedded memory, DSP, and gigabit serial I/O. The EP1S40B956C6 differentiates from lower-density Stratix parts through its 4,125 LABs and 46,970 CLB-equivalent register count, providing the capacity to host multi-million-gate system designs. It integrates TriMatrix memory (M512/M4K/M-RAM blocks), embedded DSP blocks, and up to twelve global clock networks with PLL support. Compared with Stratix GX variants, the EP1S40B956C6 omits dedicated gigabit transceivers, positioning it for parallel-I/O and memory-rich designs rather than serial-protocol applications. Typical applications include high-performance digital signal processing, telecom line cards, ASIC prototyping, video and image processing pipelines, and embedded control with on-chip processors. The 956-ball BGA package and 683 user I/O pins support high-bandwidth parallel memory interfaces (DDR/DDR2) and multiple industry-standard buses. Combined with the Quartus II design toolchain, the EP1S40B956C6 enables rapid design iteration for prototyping and production deployment. When designing with this device, pay close attention to power-plane decoupling and thermal dissipation of the FCBGA package. Use at least one 0.1 uF decoupling capacitor per power pin, distribute multiple VTT and VCCINT planes across the PCB stack-up, and verify signal-integrity simulations for high-speed DDR/DDR2 interfaces. The -6 speed grade is the slowest in the Stratix family and is typically chosen for cost-sensitive designs or for engineering prototypes.
EP1S40B956C6N - Stratix FPGA, 41250 LEs, 956-BGA | Intel / Altera
The Intel (formerly Altera) EP1S40B956C6N is a Stratix-family Field-Programmable Gate Array (FPGA) housed in a 956-ball FineLine BGA package measuring 40 mm x 40 mm with 1.27 mm ball pitch. Built on a 0.13 µm CMOS process, the device integrates 41,250 logic elements, 3,423,744 RAM bits, and 683 user I/Os, while operating from a 1.425 V to 1.575 V supply and supporting commercial 0 °C to 85 °C ambient temperatures. It belongs to the Altera Stratix generation, the first family to embed TriMatrix memory blocks and DSP blocks alongside the Logic Array Blocks (LABs), enabling high-throughput DSP and memory-intensive designs. A Field-Programmable Gate Array is a semiconductor device containing an array of programmable logic blocks, interconnect, and I/O cells that designers can configure after manufacture using an HDL-defined bitstream. FPGAs sit between fixed-function ASICs (best performance per watt, highest NRE) and microcontrollers (lowest flexibility, lowest cost at low volumes), and are typically chosen for ASIC prototyping, signal processing, custom I/O bridging, and time-to-market-critical glue logic. The Stratix family, introduced in 2002, was Altera's first high-end family with embedded DSP and TriMatrix memory, paving the way for subsequent Stratix II/III/IV/V families. The EP1S40B956C6N's headline specifications include 4,125 LABs, 6 embedded DSP blocks (or per-die DSP rows depending on speed grade), 14 embedded memory blocks totaling approximately 3.4 Mbit, and 683 maximum user I/O pins. The 956-BGA (FCBGA) package exposes 16 high-speed transceiver channels and multiple PLL blocks for clock synthesis. Configuration is supported via JTAG (IEEE 1149.1) and passive/active serial schemes using Altera's classic Quartus II design flow. Typical applications include ASIC prototyping for networking line cards, telecom baseband preprocessing, military/defense signal processing, broadcast video switching fabrics, and high-performance DSP co-processing. Its combination of high logic density and embedded memory also made the part popular for early Software Defined Radio (SDR) and image processing pipelines. When designing with this part, allocate generous PCB routing layers for the 1.27 mm-pitch BGA, use multiple decoupling capacitor values (0.1 µF, 1 µF, 10 µF) per power pin, and verify signal-integrity on high-speed LVDS and clock traces. The legacy -6 speed grade indicates slower timing closure than -7/-8 grades; budget 15-25 % additional timing margin. Engineers should consult the official Stratix Device Handbook for transceiver and PLL block-level schematics before tape-out.
EP1S40F1020C5 - 41,250 Cells Stratix FPGA 1020-BGA | Altera
The Intel / Altera EP1S40F1020C5 is a member of the Stratix FPGA family manufactured on a 130 nm process, integrating 41,250 logic elements within 4,125 Logic Array Blocks (LABs) and 773 user I/Os in a 1020-ball FC-FBGA package. It supports core voltages of 1.425 V to 1.575 V and operates across the commercial temperature grade, making it well suited to high-performance digital logic, signal processing, and communications infrastructure. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic is defined after manufacture by a configuration bitstream loaded into on-chip SRAM. FPGAs combine the parallelism of dedicated hardware with the design flexibility of programmable logic, and they sit at the top of the programmable logic hierarchy: FPGA -> Programmable Logic Device (PLD) -> Programmable Logic -> Digital Logic IC. The Stratix family in particular introduced embedded TriMatrix memory, DSP blocks, and high-speed transceivers tailored for digital signal processing, bridging, and ASIC prototyping. Key features include up to 3.4 Mbits of embedded SRAM, dedicated DSP blocks for fixed- and floating-point math, support for multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, PCI), and up to 12 clock networks per device. The 130 nm process enables a maximum internal clock rate around 500 MHz and dense on-chip memory, while the 1020-ball FC-FBGA package provides sufficient I/O count and signal integrity for backplane and processor-bus attachment. Typical applications span telecom baseband processing, high-speed serial bridging, ASIC prototyping, and military/aerospace digital signal chains where deterministic latency and parallel processing outperform microcontrollers. The C5 speed grade indicates a moderately fast bin, balancing timing margin and power. This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP1S40F1020C5AA - Stratix 41K LE FPGA, 1020-FBGA, 130nm | Intel
The Intel (Altera) EP1S40F1020C5AA is a high-density Stratix family Field-Programmable Gate Array (FPGA) delivering 41,250 equivalent logic elements (LEs) and 3,423 Kbit of embedded memory in a 1020-ball FineLine BGA package. Fabricated on a 130 nm process, this device targets high-performance digital signal processing, communications infrastructure, and embedded compute workloads requiring parallel logic and abundant on-chip RAM. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware resources such as block RAM, DSP blocks, and high-speed transceivers. Within the broader taxonomy, FPGAs sit alongside microcontrollers and ASICs in the programmable logic segment of digital ICs, bridging software-defined flexibility with near-ASIC throughput. Stratix devices in particular occupy the high-performance tier of the Intel FPGA portfolio, competing with Xilinx Virtex-4/-5 and later Kintex families for bandwidth-critical designs. Key features of the EP1S40F1020C5AA include 14 embedded DSP blocks for hardware-accelerated multiplication-accumulation, 4 phase-locked loops (PLLs) for multi-domain clock synthesis, and support for external memory interfaces including DDR SDRAM, QDR SRAM, and FCRAM. The device supports I/O standards such as LVDS, LVTTL, LVCMOS, SSTL, and HSTL through 773 user I/O pins, enabling direct interfacing to DDR memories, parallel buses, and high-speed serial links. Per-pin slew-rate and drive-strength controls allow fine-grained signal-integrity tuning. The EP1S40F1020C5AA leverages a 1.5 V core supply with 130 nm CMOS technology, delivering a balance of logic density and power efficiency for its generation. The "C5" speed grade designates a commercial temperature rating (0 °C to +85 °C) and a specific timing closure tier, while the trailing "AA" suffix denotes a specific customer/programming variant. Designers use the Quartus II design suite for synthesis, place-and-route, timing analysis, and bitstream generation. Typical applications include high-speed data acquisition front-ends, software-defined radio (SDR) baseband processing, video broadcasting and image processing pipelines, network packet inspection engines, and ASIC prototyping. The combination of 41,250 LEs and 3.4 Mbit block RAM makes it well suited to multi-channel DSP designs where parallel filter banks or FFT engines must run concurrently. When designing with the EP1S40F1020C5AA, allocate sufficient PCB layers for the 1020-ball FBGA break-out, maintain continuous reference planes for the 1.5 V core and I/O voltage rails, and follow Intel's decoupling and power-sequencing guidelines to avoid in-rush events. Always validate timing closure in Quartus II for the target speed grade. This page synthesizes verified distributor inventory, parametric specifications, package documentation, and same-family alternative MPNs not consolidated on a single manufacturer page, giving engineers a one-stop reference for sourcing and second-sourcing this legacy Stratix device.
EP1S40F1020C5DM - Stratix FPGA 41250LE 1020-BGA | Intel
The Intel (formerly Altera) EP1S40F1020C5DM is a member of the Stratix FPGA family, featuring 41,250 logic elements, 773 user I/O pins, and 3.4 Mbits of embedded RAM, packaged in a 1020-ball FineLine BGA. Built on a 0.13 µm CMOS process, this device integrates up to 12 embedded DSP blocks for high-performance signal processing, plus 6 phase-locked loops (PLLs) for flexible clock management. The EP1S40F1020C5DM operates across commercial temperature grades and supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with up to 45 high-speed LVDS channels. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can reconfigure post-manufacture to implement custom digital logic. Stratix FPGAs occupy the high-performance tier of programmable logic, sitting between CPLDs (smaller, simpler) and ASICs (custom-fabricated, non-programmable). The EP1S40F1020C5DM's combination of logic density, embedded memory, DSP blocks, and high-speed transceivers makes it suitable for systems that previously required a custom ASIC. Key features include 41,250 logic elements, 3,423 Kbits of TriMatrix embedded memory (true dual-port, simple dual-port, and single-port modes), 12 DSP blocks delivering up to 28.8 GMACS at 200 MHz, six PLLs with eight output clocks each, and 16 clock networks across the device. The configuration scheme supports passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes via dedicated configuration pins. The 1020-ball FineLine BGA supports high I/O count while enabling dense PCB routing. The architecture uses 1.5 V core VCCINT with separate VCCIO banks supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V mixed-voltage interfacing. Distributed and row/column interconnect resources deliver fast, predictable timing closure for high-speed datapaths, and the embedded memory can be configured as FIFO, ROM, or RAM with byte-enable parity. The DSP blocks implement 9-bit × 9-bit, 18-bit × 18-bit, and 36-bit × 36-bit multipliers with adders and accumulators. Typical applications include high-performance digital signal processing for telecom base stations, HD video broadcast equipment, military radar front-end processing, high-speed serial protocol bridging (PCI Express, RapidIO, Gigabit Ethernet), and ASIC prototyping where designers map production logic to a Stratix device before committing to silicon. When designing with this device, allocate separate PCB layers for VCCINT, VCCIO, and GND planes, and place all decoupling capacitors within 5 mm of each BGA ball. Use the Quartus II design software for synthesis, place-and-route, and timing closure; legacy Altera legacy designs may require a Quartus II service pack migration. This page synthesizes distributor availability, drop-in alternatives from the Stratix family, and practical design notes that complement the manufacturer datasheet.
EP1S40F1020C5GA - Stratix FPGA 41K LE 1020-BGA | Altera / Intel
The Altera (Intel Programmable Solutions Group) EP1S40F1020C5GA is a member of the original Altera Stratix FPGA family, integrating 41,250 logic elements and 3,423,744 bits of on-chip RAM into a 1020-ball FineLine BGA package. As a -C5 speed grade, commercial-temperature device, it provides a balance of fabric performance and cost for high-volume logic, DSP and embedded applications. The Stratix series was Altera's first 0.13 µm 9-layer metal FPGA platform and is the precursor to Stratix II/III/IV families. A field-programmable gate array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic, from glue logic and protocol bridges to full processor subsystems and signal-processing pipelines. FPGAs sit hierarchically above ASICs in flexibility and below microcontrollers in per-unit cost, while offering parallel hardware execution that microcontrollers cannot match. The Stratix family specifically targets high-performance applications by combining a logic fabric, dedicated DSP blocks, M512/M4K/M-RAM memory blocks, and high-speed serial transceivers on a single die. Key features of the EP1S40F1020C5GA include 41,250 logic elements, 773 user I/O pins, 3,423,744 total RAM bits, embedded DSP blocks, and up to 12 high-speed transceiver channels depending on variant. The 1020-ball FineLine BGA package supports 4 dedicated PLL clock networks per device quadrant and supports LVDS, LVPECL, HSTL, SSTL, and PCI I/O standards. Configuration is handled via JTAG, passive serial, or Altera EPC configuration devices, and the device supports remote update and CRC-based configuration error detection. Typical applications include telecommunication line cards, high-speed serial protocol bridging, video and image processing, ASIC prototyping, and military/aerospace signal processing. The 1020-BGA package is targeted at high-density PCB designs with controlled-impedance routing, and the FineLine BGA ball pitch requires multi-layer PCB stack-up with microvia technology for breakout. When designing with this device, engineers should plan for power integrity with multiple decoupling capacitors per I/O bank, use IBIS simulation for high-speed LVDS interfaces, and verify the Quartus II / Quartus Prime device support status since this part is end-of-life. Always check the latest Altera/Intel product change notifications before committing the EP1S40F1020C5GA to new designs.
EP1S40F1020C5N - Stratix FPGA 41,250 LE | Intel | FBGA-1020
The Intel EP1S40F1020C5N is a member of the Stratix Field Programmable Gate Array (FPGA) family, delivering 41,250 logic elements (LEs), 3,423,744 bits of embedded memory, and 773 maximum user I/Os in a 1020-ball FineLine BGA package. Built on a 1.5 V, 130 nm CMOS process, it operates at a maximum internal frequency of 500 MHz and is rated for the commercial extended temperature grade. An FPGA (Field Programmable Gate Array) is a reconfigurable digital integrated circuit that combines programmable logic blocks, configurable interconnects, and embedded memory/DSP blocks into a single die. In the system hierarchy, FPGAs sit between general-purpose processors (CPUs/MCUs) and ASICs - offering hardware-level parallelism and I/O flexibility that microcontrollers cannot match, while avoiding the high NRE cost and long lead time of an ASIC. The Stratix family was Altera's (now Intel) flagship high-performance FPGA line, targeting telecom, DSP, and ASIC-prototyping workloads. Key features of the EP1S40F1020C5N include 4,125 Logic Array Blocks (LABs), embedded DSP blocks for high-speed multiply-accumulate operations, multiple phase-locked loops (PLLs) for clock management, and support for external memory interfaces including DDR SDRAM, QDR SRAM, and FCRAM. The device also includes dedicated high-speed transceiver-ready I/O banks and tri-state buffering on every pin. Architecturally, the Stratix I family introduced embedded TriMatrix memory (three sizes of memory blocks per LAB region), dedicated multiplier blocks, and the DirectDrive technology that ensures consistent signal integrity across the die. The C5 speed grade denotes the slowest of the commercial speed bins, trading maximum Fmax for lower dynamic power and improved timing margin - often the preferred choice for production ASIC prototyping where timing closure matters more than peak clock rate. Typical applications include high-speed digital signal processing (DSP), telecom baseband processing, ASIC prototyping and emulation, network packet processing, video and image processing pipelines, and military/aerospace signal intelligence systems. The 1020-ball FBGA package enables the large logic and memory capacity while supporting the high pin count required by wide external memory buses. When designing with this device, plan the power-decoupling network carefully - the FBGA-1020 package demands a multilayer PCB with dedicated power and ground planes, and the Quartus II tool flow should be used for place-and-route. The C5 speed grade may require additional pipelining stages compared to C6/C7 grades; verify timing closure before committing to this bin in volume. This page synthesizes distributor pricing, drop-in same-family Stratix alternatives, and practical design considerations not found in the manufacturer datasheet alone, helping engineers select and source the right Stratix variant for legacy and new designs.
EP1S40F1020C6 - 41,250 LE Stratix FPGA, 773 I/O, 1020-BGA | Altera
The Altera (Intel) EP1S40F1020C6 is a member of the original Stratix FPGA family, delivering 41,250 logic elements in a 1020-ball flip-chip BGA package with 773 user I/O pins. It is fabricated on a 1.5 V, 0.13 µm CMOS process and operates up to 450.05 MHz core frequency, making it one of the highest-density SRAM-based FPGAs in its generation. A Field-Programmable Gate Array (FPGA) is a programmable logic device that lets engineers implement arbitrary digital logic via a configurable array of logic elements, embedded multipliers, memory blocks, and routing. The Stratix family sits at the top of Altera's high-performance lineup and uses a hierarchy that maps to: logic element -> logic array block (LAB) -> device fabric -> FPGA -> programmable logic device -> semiconductor. The original Stratix family introduced DSP blocks and TriMatrix memory that became the foundation for later Stratix II, III, and IV families. Key features of the EP1S40F1020C6 include 4,235 Kbits of embedded RAM (M4K + M512 blocks) organized as TriMatrix memory, dedicated DSP blocks for high-speed multiplication, up to 12 high-speed transceiver channels (depending on variant), and support for external memory interfaces including DDR SDRAM, DDR2, QDR, and RLDRAM. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL through its 773 user I/O pins, which is unusually high for a 1020-BGA package. The EP1S40F1020C6 uses a 1020-ball FineLine BGA (FCBGA) with 33 x 33 mm body size and 1.0 mm ball pitch, providing high I/O density for routing-intensive designs. It is powered from a 1.5 V core supply with separate PLL analog supplies, and operates across the commercial 0 °C to +85 °C temperature range. The part is supplied in tray packaging with a single unit price around $1,836 as of 2026-09-07, reflecting its mature lifecycle status and constrained supply chain. Typical applications include high-speed telecommunications backplanes, signal processing in radar and imaging systems, prototyping for ASICs, network switching fabrics, and high-performance DSP pipelines. The device's embedded memory and DSP blocks make it well-suited for FIR filters, FFT engines, and real-time video processing. When designing with this part, engineers should note that the original Stratix family has been superseded by Stratix II/III/IV/10 families for new designs. Existing boards targeting the EP1S40F1020C6 should use Quartus II design software (legacy versions up to 13.0sp1) and verify availability via authorized distributors before committing to new production.
EP1S40F1020C6N - Stratix 41.25K LE FPGA, 1.5V, FBGA-1020 | Altera
The Altera EP1S40F1020C6N is a member of the original Stratix FPGA family built on a 130nm CMOS process, integrating 41,250 logic elements and housed in a 1020-ball FineLine BGA package measuring 33 x 33 mm with a 1 mm ball pitch. Per the verified web data, the device is rated for a commercial-extended operating temperature range of 0 C to 85 C and operates from a core supply of 1.5 V, delivering up to 450.05 MHz of internal performance. As an SRAM-based programmable logic device, it ships unconfigured and must be programmed via external configuration memory before use. An FPGA (Field Programmable Gate Array) is a programmable logic device that contains an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric, supplemented with dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit above ASICs in flexibility and below microcontrollers in per-unit cost, occupying the high-performance parallel-computing tier between general-purpose processors and custom silicon. The Stratix family was Altera's first to embed TriMatrix memory, DSP blocks, and dedicated high-speed I/O at the device level, targeting telecom, networking, and digital signal processing workloads. Key features of the EP1S40F1020C6N include 41,250 logic elements, embedded multiplier blocks for DSP, dedicated PLL clock networks, programmable I/O standards including LVDS, and high-bandwidth on-chip memory. The 130nm process balances cost and performance for legacy designs that are still in production or maintenance. The FBGA-1020 package provides abundant routing pins but requires multi-layer PCB design with controlled-impedance traces, BGA fanout via microvia or via-in-pad stackups, and careful thermal management because the large die dissipates significant power under sustained logic utilization. Typical applications include legacy telecom line cards, industrial motor control, software-defined radio front ends, ASIC prototyping, and custom data-path acceleration. Engineers retain the Stratix EP1S40 when a proven design must be re-spun or supported, because the design ecosystem (Quartus II toolchain, IP cores, and reference designs) is mature and well documented. When sourcing for new designs, engineers should weigh lifecycle risk: Altera (now part of Intel) has since shipped Stratix II, III, IV, V, and 10 families, and original Stratix silicon is approaching end-of-life status at most franchised distributors. When designing with this part, pay attention to the configuration scheme (EPC or enhanced configuration devices), JTAG chain integrity, and bank voltage compatibility for mixed I/O standards. Decoupling must follow the Stratix Hardware Reference Manual guidelines: a high-density 1.5V core plane plus per-pin bypass caps. Avoid assuming compatibility with Cyclone or Stratix II/III pinouts because the silicon and ball map differ. Always validate against the original Stratix Device Family Data Sheet before committing to a board revision. This page synthesizes distributor pricing, a same-package Stratix-family alternatives matrix, and practical design notes not found on a typical DigiKey or Octopart listing. Where the verified web data was insufficient for a parameter, the field is marked [DATA_NEEDED] rather than guessed.