EP1S30F780C7N - Stratix FPGA 32470 LE, 780-FBGA | Intel
N.º de pieza: EP1S30F780C7N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $951.9 | $951,90 |
| 10 | $880 | $8.800,00 |
| 100 | $780 | $78.000,00 |
| 500 | $695 | $347.500,00 |
| 1.000 | $620 | $620.000,00 |
EP1S30F780C7N Descripción general
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic. FPGAs sit at the top of the programmable-logic hierarchy: FPGA -> CPLD -> programmable logic -> digital IC -> semiconductor. They are distinguished from Application-Specific Integrated Circuits (ASICs) by re-programmability and from CPLDs by their greater logic density, embedded RAM blocks, DSP blocks, and high-speed transceiver support. The Stratix family in particular was Altera's first generation to embed TriMatrix memory blocks, DSP blocks, and high-speed I/O structures optimized for parallel processing and communications infrastructure.
Key features of the EP1S30F780C7N include embedded RAM of 3,317,184 bits distributed across TriMatrix memory blocks, four phase-locked loops (PLLs) for clock management, support for multiple I/O standards (LVTTL, LVCMOS, PCI, LVDS, SSTL, HSTL), and a dedicated JTAG boundary-scan interface conforming to IEEE 1149.1. The device supports both passive serial (PS) and fast passive parallel (FPP) configuration schemes using an Altera-enhanced configuration device.
Architecturally, the Stratix family combines a sea-of-LEs fabric with column-based DSP and memory blocks, allowing engineers to implement wide datapath operations, packet processing, and high-throughput DSP functions on a single chip. The embedded memory enables First-In-First-Out (FIFO) buffers, lookup tables, and dual-port RAM; the DSP blocks provide dedicated multipliers and adders for FIR filters, FFTs, and video processing. Compared with the older APEX family, Stratix moved to 130 nm and added true LVDS support and dedicated high-speed transceivers in higher-density members.
Typical applications include telecommunications backplane switching, network interface cards, high-speed serial protocol bridging (UTOPIA, SPI-4.2, SFI-4, 10 GbE MAC), digital video broadcasting, and high-performance DSP prototyping. Industrial 0 C to 85 C operation makes the part suitable for thermally-controlled telecom and computing equipment.
When designing with this part, allocate sufficient decoupling (typically 100 nF plus bulk 10-100 uF near each VCC/GND pair) and follow Stratix power-up sequencing requirements to keep VCCINT and VCCIO rails within the recommended ramp rates. Quartus II (or Quartus Prime in later releases) is the primary development environment; legacy Quartus II 9.0 is the latest version with full support for this Stratix silicon.
This page synthesizes distributor pricing, same-package drop-in alternatives from the Stratix family, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para EP1S30F780C7N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1S30F780C7N (mismo factor de forma y huella) — difiere en Package, Speed Grade, Operating Temperature, Process Technology, DSP Blocks.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1S30F780C7
✅ Sustitución directa✓ En stock
$135 / unidad
Ver hoja de datos →EP1S30F780C7AA
✅ Sustitución directa✓ En stock
$142 / unidad
Ver hoja de datos →EP1S30F780C6N
✅ Sustitución directa✓ En stock
$185 / unidad
Ver hoja de datos →EP1S30F780C6
✅ Sustitución directa✓ En stock
$1125 / unidad
Ver hoja de datos →EP1S30F780C6GA
✅ Sustitución directa✓ En stock
$1100 / unidad
Ver hoja de datos →EP1S30F780C7N Valores máximos y características eléctricas
| Family | Stratix |
| Logic Elements | 32,470 |
| Logic Array Blocks (LABs) | 3,247 |
| Configurable Logic Blocks (CLBs) | 3,819 |
| Embedded Memory Bits | 3,317,184 bits |
| Maximum User I/O | 597 |
| PLLs | 4 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V |
| Temperatura de funcionamiento | 0 C to 85 C (Commercial) |
| Encapsulado | 780-ball FC-FBGA (29 x 29 mm, 1 mm pitch) |
| Tipo de montaje | Surface Mount |
| Configuration Interface | JTAG (IEEE 1149.1) / Passive Serial / Fast Passive Parallel |
| Internal Speed Grade | C7 |
| Lead Free / RoHS | Lead Free per FindIC datasheet entry (2014-12-09) |
Guía de configuración de pines de EP1S30F780C7N 780-ball fc-fbga (29 x 29 mm, 1 mm pitch)
Configuración de pines para EP1S30F780C7N (encapsulado 780-ball fc-fbga (29 x 29 mm, 1 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP1S30F780C7N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP1S30F780C7N es adecuado para 7 aplicacións: Telecommunications Backplane Switching, Network Interface Cards (NIC) / Protocol Bridging, Digital Video Broadcasting Equipment, High-Performance DSP Prototyping, Industrial Control / Test Equipment, Legacy Storage / RAID Controllers, Aerospace / Defense Signal Processing (legacy programs).
Telecommunications Backplane Switching
The EP1S30F780C7N fits telecom backplane switching applications because its 32,470 logic elements, 597 user I/Os, and 4 PLLs provide the parallel datapath width and clock-domain management required by multi-gigabit bus standards. Its embedded TriMatrix memory (3.3 Mbit) is large enough to buffer packet headers and traffic-manager queues between ingress and egress ports without external SSRAM, simplifying board layout. The 1.5 V VCCINT plus selectable 1.5/1.8/2.5/3.3 V VCCIO let one device bridge legacy LVTTL control logic with newer LVDS / SSTL backplane PHYs. Designers typically instantiate SPI-4.2 or UTOPIA Level 3 cores from the Altera MegaCore library and target fMAX around 100-133 MHz DDR on the source-synchronous bus.
Recomendado
Network Interface Cards (NIC) / Protocol Bridging
In NIC and protocol-bridging designs, the EP1S30F780C7N is a strong fit because its Stratix architecture implements 10/100/1000 Ethernet MACs, SPI-3/SPI-4.2 PHY interfaces, and custom packet-classification engines in a single chip. The 130 nm process provides the headroom for sustained 125 MHz DDR on LVDS I/O, which is the typical rate for SPI-4.2 PL4 interfaces. The dedicated PLL count (4) supports independent transmit and receive clock domains plus a system reference. With 3.3 Mbit of embedded RAM, designers can build line-rate lookup tables and statistics counters without external memory.
Recomendado
Digital Video Broadcasting Equipment
The EP1S30F780C7N suits DVB encoder / decoder and MPEG transport-stream processing because the TriMatrix memory blocks can be configured as dual-port buffers for video frame reordering, while the 32K LE fabric implements TS demultiplexers, PSI/SI table parsers, and PCR restamping logic in a single device. Source-synchronous LVDS I/O pairs cleanly receive DVB-ASI (270 Mbps) and parallel TS buses (up to ~1 Gbps). The 780-FBGA exposes enough user I/Os (597) for head-end chassis with multiple TS inputs and outputs plus Ethernet management. Industrial 0-85 C temperature operation covers the chassis-internal environment typical of head-end racks.
Recomendado
High-Performance DSP Prototyping
The EP1S30F780C7N works well for DSP prototyping (FIR filters, FFTs, video codecs) because its dedicated DSP blocks implement hardened multipliers and add-accumulators at high fMAX, while the surrounding 32K-LE fabric implements control state machines and address generators. The 3.3 Mbit embedded memory is large enough to hold FFT twiddle tables and video line buffers, eliminating external SSRAM in many designs. LVDS source-synchronous I/O at up to 640 Mbps supports high-speed ADC/DAC interfacing in instrumentation front-ends. Quartus II 9.0 provides IP cores (FFT, FIR, NCO) optimized for the Stratix DSP block architecture.
Recomendado
Industrial Control / Test Equipment
The EP1S30F780C7N fits industrial test-and-measurement chassis where its 597 user I/Os can be split among instrument buses (GPIB, LXI, USB, RS-485), front-panel display controllers, and FPGA-mezzanine-card (FMC) sites. The 1.5 V core plus selectable VCCIO levels simplifies level-shifting to mixed-voltage peripherals. Embedded 3.3 Mbit RAM holds waveform capture buffers and protocol trace memory. Industrial 0-85 C temperature operation covers the chassis-internal thermal envelope. The JTAG (IEEE 1149.1) boundary-scan interface simplifies board bring-up and in-system diagnostics.
Recomendado
Legacy Storage / RAID Controllers
Storage and RAID controller cards in the late 2000s frequently used the EP1S30F780C7N because its 597 I/Os are sufficient to drive multiple SATA / SAS PHYs plus a PCIe x4 endpoint, while the 3.3 Mbit embedded RAM serves as on-chip command-queue and write-back cache scratchpad. The 4 PLLs generate the precise reference clocks required by SATA 1.5/3.0 Gbps serial interfaces. The 780-FBGA's 1 mm pitch is compatible with standard high-layer-count PCB stackups used in storage backplanes. Migration paths to Cyclone V or Stratix V are documented in Altera application notes AN 532 and AN 633.
Recomendado
Aerospace / Defense Signal Processing (legacy programs)
Although the EP1S30F780C7N is not radiation-hardened, it is widely found in commercial-off-the-shelf (COTS) aerospace and defense signal-processing subsystems (radar IF stages, electronic-warfare test rigs, flight-simulator I/O) that operate in temperature-controlled enclosures. The 32K-LE fabric and 4 PLLs enable multi-channel beamforming and IF digitizer fan-out. The 780-FBGA is mechanically compatible with standard VITA 57 FMC mezzanine sites. For new aerospace programs, the Altera (now Intel) recommendation is to migrate to radiation-tolerant Cyclone V or Microsemi RTG4 families.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1S30F780C7N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1S30F780C7 | EP1S30F780C7AA | EP1S30F780C6N | EP1S30F780C6 | EP1S30F780C6GA |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-FBGA (29x29 mm, 1 mm pitch) | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same |
| Logic Elements | 32,470 | 32,470 | 32,470 | 32,470 | 32,470 | 32,470 |
| Speed Grade | C7 | C7 | C7 | C6 (slower) | C6 (slower) | C6 (slower) |
| Ball Finish | Lead-Free (Pb-free) | SnPb (tin-lead) | Per AA suffix spec | Lead-Free | SnPb | Per GA suffix spec |
| User I/O Count | 597 | 597 | 597 | 597 | 597 | 597 |
| Embedded Memory | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits | 3,317,184 bits |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0 C to 85 C | 0 C to 85 C | Per AA suffix spec | 0 C to 85 C | 0 C to 85 C | Per GA suffix spec |
| Lifecycle Status | NRNR (Not Recommended for New Designs) | NRNR | NRNR | NRNR | NRNR | NRNR |
Diferenciadores clave
- Mid-density Stratix silicon with 32K LEs in 780-BGA package (frente a EP1S25F780C7N)
- Higher internal speed grade (C7) than C6 alternatives (frente a EP1S30F780C6N)
- Lead-free (Pb-free) ball finish (frente a EP1S30F780C7)
Notas de diseño
Stratix EP1S30F780C7N requires three power rails: VCCINT at 1.5 V, VCCIO at 1.5/1.8/2.5/3.3 V per bank, and VCC_PLL for the 4 PLLs (typically 1.5 V). VCCINT must ramp monotonically within the POR timing window (typically <100 ms from 0 V to 1.5 V). Bulk decoupling of 100-220 uF plus 10 uF per VCC_PLL pin is recommended; high-frequency decoupling uses 100 nF X7R placed within 5 mm of each VCC/GND ball pair. Altera AN 366 (Stratix PowerPlay) provides detailed power-budget worksheets for the C7 speed grade at typical 100 MHz logic utilization.
The 780-FBGA uses 1.0 mm ball pitch (JEDEC MO-151). Use a minimum 10-layer PCB stackup with dedicated ground and power planes. Microvia (laser-drilled) or stacked-via structures are required for fan-out from inner-row balls. Maintain a continuous reference plane under all LVDS pairs and source-synchronous buses to control impedance (target 100 ohm differential, 50 ohm single-ended). Per Altera AN 315, via-in-pad is acceptable but should not exceed 20% of total ball count to maintain assembly yield. Pin 1 (A1 ball) is located per the JEDEC MO-151 top-left convention.
Assign high-speed LVDS pairs (TX/RX clocks) to bank edges nearest the corresponding PLL inputs to minimize clock-distribution skew. The 4 PLLs are physically distributed across the die; consult the Stratix pinout file in Quartus II 9.0 to map PLL numbers to specific I/O banks. Keep PLL analog VCC_PLL balls separated from noisy digital VCC by a ferrite bead or pi-filter. JTAG TCK should be a 10-25 MHz signal routed on an inner layer to reduce EMI; include a TCK pull-down to ensure defined state during configuration.
Stratix I/O supports LVDS at up to 640 Mbps source-synchronous and 1 Gbps with external termination. For DDR LVDS interfaces, use the dedicated DPA (Dynamic Phase Alignment) circuitry available in C7-speed-grade parts to recover clock-to-data phase at the receiver. SSTL and HSTL Class I/II outputs require external series termination (typically 25-33 ohm) within 5 mm of the FPGA pin. Refer to Altera AN 477 (Stratix High-Speed I/O) for detailed IBIS model usage and channel-budget analysis.
Do not confuse the EP1S30F780C7N with the EP1S30F1020C7N: same die, different packages (780-BGA vs 1020-BGA), different PCB footprints. Do not confuse the C7 speed grade with the I7 industrial-temperature grade; the latter uses an 'I' prefix (e.g., EP1S30F780I7N). Quartus Prime (>=15.0) does not officially support first-generation Stratix, so retain Quartus II 9.0 in your toolchain if you must continue using this silicon. Configuration via fast passive parallel (FPP) requires an enhanced configuration device (EPC16 or EPC64); standard EPC2 / EPC4 devices only support passive serial.
Información de cumplimiento
N suffix denotes lead-free (Pb-free) ball finish per FindIC datasheet entry dated 2014-12-09; AEC-Q100 is not applicable for FPGAs (automotive-grade variants use a separate part numbering scheme). REACH and conflict-minerals status not confirmed in the verified web data.
