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Productos (32725)

XC3090LTM-100PC84C - 6K Gate, 320-Cell FPGA 5V 84-PLCC | Xilinx
XC3090LTM-100PC84C

XC3090LTM-100PC84C - 6K Gate, 320-Cell FPGA 5V 84-PLCC | Xilinx

The Xilinx XC3090LTM-100PC84C is a CMOS Field Programmable Gate Array (FPGA) from the legacy XC3000 Logic Cell Array family, delivering approximately 6,000 usable gates and 320 Configurable Logic Blocks (CLBs) in an 84-pin Plastic Leaded Chip Carrier (PLCC) package. Operating at 5V CMOS technology with a 100 MHz internal performance grade, the device is rated for commercial temperature conditions and targets low-voltage logic integration where fine-grained parallel logic is required. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that combines the density of gate arrays with the design flexibility of in-system programmability. FPGAs sit at the top of the programmable logic hierarchy (PLD -> CPLD -> FPGA -> SoC FPGA) and are widely used to implement custom digital logic, glue logic, bus interfaces, and parallel datapaths without committing to a masked ASIC. The XC3000 family is the third-generation Xilinx architecture that introduced distributed Configurable Logic Blocks with look-up table-based logic, complemented by a programmable interconnect matrix and I/O blocks. Key features of the XC3090LTM-100PC84C include 320 CLBs, a typical gate count range of 5,000 to 6,000 gates, 100 MHz system performance, and 5V CMOS core technology. The PLCC-84 (PC84) package uses J-lead surface-mount terminals in a square ceramic/plastic body, supporting legacy through-hole-style PCB assembly processes. The XC3000 family pioneered SRAM-based configuration, allowing infinite re-programmability via an external configuration PROM or microcontroller bitstream load. From an architecture perspective, the XC3000L family uses 5V-tolerant I/O buffers, distributed RAM capability in select CLB modes, and a hierarchical interconnect that routes signals between logic blocks with predictable delay. The 'LTM' suffix designates the low-voltage / commercial temperature variant in the XC3000 family. Compared with modern 28nm or 16nm FPGAs, the XC3090LTM-100PC84C delivers modest logic density but remains useful for legacy board retrofits, education platforms, and industrial systems where proven long-life silicon is required. Typical applications include industrial control glue logic, legacy telecommunications interfaces, military and aerospace retrofits (through QML equivalents), educational FPGA training platforms, and digital signal preprocessing where low-cost parallel logic suffices. The 84-pin PLCC footprint is socket-compatible with the broader XC3000/XC3100/XC3300 84-pin PLCC family, simplifying board reuse across multiple design generations. When designing with this device, ensure proper configuration circuitry is included - the SRAM-based XC3000 family requires a configuration bitstream at every power-up. Plan for 5V supply decoupling, and verify I/O voltage compatibility with downstream CMOS or TTL peripherals. Engineers targeting new designs should consider the device's NRND/EOL status and confirm lifetime-buy availability for production runs. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, providing a single reference for engineers evaluating the XC3090LTM-100PC84C for both new designs and legacy support scenarios.

USD $41,40 En stock
XC3090LTM-125PC84C - 5000 Gates XC3000L FPGA, 125MHz, PLCC-84 | Xilinx
XC3090LTM-125PC84C

XC3090LTM-125PC84C - 5000 Gates XC3000L FPGA, 125MHz, PLCC-84 | Xilinx

The Xilinx XC3090LTM-125PC84C is a 5000-gate, 125 MHz Field Programmable Gate Array (FPGA) from the legacy XC3000L Low-Voltage Logic Cell Array family, housed in an 84-pin Plastic Leaded Chip Carrier (PLCC-84) package. It delivers approximately 5000 equivalent gates, 320 Configurable Logic Blocks (CLBs), and 928 flip-flops, with a maximum clock frequency of 125 MHz. The 'L' suffix denotes the low-voltage 3.3 V core variant, and 'TM' indicates the commercial plastic-leaded chip carrier package grade. An FPGA (Field Programmable Gate Array) is a programmable logic device that lets engineers implement arbitrary digital logic functions using an array of configurable logic blocks (CLBs) interconnected by a programmable routing matrix. Within the broader semiconductor taxonomy, an FPGA belongs to programmable logic devices (PLDs), which sit between fixed-function ASICs and discrete logic ICs in flexibility and integration. The XC3000L family was Xilinx's third-generation low-voltage FPGA line, succeeding the original XC3000 by operating from 3.0 V to 3.6 V supplies instead of 5 V, enabling lower power consumption for portable and battery-powered designs of the 1990s. Key features include 320 CLBs, 928 flip-flops, 138 user I/Os, 4.75 V to 5.25 V supply range for the I/O bank, an internal 3.3 V core, and a 125 MHz maximum toggle/clock frequency. The device supports JTAG-based boundary-scan testing, on-chip configuration memory, and tri-state output buffers per I/O. The PLCC-84 through-hole package provides robust mechanical mounting suitable for industrial and legacy equipment designs. Technically, the XC3090LTM-125PC84C uses SRAM-based configuration cells, meaning the bitstream must be loaded from an external ROM or microcontroller at every power-up. This volatile configuration enables unlimited re-programming cycles in the field, but requires a separate configuration PROM such as the XC1736 or compatible serial-loader device. The architecture implements a symmetrical array of CLBs surrounded by perimeter I/O blocks (IOBs), which was the industry-standard FPGA floorplan of that era. Typical applications include industrial control logic, telecom interface glue logic, legacy peripheral adapters, and test-and-measurement custom instrumentation. The wide I/O count (138) supports parallel buses and high-pin-count glue-logic designs. When designing with this FPGA, allocate at least 4 clock-pad pins for global clock distribution and ensure the configuration PROM timing aligns with the XC3090LTM power-on reset sequence. For new designs, consider migrating to a modern Xilinx 7-series or Spartan-6 device, since the XC3000L family is no longer recommended for new designs. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

USD $20,85 En stock
XC3090LTM-8PC84C - XC3000L FPGA, 6K Gates, 84-PLCC | Xilinx
XC3090LTM-8PC84C

XC3090LTM-8PC84C - XC3000L FPGA, 6K Gates, 84-PLCC | Xilinx

The Xilinx XC3090LTM-8PC84C is a member of the legacy XC3000L Low Voltage Logic Cell Array family, delivering approximately 6,000 usable gates in an 84-pin Plastic Leaded Chip Carrier (PLCC) package. The device is built on a 0.8-micron CMOS SRAM-based architecture and operates from a 3.0 V to 3.6 V core supply, with the "L" suffix designating low-voltage operation relative to the original 5 V XC3000 series. The "TM" suffix indicates a specific speed/grade combination within the XC3000L family. A Field Programmable Gate Array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and programmable I/O cells. The user-defined logic function is loaded into on-chip static memory cells from an external boot source such as an EEPROM, EPROM, ROM, or microprocessor. Once configured, the FPGA behaves as a dedicated custom digital circuit. The XC3000 family was Xilinx's pioneering commercial FPGA line, establishing the FPGA architecture still dominant in the industry today, and the XC3000L variant extends that architecture to lower-voltage 3.3 V systems where power dissipation is a primary concern. Key features of the XC3090LTM-8PC84C include approximately 320 Configurable Logic Blocks (CLBs), 64,160 bits of distributed configuration memory, and an 84-pin PLCC package with J-lead surface-mount terminations. The device supports in-system configuration via the Xilinx XC3000 configuration bitstream and is footprint-compatible with other XC3090L members that share the PC84 pinout. Logic delays are typically in the 5-10 ns range, sufficient for moderate-speed glue logic, bus interfacing, state-machine implementation, and small processor prototyping on 3.3 V rails. Typical applications include legacy 3.3 V digital glue logic replacement, prototype ASIC emulation, custom peripheral interfacing for microcontrollers, parallel bus arbitration, and industrial control subsystems where 5 V FPGAs are no longer acceptable. The 84-PLCC package also supports through-hole and socket-based prototyping, which is convenient for engineering development and low-volume production. Designers should note that the XC3000L family is legacy silicon - the Xilinx WebPACK and modern Vivado tools do not support these devices. Programming requires the legacy XACT or older Foundation toolchains, and configuration bitstreams generated for XC4000, Spartan, or 7-series FPGAs are incompatible. Engineers maintaining legacy systems should verify the configuration PROM and toolchain availability before committing to new designs.

USD $43,25 En stock
XC3S1600E-4FG484I - 1.6M Gate Spartan-3E FPGA | AMD Xilinx
XC3S1600E-4FG484I

XC3S1600E-4FG484I - 1.6M Gate Spartan-3E FPGA | AMD Xilinx

The AMD Xilinx XC3S1600E-4FG484I is a Spartan-3E family Field Programmable Gate Array (FPGA) delivering 1.6 million system gates, 33,192 logic cells, and 376 user I/Os in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package. Fabricated on a 90nm CMOS process with a 1.2V core supply, this industrial-temperature device (I suffix, -40C to +100C) runs at speed grade -4 and integrates 29,504 registers and 648 Kbits (663,552 bits) of distributed and block RAM. An FPGA (Field Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks (CLBs) and programmable interconnects that the designer configures in the field via HDL (VHDL/Verilog). Within the programmable logic hierarchy, the FPGA sits above CPLDs in capacity and sits alongside ASSPs as a core digital logic implementation platform for system-on-chip prototyping and production designs. Key features of the XC3S1600E include 3,688 CLBs/LABs providing high logic density, 572MHz maximum toggle capability supported by dedicated digital clock managers (DCMs), and abundant block RAM for FIFOs and dual-port memories. The 376 I/Os support multiple I/O standards with configurable banks, enabling wide data-path interfaces. Architecturally, the Spartan-3E platform uses a 4-input look-up table (LUT) based fabric with dedicated carry logic, multiplier blocks, and DCMs for clock conditioning - well suited to cost-sensitive control, glue logic, and DSP-lite tasks. The 90nm process keeps core power low at 1.2V while retaining robust routing flexibility. Typical applications include industrial control and automation, embedded system prototyping, data acquisition glue logic, motor control interfaces, and communications line cards. The wide 376-I/O budget makes it a natural fit for bus bridging and parallel-to-serial adaptation. A key design consideration: the Spartan-3E family is mature, so plan configuration via a platform Flash PROM (such as XCF-series) and verify 1.2V core, 3.3V auxiliary, and I/O bank rails meet sequencing guidance in the datasheet. This page synthesizes distributor pricing, drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet.

USD $276,00 En stock
XC3S1600E-5FGG320C - Spartan-3E FPGA 1.6M Gates | AMD/Xilinx
XC3S1600E-5FGG320C

XC3S1600E-5FGG320C - Spartan-3E FPGA 1.6M Gates | AMD/Xilinx

The AMD (Xilinx) XC3S1600E-5FGG320C is a Spartan-3E family FPGA with 1.6 million system gates, 33,192 logic cells, and 250 user I/Os, fabricated on 90nm CMOS process technology and housed in a 320-ball fine-pitch BGA (FGG320, 19x19 mm) package. It operates from a 1.2V core supply (1.14V to 1.26V) with a commercial temperature range of 0C to 85C junction, and speed grade -5. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks (CLBs), embedded memory, and programmable interconnects that designers configure via a hardware description language such as Verilog or VHDL. Within the semiconductor hierarchy, an FPGA sits under programmable logic devices, alongside CPLDs and ASICs, and is used to implement custom digital logic without fabricating a custom chip. Key features of the XC3S1600E include a large 1.6M-gate fabric for mid-density designs, 250 user I/Os supporting multiple I/O standards, Spartan-3E cost-optimized architecture, and availability of configuration via platform flash devices such as the XCF32P. The Spartan-3E family was widely adopted in telecommunications, industrial control, and consumer electronics, per Microchip USA product data. Architecturally, the Spartan-3E fabric uses 4-input look-up tables (LUTs), dedicated carry logic, block RAM, and embedded multipliers, enabling DSP datapaths, glue logic consolidation, bus interfaces, and control sequencing on a single chip. Typical applications include industrial control systems, telecommunications line cards, test equipment, motor control interfaces, and legacy system sustenance where a proven mid-density FPGA is already designed in. Design consideration: this part is officially obsolete and no longer manufactured, per DigiKey lifecycle data, so new designs should evaluate AMD 7-series (Spartan-7, Artix-7) or cross-brand alternatives; existing designs should secure stock or a qualified migration path. This page synthesizes distributor pricing, drop-in alternatives, lifecycle status, and practical design notes not consolidated in the manufacturer datasheet.

USD $204,51 En stock
XC3S1600EFG400 - Spartan-3E FPGA 1.6M Gates | AMD/Xilinx
XC3S1600EFG400

XC3S1600EFG400 - Spartan-3E FPGA 1.6M Gates | AMD/Xilinx

The AMD/Xilinx XC3S1600EFG400 is a member of the Spartan-3E family of Field Programmable Gate Arrays (FPGAs), offering a high-density programmable logic solution with 33,192 logic cells and an equivalent gate count of 1,600,000. Housed in a 400-ball FBGA package (FG400), this device provides 304 user I/O pins and 663,552 bits of block RAM, making it suitable for a wide range of digital designs. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence 'field-programmable'. FPGAs consist of an array of programmable logic blocks, interconnects, and I/O blocks, allowing the implementation of complex digital circuits without the need for custom fabrication. They are a subset of programmable logic devices (PLDs) and are widely used in prototyping, low-to-medium volume production, and applications requiring reconfigurability. Key features of the XC3S1600EFG400 include 33,192 logic cells, 663,552 bits of block RAM, and support for a maximum clock frequency of 572 MHz. The device operates from a 1.2V core voltage and is manufactured using advanced CMOS technology. The FG400 package offers 400 balls with a 1.00 mm pitch, providing a compact footprint for space-constrained designs. The Spartan-3E architecture is optimized for high performance and low cost, featuring dedicated multipliers, digital clock managers (DCMs), and support for various I/O standards including LVCMOS, LVTTL, and differential standards. The device also includes configuration support via JTAG, SPI, and SelectMAP interfaces, enabling flexible system integration. Typical applications for the XC3S1600EFG400 include industrial control, automotive infotainment, consumer electronics, and communication systems. Its balance of logic density, I/O count, and cost makes it ideal for bridging ASIC prototyping and production. When designing with this FPGA, careful attention must be paid to power supply decoupling and configuration bitstream storage. The 1.2V core requires stable power, and the configuration data is typically stored in an external SPI flash, which must be selected for compatibility.

USD $29,00 En stock
XC3S200-4FTG256I - Spartan-3 FPGA 200K Gates | Xilinx
XC3S200-4FTG256I

XC3S200-4FTG256I - Spartan-3 FPGA 200K Gates | Xilinx

The Xilinx XC3S200-4FTG256I is a Spartan-3 family field programmable gate array (FPGA) offering 200,000 system gates and 4,320 logic cells in a 256-ball FineLine BGA (FTG256) package, with a 1.2V core voltage, industrial temperature rating of -40C to +100C, and a -4 speed grade supporting internal performance up to approximately 630 MHz. A field programmable gate array is a semiconductor device containing a fabric of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks that the designer configures after manufacturing. FPGAs sit within the broader programmable logic hierarchy: CLB -> FPGA -> programmable logic device -> digital IC. Unlike fixed-function ASICs, FPGAs allow field reprogramming, making them ideal for prototyping, low-to-medium volume production, and designs requiring in-service updates. Key features of the XC3S200 include 2,160 slices built on a 90nm process technology, 12 blocks of 18Kbit block RAM totaling 216 Kbits of embedded dual-port memory, four 18x18 hardware multipliers for DSP operations, a Digital Clock Manager (DCM) for clock deskew and frequency synthesis, and up to 173 user I/Os supporting multiple I/O standards such as LVTTL, LVCMOS, SSTL, and LVDS on bank-selectable VCCO rails. Technically, the Spartan-3 fabric uses a four-input lookup table (LUT) per slice logic cell with dedicated fast carry logic for arithmetic chains. The -4 speed grade denotes the fastest standard commercial/industrial timing bin of the Spartan-3 family. Configuration is performed via serial or parallel PROMs (Xilinx Platform Flash) in Master/Slave Serial or SelectMAP modes with JTAG boundary-scan support per IEEE 1149.1. Typical applications include industrial control and motor drive logic, communication protocol bridging, test and measurement instrumentation, and embedded coprocessing with the hardware multipliers for modest DSP tasks. The 17x17mm FTBGA footprint suits space-constrained boards requiring high I/O density. A key design consideration is power: the 1.2V core requires a dedicated regulator, and I/O bank VCCO supplies must match the connected logic standards; total power scales with clock frequency and toggle rates, so use the Xilinx power estimator early in design. This page synthesizes verified distributor data, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.

USD $16,40 En stock
XC3S200A-4FTG256I - 200K Gate Spartan-3A FPGA, 195 I/O | AMD/Xilinx
XC3S200A-4FTG256I

XC3S200A-4FTG256I - 200K Gate Spartan-3A FPGA, 195 I/O | AMD/Xilinx

The AMD/Xilinx XC3S200A-4FTG256I is a Spartan-3A family Field Programmable Gate Array (FPGA) with 200,000 system gates, 4,032 logic cells, and 195 user I/Os in a 256-ball FineLine Thin-profile BGA (FTG256) package at industrial temperature grade (I suffix). Built on 90nm CMOS technology with a 1.2V core, the device targets cost-sensitive, high-volume digital logic applications. An FPGA (Field Programmable Gate Array) is a class of programmable logic device that allows engineers to implement arbitrary digital circuits using a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as block RAM and multipliers. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs and CPLDs as reconfigurable logic; the Spartan-3A family is Xilinx's low-cost, high-volume segment designed for consumer, industrial, and communications glue-logic applications. Key specifications of the XC3S200A-4FTG256I include 448 Configurable Logic Blocks (CLBs), 288 Kbits of block RAM, up to 667 MHz maximum operating frequency (speed grade -4), dedicated 18x18 hardware multipliers for DSP, and a Digital Clock Manager (DCM) block for clock synthesis. The FTG256 package measures 17x17 mm and uses a 1.0 mm ball pitch. Architecturally, the Spartan-3A integrates CLBs arranged in rows and columns, surrounded by IOBs (I/O blocks), with block RAM columns interleaved, four DCMs, and dedicated multiplier blocks. The device supports multiple I/O standards including LVTTL, LVCMOS, LVDS, and differential HSTL/SSTL for direct interface to external memories and high-speed peripherals. Typical applications include industrial control and machine vision, consumer electronics display controllers, communications protocol bridges, low-cost video processing, motor control, and educational/hobbyist development boards. The wide operating temperature range (-40C to +100C industrial grade) also suits factory automation and outdoor equipment. Designers should pay attention to the FTG256 ball-pinout for PCB layout: a 256-ball BGA with 1.0 mm pitch requires 4-6 layer PCB design with microvia or via-in-pad technology for reliable assembly. Use Xilinx ISE WebPACK or the modern AMD Vivado/Vivado Lab Edition for configuration bitstream generation. Power estimation should be performed with the Xilinx Power Estimator (XPE) tool before finalizing thermal management. This page consolidates current distributor pricing, verified pin-compatible drop-in alternatives in the Spartan-3A family, and practical design notes - practical context not found in the bare manufacturer datasheet.

USD $21,80 En stock
XC3S400A-4FTG256C - Spartan-3A FPGA, 400K Gates, 256-FTBGA | AMD
XC3S400A-4FTG256C

XC3S400A-4FTG256C - Spartan-3A FPGA, 400K Gates, 256-FTBGA | AMD

The AMD (Xilinx) XC3S400A-4FTG256C is a Spartan-3A Field Programmable Gate Array (FPGA) with 400,000 system gates, 8,064 logic cells, and 195 user I/Os housed in a 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA) measuring 17 × 17 mm. Built on a 90 nm CMOS process, the part operates across 0°C to +85°C commercial temperature range and supports up to 770 MHz internal clock performance per the Spartan-3A family datasheet. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (semiconductor IC) that lets engineers configure digital logic, memory blocks, and I/O behavior after manufacture. Within the broader taxonomy, the Spartan-3A sits under FPGA -> programmable logic -> logic ICs -> integrated circuits -> semiconductor. FPGAs like the Spartan-3A family are used as flexible hardware platforms that replace large clusters of discrete glue logic, custom ASICs, and processor peripherals, enabling rapid design iteration without a fabrication spin. Key differentiating features of the XC3S400A include 368,640 bits of embedded Block RAM distributed across 20 dedicated blocks (each 18 Kbit), 4 dedicated silicon hardware multipliers (18 × 18-bit signed), 4 Digital Clock Managers (DCMs) for clock conditioning, and integrated configuration support for SPI, BPI, and JTAG modes. The 256-FTBGA package offers high board-density and a low-profile mounting footprint suitable for portable and embedded products, while the commercial speed/grade designation ("-4") reflects the timing/voltage balance selected for general-purpose logic systems. Architecturally, the Spartan-3A uses a structured ASIC-style fabric of Configurable Logic Blocks (CLBs), a hierarchical routing network, and a hardened set of I/O standards including LVCMOS, LVTTL, LVDS, and HSTL. The four silicon multipliers deliver deterministic DSP performance independent of slice utilization, while the four DCMs provide frequency synthesis, phase shifting, and jitter filtering on a per-clock-domain basis. Typical applications for the XC3S400A-4FTG256C include industrial control and factory automation backplanes, video/image processing front-ends, low-density DSP pipelines, embedded display controllers, automotive infotainment prototyping, communications glue logic, and legacy parallel-interface bridges between microcontrollers and high-speed peripherals. Its combination of moderate logic density and ample Block RAM makes it a strong fit for cost-sensitive designs that would otherwise require several smaller FPGAs. When designing with the 17 × 17 mm FTG256 package, allocate at least four PCB layers with a solid ground plane under the device to control simultaneous switching noise (SSN). All I/O banks must share a common Vcco reference per bank, and unused pins should be left floating per AMD/Xilinx guidelines to avoid leakage paths during configuration. This page synthesizes distributor pricing, drop-in same-package alternatives (XC3S400A-4FTG256I and XC3S400-4FTG256C), and practical design notes not consolidated in the manufacturer datasheet alone.

USD $16,42 En stock
XC3S50-4CP132I - 50K-Gate Spartan-3 FPGA | Xilinx
XC3S50-4CP132I

XC3S50-4CP132I - 50K-Gate Spartan-3 FPGA | Xilinx

The Xilinx XC3S50-4CP132I is a 50,000-system-gate Spartan-3 field-programmable gate array in a 132-terminal, approximately 8 mm square TFBGA package. Verified listings identify the device as a 192-CLB FPGA, while one comparison source states 630 MHz and 90 nm process technology. The “-4” ordering code identifies the performance grade, “CP” identifies the package family, “132” identifies the terminal count, and “I” identifies the industrial temperature grade. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interconnect, and programmable I/O resources can be configured after manufacture. Within the product hierarchy, an FPGA is a programmable logic device and a configurable semiconductor. Spartan-3 devices target cost-sensitive embedded systems where parallel logic, state machines, protocol handling, data acquisition, and modest control functions must fit into a compact board area. The verified sources report 50,000 system gates and 192 configurable logic blocks. The DigiKey result for the closely identified XC3S50-4CPG132I also reports 73,728 registers and 1,728 logic cells, but those figures were not explicitly supplied for XC3S50-4CP132I and therefore are not treated as target specifications here. The target belongs to the Spartan-3 family and is suitable for consumer, automotive, industrial, telecommunications, communications-hardware, and embedded-control applications. The CP132 package uses ball terminals and is identified by sources as TFBGA or CSPBGA. Because it is a fine-pitch, 132-terminal surface-mount package, PCB layout quality directly affects assembly yield and long-term reliability. Its approximately 8 mm square body demands exact land-pattern, solder-mask, stencil, and component-placement verification against the manufacturer package drawing before fabrication. Typical designs use configurable logic for acquisition control, sensor conditioning, digital filtering, communications, industrial interfaces, and compact embedded systems. Unlike a microcontroller, this FPGA performs parallel operations in hardware and can achieve deterministic latency after configuration. Designers must still supply configuration memory or another supported configuration source, clocking, decoupling, I/O standards, and a valid power-distribution network. The primary procurement caution is lifecycle and exact-ordering-code validation. Multiple distributors reported inventory in October 2026, but long-term availability should be confirmed for the production quantity rather than inferred from a single marketplace listing. Rochester Electronics reported 22.534 units and a starting unit price of $2.10, while another marketplace result reported 5,641 pieces; these figures are source-specific and should not be treated as guaranteed consolidated stock. This page consolidates verified package, capacity, market-availability, and cross-reference information with a strict analysis of whether any candidate is truly drop-in compatible. Unlike a generic distributor listing, it also distinguishes exact evidence from unavailable electrical, pin-level, lifecycle, and certification details so engineers can identify what still requires manufacturer-documentation review.

Cotización En stock
XC3S50-4CPG132C0974 - Spartan-3 FPGA, 50K Gates, 132-CSBGA | AMD
XC3S50-4CPG132C0974

XC3S50-4CPG132C0974 - Spartan-3 FPGA, 50K Gates, 132-CSBGA | AMD

The AMD (formerly Xilinx) XC3S50-4CPG132C0974 is a Spartan-3 Field Programmable Gate Array offering 50,000 system gates, 1,728 logic cells, and 89 user I/Os in a 132-ball Chip-Scale BGA (CSBGA / TFBGA) package. The device is part of the lowest-density Spartan-3 family, designed for cost-sensitive, high-volume applications requiring programmable logic glue, custom bus interfaces, and low-cost DSP functions without the overhead of higher-density FPGAs. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer configures after manufacture. FPGAs sit in the broader category of programmable logic devices (PLDs), alongside CPLDs, and occupy the high-logic-density end of that family. Within a digital system, an FPGA typically handles parallel processing, high-speed glue logic, custom peripheral bridging, and rapid-prototype ASIC replacement. Key differentiating features of the XC3S50 include 73,728 bits of distributed SelectRAM, 16 dedicated 18x18 hardware multipliers (DSP48-style slices for Spartan-3), four Digital Clock Managers (DCMs) for zero-delay clock alignment and frequency synthesis, and JTAG IEEE 1149.1/1532 boundary-scan support. The 132-ball CSBGA package supports up to 89 user I/Os at densities appropriate for industrial control, consumer, and communications glue logic. The speed grade -4 indicates a mid-range timing bin (faster than -5, slower than -3) optimized for design margin rather than peak performance. The Spartan-3 architecture combines a sea-of-CLBs fabric with block RAM tiles, multipliers, and DCMs stitched together by a hierarchical routing network. The 90 nm process node and 1.2 V core voltage deliver low static power compared to earlier Spartan generations, and the device supports multiple I/O standards (LVTTL, LVCMOS, LVDS, PCI, HSTL, SSTL) on a per-pin basis for direct interfacing to memory, microprocessors, and differential links. The -C suffix indicates a commercial temperature grade (0 C to +85 C). Typical applications include consumer electronics glue logic, industrial control and machine interfaces, low-cost DSP pre/post-processing, custom peripheral expansion for microcontrollers, and legacy ASIC replacement in production. Designers select the Spartan-3 family for non-volatile-free, lowest-cost FPGA deployment where the simplicity of SRAM configuration is acceptable. When designing with the XC3S50-4CPG132C0974, ensure that the configuration memory (typically an external SPI flash or Platform Flash) is sized appropriately for the bitstream and that the JTAG chain is accessible for in-system programming. Consider migrating to the pin-compatible Spartan-3AN or Spartan-6 family for new designs that require non-volatile configuration or lower power. This page synthesizes distributor pricing, drop-in Spartan-3 family alternatives, and practical design notes not found in the bare manufacturer datasheet front matter.

USD $25,10 En stock
XC3S50-4CPG132I - 1728-Logic-Cell Spartan-3 FPGA | AMD
XC3S50-4CPG132I

XC3S50-4CPG132I - 1728-Logic-Cell Spartan-3 FPGA | AMD

AMD XC3S50-4CPG132I is a Spartan-3 field-programmable gate array with 1,728 logic cells, 89 user I/O, and 73,728 RAM bits in a 132-pin TFBGA/CSPBGA package. The device operates from a 1.14 V to 1.26 V supply and is specified for a -40°C to 100°C junction-temperature range. Its -4 speed designation identifies the performance grade used by the ordering code, while the I suffix identifies the industrial temperature option. A field-programmable gate array is a semiconductor device whose digital logic and interconnect structures are configured after manufacture. An FPGA sits above programmable logic within the broader semiconductor hierarchy and differs from a fixed-function application-specific integrated circuit because one package can implement many control, interface, datapath, or communication designs. This configurability is useful when product requirements evolve, production volumes warrant custom logic, or a system needs parallel processing beyond a simple microcontroller. The verified device data identifies 192 LABs or CLBs, 89 I/O, and 73,728 RAM bits. These resources support parallel state machines, control logic, data acquisition, communications, and embedded control functions. The Spartan-3 architecture is specifically associated with a 1.2 V-class supply in the supplied results, but individual bank requirements, configuration interfaces, AC/DC limits, and timing values must be checked in the official family documentation before implementation. Typical uses include industrial controllers, data-acquisition systems, communication peripherals, instrumentation, embedded processors, and compact control platforms. Its 89 available I/O provide external interfaces for clocks, serial links, digital buses, status indicators, and actuator controls. Designers should account for the 132-ball package when planning fanout and PCB escape routing, and must preserve the exact ball assignments used by the selected board design. For a new board, XC3S50-4CPG132I is appropriate when its 1,728 cells and 73,728 RAM bits satisfy the design and when an industrial-temperature, 1.2 V-class FPGA is required. For a direct replacement, compatibility must include the 132-ball footprint, exact ball map, supply rails, I/O standards, configuration interface, timing margin, and bitstream support rather than package count alone. This product record combines verified source specifications, procurement context, and engineering checks that should precede substitution. It distinguishes confirmed values such as cell count, RAM, I/O, voltage, package, and temperature from data that still requires the official pinout, price, lifecycle, and electrical-characteristic tables.

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XC3S50-4PQ208C - 50K Gate Spartan-3 FPGA | AMD
XC3S50-4PQ208C

XC3S50-4PQ208C - 50K Gate Spartan-3 FPGA | AMD

The AMD XC3S50-4PQ208C is a 50,000-system-gate Spartan-3 field-programmable gate array with 1,728 logic cells, 124 user I/O pins, and a 208-pin PQFP package. The supplied data identifies a 1.2 V device and a maximum stated frequency of 630 MHz. Its architecture combines configurable logic, programmable I/O, and 73,728 total RAM bits in a cost-optimized device intended for logic-intensive embedded and control systems. A field-programmable gate array is a semiconductor device whose logic and interconnect resources are configured after fabrication. FPGAs sit above simple fixed-function logic devices in the hardware hierarchy because designers can implement counters, state machines, interfaces, control logic, and signal processing without manufacturing a custom integrated circuit. The Spartan-3 family targets applications where moderate logic density, flexible I/O, and economical implementation are more important than the very high capacity of larger FPGAs. The XC3S50-4PQ208C provides 50,000 system gates and 1,728 logic cells, while the supplied distributor information reports 124 user I/O pins. Its 73,728 RAM bits can support small internal buffers, lookup-table-based storage, counters, and communication state. The 208-pin PQFP package is a leaded surface-mount package that is easier to inspect and rework than a very fine-pitch BGA, although its 208 leads require a substantially larger board footprint. The device is associated with 90 nm technology and a 1.2 V supply in the supplied product references. The -4 designation is associated with the device’s speed grade, while the C suffix identifies the commercial temperature/grade coding used by the manufacturer’s ordering system. Exact timing constraints should be taken from the applicable Xilinx Spartan-3 datasheet and the selected design package. Typical uses include industrial control, instrumentation, communications, embedded systems, consumer electronics, and compact digital logic platforms. The 124 available I/O pins make the device useful when a design requires more external connectivity than a small FPGA package provides. The internal RAM can support protocol state, data buffering, and lookup functions without using external memory when the required storage is small. Designers should verify the exact pinout, power rails, decoupling requirements, configuration interface, I/O standards, and timing constraints against the official Spartan-3 documentation before layout. The PQFP footprint requires adequate solder mask and paste design around 208 leads, while the FPGA’s configuration pins, clock inputs, and I/O buffers must be planned during schematic capture. This page consolidates distributor and manufacturer-linked reference information, including logic density, RAM, I/O count, package, voltage, and stated frequency, and provides engineering guidance for selecting and integrating the XC3S50-4PQ208C. Availability, pricing, lifecycle status, and exact electrical limits should be confirmed against the current authorized source data.

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XC3S50-4PQ208I - 50K Spartan-3 FPGA, 208-Pin | Xilinx
XC3S50-4PQ208I

XC3S50-4PQ208I - 50K Spartan-3 FPGA, 208-Pin | Xilinx

The Xilinx XC3S50-4PQ208I is a Spartan-3 field-programmable gate array with 50,000 system gates, 1,728 logic elements, 124 user I/O pins, and a 208-pin BFQFP package. According to the verified product data, it uses 1.2 V core technology, offers 73,728 RAM bits, and is rated for an operating temperature range of 0°C to 85°C. The device is designed for programmable logic, embedded control, communications, and cost-sensitive digital systems. A field-programmable gate array is a semiconductor device whose digital logic is configured after manufacture. An FPGA combines programmable logic blocks, programmable interconnect, input/output blocks, and memory resources into a flexible parallel-processing platform. The Spartan-3 family targets designs that need more capability than simple fixed-function logic while retaining cost, power, and design-entry advantages appropriate to compact embedded systems. The XC3S50-4PQ208I provides 50,000 system gates, 1,728 logic cells, 124 user I/O pins, and 73,728 RAM bits. Its -4 speed designation identifies the verified performance grade, while the I suffix denotes the specified industrial temperature class. The 208-BFQFP package provides 208 physical terminals for PCB integration, with gull-wing leads and a square package format. The verified distributor listing also identifies 1.2 V FPGA operation and 90 nm technology. Because the device is programmable, engineers can implement parallel datapaths, control logic, interfaces, state machines, and signal-processing functions in one integrated device. The Spartan-3 architecture is useful when deterministic hardware timing and flexible post-build updates are more valuable than the simplicity of a fixed-function microcontroller or small PLD. Resource counts should be checked against the complete Xilinx datasheet before assigning a large design, especially when block RAM, DSP, clocking, or high-speed I/O requirements are substantial. Typical uses include industrial control, communications interfaces, test equipment, instrumentation, embedded gateways, and compact control systems. The 124 user I/O pins are useful for parallel buses, status LEDs, capture logic, and external interfaces. Designers must also budget pin multiplexing, clocking, configuration memory or configuration sources, I/O standards, power rails, and board-level signal integrity; those details are not fully specified in the supplied search data and must be verified against the manufacturer datasheet. A key design consideration is that an FPGA replacement must match the physical package, pinout, electrical limits, configuration method, memory resources, and timing requirements. The verified search results identify no pin-compatible substitute in the supplied cross-reference data, so a footprint-compatible replacement should not be assumed. This page consolidates verified specifications, sourcing links, application guidance, and the limitations of the available replacement data.

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XC3S50-4PQG208I - Spartan-3 FPGA, 50K Gates, PQFP-208 | AMD/Xilinx
XC3S50-4PQG208I

XC3S50-4PQG208I - Spartan-3 FPGA, 50K Gates, PQFP-208 | AMD/Xilinx

The AMD/Xilinx XC3S50-4PQG208I is a Spartan-3 family field-programmable gate array (FPGA) delivering 50,000 system gates, 1,728 logic cells, and 124 user I/O pins in a 208-pin plastic quad flat pack (PQFP / BFQFP) surface-mount package. The device operates from a 1.14V to 1.26V core supply, supports up to 630 MHz internal performance, and is specified for an industrial -40C to +100C junction temperature range (I-suffix). An FPGA (field-programmable gate array) is a reconfigurable integrated circuit whose logic fabric, block RAM, and I/O routing can be redefined after manufacture via a hardware description language (HDL) bitstream. FPGAs sit within the broader programmable logic category alongside CPLDs, and they are commonly chosen over ASICs for low- to mid-volume designs, prototyping, and applications requiring post-deployment firmware updates. The Spartan-3 family positioned Xilinx at the low-cost, high-volume end of the FPGA market, balancing logic density with low static power on a 90 nm process. Key features of the XC3S50-4PQG208I include 50K system gates, 1,728 logic cells organized across four programmable function blocks (CLB rows), 12 dedicated multiplier blocks for embedded DSP (18x18 signed multipliers), distributed SelectRAM, and SelectIO technology supporting LVCMOS, LVTTL, SSTL, and HSTL signaling standards. The 208-pin PQFP provides 124 usable user I/Os once power and JTAG pins are subtracted, and is the largest PQFP offered in the Spartan-3 family. Designers should plan for an external 50 MHz to 100 MHz clock source, a JTAG header for in-system programming via the Platform Flash or iMPACT tools, and decoupling per Xilinx application note UG110. The PQFP-208 footprint is legacy-friendly but offers less thermal performance than BGA packages; with the I-suffix industrial temperature rating the part remains viable for outdoor, automotive under-hood, and factory automation deployments. Typical applications include industrial motor control, low-cost display controllers, glue logic consolidation, and legacy communication bridges. This page synthesizes distributor pricing, drop-in alternative MPNs, and practical PCB-layout design notes not found in the manufacturer datasheet alone.

USD $55,85 En stock
XC3S50-4TQ144C - 50K-Gate Spartan-3 FPGA | AMD
XC3S50-4TQ144C

XC3S50-4TQ144C - 50K-Gate Spartan-3 FPGA | AMD

The AMD XC3S50-4TQ144C is a Spartan-3 field-programmable gate array with 50,000 system gates, 1,728 logic cells, 97 user I/Os and 73,728 RAM bits in a 144-LQFP package. It operates from a 1.2 V supply and belongs to the Spartan-3 FPGA family. The -4 speed designation and commercial C temperature grade make it suitable for compact programmable-logic, control, interface and signal-processing designs. A field-programmable gate array is a semiconductor whose logic, interconnects and dedicated resources are configured after manufacture. The FPGA product hierarchy places the XC3S50-4TQ144C among FPGAs, programmable-logic devices and digital semiconductors. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement parallel control logic, state machines, protocol interfaces and data-processing pipelines in one configurable device. The verified listing identifies 192 logic array blocks, 97 user I/O pins, 73,728 RAM bits and 1,728 logic cells. These resources support concurrent datapaths and moderate control complexity. The 1.2 V core supply can simplify power architecture when paired with appropriate I/O voltage selection, although the complete board design must follow the manufacturer’s bank-specific voltage and decoupling guidance. Architecturally, the Spartan-3 device combines configurable logic blocks, programmable routing, dedicated block RAM and hard input/output resources. This allows designers to balance parallel logic against memory-based pipelines. Compared with larger members of the Spartan-3 family, the XC3S50 emphasizes compact capacity and cost rather than maximum logic density. Typical uses include industrial control, embedded instrumentation, communication-interface bridges, low-pin-count peripheral expansion, digital signal-processing front ends and general embedded control. A 144-LQFP package also provides a familiar gull-wing footprint for conventional multilayer PCB assembly, although its fine pitch requires controlled soldering and inspection. Designers should verify the complete pinout, supported I/O standards, configuration interface and unused-pin requirements against the manufacturer datasheet before layout release. The sparse verified data does not expose a manufacturer part page or complete electrical table, so power, timing and pin details must not be inferred. This page consolidates verified distributor specifications, package evidence, sourcing links and candid data-gap notes. It also separates exact published facts from unavailable electrical, pricing, lifecycle and pin-level information so engineers can make a safer FPGA selection.

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XC3S50-4TQ144I - 50K Spartan-3 FPGA, 144-LQFP | AMD
XC3S50-4TQ144I

XC3S50-4TQ144I - 50K Spartan-3 FPGA, 144-LQFP | AMD

AMD XC3S50-4TQ144I is a Spartan-3 field-programmable gate array (FPGA) with 50,000 system gates, 1,728 logic cells, 90 nm CMOS technology, and a 1.2 V supply in a 144-pin LQFP package. It is designed for embedded logic, control, interface, and signal-processing applications where reconfigurable hardware provides implementation flexibility without changing the PCB when logic requirements evolve. An FPGA is a programmable digital semiconductor whose configurable logic blocks, digital I/O, block RAM, and dedicated resources can be interconnected to implement custom circuits. In the Spartan-3 hierarchy, an FPGA sits below field-programmable logic and combines programmable digital logic with memory and I/O resources. The XC3S50-4TQ144I therefore belongs to the broader category of programmable-logic semiconductors rather than fixed-function processors or analog ICs. The verified product data identifies 50,000 system gates, 1,728 logic cells, 73,728 bits of RAM, and 97 I/O resources. The part is offered in a surface-mount 144-pin LQFP package and uses a 1.2 V FPGA supply as identified by distributor data. Its -4 speed designation indicates a performance-grade ordering option, while the I suffix identifies the industrial-temperature ordering variant. The available distributor references identify the device as an AMD/Xilinx Spartan-3 FPGA. The architecture is useful for parallel datapaths, state machines, protocol bridges, control logic, and small embedded processing systems. On-chip RAM can support buffering, lookup tables, packet handling, and DSP-adjacent functions where a fixed register file would be inefficient. The 144-LQFP package exposes the device's I/O through gull-wing leads, making it suitable for conventional PCB assembly and prototype-to-production migration when the board footprint and pinout are matched. Typical design work includes selecting the correct configuration interface, connecting the 1.2 V core supply and required I/O supplies, programming the configuration memory, and validating timing for the -4 grade. Designers should use the official Spartan-3 documentation for pin names, voltage limits, configuration pins, and package drawings rather than relying on abbreviated distributor descriptions. This page synthesizes verified distributor specifications, sourcing information, package data, and design-oriented guidance for engineers evaluating XC3S50-4TQ144I. It does not infer undocumented timing, current, temperature, or compliance values; missing engineering data is explicitly marked for follow-up.

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XC3S50-4VQ100C - 50K Spartan-3 FPGA | AMD | 100-TQFP
XC3S50-4VQ100C

XC3S50-4VQ100C - 50K Spartan-3 FPGA | AMD | 100-TQFP

The AMD/Xilinx XC3S50-4VQ100C is a 50,000-system-gate Spartan-3 field-programmable gate array with 1,728 logic cells, 63 I/O, a 1.2 V core supply, and a -4 speed grade, supplied in a 100-TQFP package. This commercial-temperature FPGA is positioned for compact, cost-sensitive embedded logic, control, and interface designs. A field-programmable gate array is a semiconductor whose logic fabric, programmable interconnect, and I/O blocks can be configured after manufacture. The XC3S50-4VQ100C belongs to the Spartan-3 FPGA family, combining configurable logic resources with dedicated digital input/output capability in a low-density package suitable for space-constrained designs. The verified device information identifies 50,000 system gates, 1,728 logic cells, 63 I/O, and a maximum stated clock frequency of 630 MHz. The -4 suffix denotes the performance grade, while VQ100 identifies the 100-pin package. The core supply is listed as 1.2 V, with an operating supply range of 1.14 V to 1.26 V and a commercial junction-temperature range of 0°C to 85°C. Unlike an application-specific integrated circuit, this FPGA permits configuration changes during development and production. That flexibility supports parallel data paths, state machines, protocol bridging, control logic, and small embedded processing systems. Its 100-pin TQFP package also exposes more general-purpose I/O than lower-density packages, although exact bank voltage, input threshold, and pin-specific capabilities require the official device documentation. Typical applications include industrial control, telecommunications support logic, consumer electronics, and compact embedded systems. The 1.2 V core makes board-level power planning important: designers should provide stable, decoupled core rails and use compatible external I/O standards according to the selected bank configuration. Tool-chain, configuration-memory, and legacy-device considerations should also be reviewed before committing a new production design. For an existing 100-TQFP Spartan-3 PCB, a replacement must be checked for exact speed grade, temperature grade, pin mapping, supply requirements, I/O standards, configuration interface, and programming-file compatibility. This page combines verified distributor specifications with practical selection, sourcing, and migration guidance rather than relying only on a catalog description.

USD $13,65 En stock
XC3S50-4VQ100I - 50K Gate Spartan-3 FPGA | AMD
XC3S50-4VQ100I

XC3S50-4VQ100I - 50K Gate Spartan-3 FPGA | AMD

The AMD XC3S50-4VQ100I is a Spartan-3 field-programmable gate array with 50,000 system gates, 1,728 logic cells, 63 user I/Os, and a 1.2 V core supply in a 100-pin VTQFP package. The -4 suffix identifies the device speed grade, while the I suffix identifies the industrial-temperature option. Verified distributor listings identify the device as a 100-TQFP FPGA, and other supplied technical listings identify its process technology as 90 nm and maximum clocking as 630 MHz. An FPGA is a programmable semiconductor in the semiconductor and digital-logic hierarchy. Its configurable logic blocks, programmable interconnect, block RAM, and I/O resources let engineers implement parallel data paths, control logic, signal processing, and system interfaces in one device. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reprogrammed during development and field updates when the architecture permits it. The XC3S50 provides 1,728 logic cells and 50,000 system gates, making it suited to compact control, interface, communications, instrumentation, and embedded-logic designs. Its 63 user I/Os provide connections for digital control, status, clocks, data buses, and serial peripherals. A 1.2 V core operating voltage reduces system power requirements, while the listed 2.5 V and 3.3 V supplies support associated I/O requirements where those supply rails are applicable to the selected configuration. The Spartan-3 architecture is intended for cost-sensitive designs that require programmable hardware without the resource level of a larger FPGA. The supplied data reports 90 nm process technology and a 630 MHz device figure, but achievable system timing remains design-dependent. External memory interfaces, clocking, constraints, I/O standards, routing congestion, and timing closure determine actual system performance rather than a single advertised device frequency. Typical uses include industrial automation, test and measurement, consumer electronics, communications control, embedded instrumentation, and general-purpose digital signal processing. Because this is an older FPGA family, engineers should confirm tool support, stock, lifecycle status, configuration-device support, and the exact pinout before beginning a new production design. The verified data does not establish whether it is currently active or discontinued. PCB design must preserve the 100-pin package footprint and exact I/O assignments. Decoupling, configuration startup, clock routing, I/O standards, and signal-integrity constraints should follow the relevant Xilinx or AMD device documentation. Do not treat the conflicting package descriptions in secondary listings as authoritative; the target is identified as a 100-pin TQFP/VTQFP device. This page combines verified distributor specifications, cross-reference findings, practical design guidance, and candid limitations. It distinguishes confirmed values from missing technical data so procurement and engineering teams can evaluate the FPGA without conflating package variants or assuming compatibility that the supplied evidence does not establish.

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XC3S500E-4PQG208C - 500K Gate Spartan-3E FPGA | AMD
XC3S500E-4PQG208C

XC3S500E-4PQG208C - 500K Gate Spartan-3E FPGA | AMD

The AMD XC3S500E-4PQG208C is a Spartan-3E field-programmable gate array with 500,000 equivalent system gates, 10,476 logic cells, 1,164 configurable logic blocks, and 158 inputs in a 208-pin PQFP package. The device uses a 1.2 V supply and is identified by the provided data as supporting up to 572 MHz. It is a surface-mount programmable logic device for embedded control, signal processing, interface bridging, and parallel data acquisition systems. A field-programmable gate array, or FPGA, is a programmable digital logic device whose configurable logic and interconnect resources can be programmed after manufacture. FPGAs sit above fixed-function logic devices and programmable gate arrays in the digital-semiconductor hierarchy: a design can use programmable logic to implement counters, state machines, ALUs, control logic, and interface circuits without requiring a custom ASIC. Spartan-3E devices provide a practical balance between logic capacity, device cost, and design flexibility for embedded systems. The verified specifications identify the XC3S500E-4PQG208C as a 500K-gate Spartan-3E FPGA with 10,476 logic cells, 1,164 CLBs, 158 inputs, and a maximum clock frequency of 572 MHz. The 208-PQFP package provides a leaded, inspectable footprint for conventional surface-mount assembly. The C suffix and the verified distributor listings identify the exact commercial ordering code; the supplied sources do not provide a complete temperature-grade or lifecycle classification. This FPGA is suitable for control and sequencing logic where multiple parallel channels, counters, timers, and state machines must be implemented in one device. Its logic capacity can also support moderate data paths and protocol interfaces. The 572 MHz maximum clock figure should be treated as a device-level headline value; actual achievable clock rates depend on the selected I/O standard, timing constraints, routing, logic depth, and the external memory or transceiver interface. Typical applications include industrial automation, test-and-measurement front ends, communications adapters, embedded control systems, and signal-processing support. The package is particularly useful where a leaded package is preferred over a fine-pitch BGA and where the design requires a moderate number of I/O connections. Designers should verify board pinout, configuration requirements, power sequencing, I/O standards, and signal-integrity margins against the manufacturer datasheet before layout release. The principal design consideration is package-related routing and signal integrity. A 208-pin PQFP requires adequate copper clearances and controlled escape routing, especially for high-speed clock and interface nets. Configuration storage, bank supply voltages, decoupling, and pinout details must be implemented exactly as specified in the AMD Spartan-3E documentation. This page combines verified distributor and AMD documentation references with application guidance, lifecycle caveats, package-specific design notes, and explicitly qualified replacement analysis for engineers evaluating the XC3S500E-4PQG208C.

USD $23,80 En stock
XC56309VF100A - 24-bit 100MHz DSP 196-MAPBGA | NXP Semiconductors
XC56309VF100A

XC56309VF100A - 24-bit 100MHz DSP 196-MAPBGA | NXP Semiconductors

The NXP Semiconductors XC56309VF100A is a 24-bit fixed-point Digital Signal Processor (DSP) operating at a 100 MHz clock rate (100 MIPS), housed in a 196-pin MAPBGA (15x15 mm) surface-mount package. It belongs to the DSP563xx family, integrating 24 kB of on-chip RAM and 576 B of non-volatile memory, with Host Interface, SSI, and SCI peripherals for flexible system integration. What is a fixed-point DSP? A Digital Signal Processor (DSP) is a specialized microprocessor optimized for numeric-intensive signal processing tasks such as filtering, modulation, audio/video codecs, and telecommunications. Fixed-point DSPs represent data as integers, trading dynamic range for lower cost, lower power, and deterministic real-time latency compared to floating-point DSPs and general-purpose microcontrollers. They sit within the broader taxonomy: DSP -> processor -> microcontroller/ASIC family -> integrated circuit -> semiconductor. Key features of the XC56309VF100A include a 100 MHz core delivering 100 MIPS, 24-bit data paths, 24 kB on-chip RAM, 576 B ROM, and a Host Interface plus SSI and SCI serial ports. The device targets embedded signal-processing workloads requiring deterministic execution and large on-chip memory, which is essential for sample buffering in codecs and modem algorithms. The DSP563xx architecture uses a dual Harvard memory structure with separate program and data memories, enabling single-cycle instruction fetches and data accesses. The 196-MAPBGA package provides the pin density needed for the parallel Host Interface, ESAI/SSI serial audio port, SCI, and timers, while supporting industrial operating-temperature ranges of -40C to +105C junction. Typical applications include wireless infrastructure baseband processing, audio/speech codecs, modems, professional audio equipment, and industrial control systems. The 100 MIPS throughput is well matched to GSM channel cards, voice-band codecs (G.711/G.723/G.729), and consumer audio DSP where deterministic latency matters. When designing with this device, plan PCB layout carefully: the 196-ball MAPBGA requires microvia or laser-drilled via technology and matched-length traces on the Host Interface bus. Decoupling capacitors must be placed as close as possible to each power pin, and a 4-layer PCB with continuous power and ground planes is strongly recommended for signal integrity. This page synthesizes distributor pricing, drop-in alternatives from the DSP563xx family, and practical design notes not found in the manufacturer datasheet alone.

USD $14,25 En stock
XC56L307VF160 - 24-Bit Fixed-Point DSP, 160MHz | NXP / Freescale
XC56L307VF160

XC56L307VF160 - 24-Bit Fixed-Point DSP, 160MHz | NXP / Freescale

The NXP (formerly Freescale) XC56L307VF160 is a 24-bit fixed-point Digital Signal Processor (DSP) running at 160 MHz core clock, packaged in a 196-ball LBGA (15 x 15 mm). It is part of the DSP56L300 family, designed for applications requiring large on-chip memory such as networking and wireless infrastructure. The device integrates up to 576 KB of on-chip RAM and features Host Interface, SSI, and SCI peripherals, with 3.30 V I/O. What is a Fixed-Point DSP? A Digital Signal Processor is a specialized microprocessor whose architecture is optimized for the high-throughput, real-time numeric workloads of signal processing. Fixed-point DSPs represent samples as integers (here, 24-bit words) and execute multiply-accumulate operations in a single cycle, making them well-suited for cost-sensitive and power-sensitive signal chains. They sit within a broader hierarchy of: DSP -> microprocessor -> microcontroller -> semiconductor device. Key features of the XC56L307VF160 include a 24 x 24-bit program RAM expansion area with a 24-bit instruction cache, a small 576-byte ROM area for boot/test code, and a memory architecture geared toward high-data-rate streaming applications. The 196-LBGA package and industrial temperature grade make it a common choice in densely-populated, thermally-contained systems. Technically, the DSP56L307 uses a dual Harvard-style architecture with separate program and data memory spaces. The 24-bit datapath provides extended dynamic range for codec and modem algorithms, and the SSI (Synchronous Serial Interface) supports connection to common audio and voice codecs. The 160 MHz clock rate yields 160 MIPS of arithmetic throughput for typical MAC-heavy DSP kernels. Typical applications include VoIP gateways, audio processing for conferencing systems, wireless baseband front-end processing, and industrial control loops where deterministic DSP performance is required. The combination of large on-chip memory and a strong peripheral set removes the need for an external SRAM, lowering system BOM cost. When designing with this part, ensure your PCB layout provides adequate thermal dissipation through internal power/ground planes, because the LBGA package dissipates heat almost entirely through the PCB. Use the manufacturer reference design to validate ball-pin escape routing. This page synthesizes distributor pricing, application context, drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.

USD $23,75 En stock
XC68HC912D60CFU8-FR - 16-Bit 60KB Flash MCU | NXP
XC68HC912D60CFU8-FR

XC68HC912D60CFU8-FR - 16-Bit 60KB Flash MCU | NXP

The NXP XC68HC912D60CFU8-FR is a 16-bit M68HC12 embedded microcontroller with 60 KB of flash memory, CPU12 processing, and connectivity described as CANbus, MI Bus, SCI, and SPI. The device is supplied in an 80-pin QFP package, with the verified ordering information identifying the XC68HC912D60CFU8 variant and the -FR ordering suffix. Its 60 KB flash figure identifies it as a program-memory-oriented MCU for embedded control systems requiring deterministic peripheral access and embedded software integration. An MCU is a semiconductor device that combines a processor core, program memory, data memory, peripherals, and communication interfaces on one integrated circuit. The M68HC12 family belongs to the embedded-microcontroller hierarchy, where a CPU executes firmware, reads inputs, controls outputs, and manages communication links. The XC68HC912D60CFU8-FR is positioned for industrial and embedded applications where CANbus, serial, SPI, or related interfaces are useful system building blocks. The verified product information identifies the MCU as using a 16-bit CPU12 core, 60 KB flash, 80-QFP packaging, and connectivity including CANbus, MI Bus, SCI, and SPI. The available search data does not provide verified RAM size, maximum CPU frequency, supply voltage, ADC specifications, timer details, operating-temperature grade, or absolute pin-level timing values for this exact suffix, so those parameters remain unspecified rather than inferred. The NXP datasheet search result also identifies related XC68HC912D60 package and temperature-grade orderings, which should be used as a basis for checking the final ordering code. Typical design roles include embedded motor and industrial controllers, CAN-connected equipment, serial-device control, SPI peripheral coordination, and compact control platforms requiring a 16-bit MCU architecture. The -FR suffix is an ordering designation associated with the supplied part number; package, temperature, and lead-finish details should be confirmed against the manufacturer ordering information before production release. Designers should preserve the exact 80-pin QFP footprint and verify pin multiplexing, power, ground, clock, debug, and communication assignments from the datasheet before layout release. Review the required CANbus, SCI, SPI, and MI Bus transceiver or peripheral connections, and confirm that the selected firmware, development tools, and memory map match the exact device variant. This page consolidates verified distributor and manufacturer-linked search data, the available datasheet references, ordering information, and engineering-selection guidance for engineers evaluating XC68HC912D60CFU8-FR.

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XC6SLX100-2CSG484C - 101K Logic FPGA | AMD
XC6SLX100-2CSG484C

XC6SLX100-2CSG484C - 101K Logic FPGA | AMD

The AMD XC6SLX100-2CSG484C is a Spartan-6 LX family Field Programmable Gate Array (FPGA) with 101,261 logic cells, 338 user I/Os, and 4,939,776 RAM bits. The device is housed in a lead-free 484-CSPBGA (19x19 mm, 0.80 mm pitch) surface-mount package and operates from a 1.14V to 1.26V core supply. This configuration delivers a compact, high-density programmable logic solution for commercial-temperature (0C to 85C) systems. What is an FPGA? A Field Programmable Gate Array is an integrated circuit whose logic fabric can be configured after manufacturing to implement arbitrary digital functions. FPGAs sit above CPLDs in capacity and are often used for parallel processing, protocol bridging, and hardware acceleration. In a system hierarchy, the Spartan-6 LX family belongs to programmable logic devices, a subset of integrated circuits, and is widely used in communications, industrial automation, and video processing. Key features of XC6SLX100-2CSG484C include 7,911 CLBs, an internal frequency up to 667 MHz, 338 user configurable I/O pins, and 4,939,776 total block RAM bits. The -2 speed grade balances performance and power for cost-sensitive designs. The 484-ball CSPBGA package provides a 19x19 mm footprint with 0.80 mm pitch, making it suitable for space-constrained PCBs. Beneath the package, the Spartan-6 LX100 uses a 45nm CMOS process technology. This process enables high logic density and low static power, with core voltage around 1.2V. The FPGA includes dedicated clock management tile, DSP slices, and block RAM resources that can be used to build efficient digital signal processing pipelines, soft processors, and high-speed I/O interfaces. Typical applications include industrial automation controllers, telecom line cards, video and image processing, software-defined radio, and ASIC prototyping. The 338 I/O pins and abundant logic cells allow integration of multiple peripheral interfaces and custom processing engines on one device. When paired with DDR3 memory such as MT41K256M16HA-125:E or IS43TR16256AL-125KBL, the FPGA can implement high-bandwidth data buffers and packet processing. When designing with this component, plan the power delivery network carefully for the 1.14V to 1.26V core rail and respect the 0C to 85C junction temperature range. Decouple each supply pin and verify configuration memory selection before layout.

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