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XC6SLX75T-2FG484I - 74K Spartan-6 LXT FPGA | AMD
XC6SLX75T-2FG484I

XC6SLX75T-2FG484I - 74K Spartan-6 LXT FPGA | AMD

The AMD XC6SLX75T-2FG484I is a Spartan-6 LXT field-programmable gate array containing 74,637 configurable logic elements organized into 5,831 configurable logic blocks, with a stated operating speed of 667 MHz and 268 I/Os in a 484-ball FBGA package measuring 23 x 23 mm with 1 mm ball pitch. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, memory, and I/O behavior are configured after manufacture. An FPGA belongs to the programmable-logic hierarchy and combines parallel programmable logic blocks with configurable input/output resources. This integration allows one physical device to implement control logic, signal processing, interface bridging, and embedded system functions without relying on a large collection of fixed-function logic ICs. The Spartan-6 LX device family combines substantial programmable logic capacity with a high number of user I/Os. In the XC6SLX75T-2FG484I, 268 I/Os support communication with external processors, memory, converters, sensors, and industrial peripherals. The -2 performance grade and 667 MHz stated operating speed place the device in the Spartan-6 LX performance range, while the industrial-temperature suffix supports equipment designed for extended commercial and industrial operating environments. The 484-ball FBGA package uses a 1 mm pitch and provides a compact, high-pin-count surface-mount footprint. Its 23 x 23 mm body makes it appropriate for dense control boards, but the fine ball pitch requires careful PCB layout, manufacturing control, inspection, and connector or test-point planning. The LXT designation also identifies this as a Spartan-6 member intended for designs requiring more logic resources and I/O capacity than smaller LX variants. Typical uses include industrial automation, data acquisition, motion control, communications gateways, embedded instrumentation, and general-purpose digital signal processing. Its combination of 74,637 logic elements, 5,831 configurable logic blocks, and 268 I/Os is particularly useful when several parallel control paths, high-speed interfaces, and protocol conversion functions must share one programmable device. PCB design should follow the AMD Spartan-6 package pinout files for every ball assignment and keep sensitive interfaces away from noisy power and switching paths. Decoupling, clock routing, configuration handling, bank voltage planning, and thermal performance require careful implementation before the FPGA is released for production. This page organizes the principal device characteristics, practical application guidance, verified package details, and compatible Spartan-6 orderable variants into a focused engineering reference for design evaluation and component sourcing.

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XC6SLX75T-2FG676I - Spartan-6 LXT 74,637-Cell FPGA | AMD
XC6SLX75T-2FG676I

XC6SLX75T-2FG676I - Spartan-6 LXT 74,637-Cell FPGA | AMD

AMD XC6SLX75T-2FG676I is a Spartan-6 LXT field-programmable gate array with 74,637 logic cells, 5,831 configurable logic blocks, 348 user I/O, and a maximum stated clock frequency of 667 MHz. It is manufactured on 45 nm CMOS technology, operates from a 1.2 V core supply, and is packaged in a 676-ball FBGA measuring 27 x 27 mm with 1 mm ball pitch. The -2 suffix identifies the speed grade, FG676 identifies the package configuration, and the final I designates the industrial temperature grade. A field-programmable gate array is a programmable digital semiconductor within the broader FPGA and semiconductor hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA combines configurable logic blocks, programmable interconnect, block RAM, digital signal processing resources, and programmable input/output resources on one device. This allows parallel digital architectures to be implemented in hardware and updated through a configuration bitstream without changing the printed circuit board. The XC6SLX75T-2FG676I provides 74,637 logic cells for medium-density systems requiring substantially more parallel processing capacity than small programmable logic devices. Its 5,831 configurable logic blocks and 348 user I/O support interfaces for control logic, data acquisition, industrial automation, communications, embedded vision, and test equipment. A 667 MHz stated clock frequency establishes the device family’s speed context, while designers must still apply the appropriate timing constraints for each implemented path. Technically, the device belongs to the Spartan-6 LXT family and uses 45 nm CMOS fabrication with a 1.2 V core supply. Its large 676-ball FBGA exposes a substantial bank of user I/O and dedicated configuration, power, clock, and ground resources. The 27 x 27 mm body and 1 mm pitch require a dense PCB escape-routing strategy, careful power-plane planning, and assembly-process control. Configuration storage and serial or parallel programming behavior should be designed according to the AMD package pinout files. Typical applications include industrial automation controllers, embedded video processing, communications infrastructure, instrumentation, aerospace and defense equipment, and high-speed bridging designs. Its combination of programmable logic, DSP capability, block RAM, and a large I/O count makes it suitable for systems that must consolidate parallel control, data acquisition, and protocol conversion functions into a single FPGA. The primary design trade-off is package density rather than electrical function. A 676-ball FBGA supports many connections but demands fine-pitch PCB layout, adequate layer count, controlled impedance, and assembly capability. Engineers should preserve the AMD package pinout and Spartan-6 package files when assigning pins and planning the board stack-up. This page combines package identification, application guidance, design considerations, and structured comparisons that help engineers evaluate the XC6SLX75T-2FG676I for new FPGA designs, industrial control platforms, and legacy Spartan-6 LXT board upgrades.

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XC6SLX75T-3FG484I - 74,637-Cell Spartan-6 FPGA | AMD
XC6SLX75T-3FG484I

XC6SLX75T-3FG484I - 74,637-Cell Spartan-6 FPGA | AMD

The AMD XC6SLX75T-3FG484I is a Spartan-6 LXT field-programmable gate array with 74,637 logic cells, 268 I/O, a -3 speed grade, and a 484-pin FBGA package. The device is manufactured on 45 nm CMOS technology, operates from a 1.2 V core supply, and is listed with an internal frequency of 667 MHz. Its 23 mm by 23 mm package uses a 1 mm ball pitch. A field-programmable gate array, or FPGA, is a programmable digital semiconductor within the broader logic IC and semiconductor hierarchy. Its configurable logic blocks, programmable interconnect, and I/O resources implement digital control, signal processing, interface, and embedded systems without requiring a custom mask-programmed ASIC. Spartan-6 devices combine configurable fabric with hard DSP and memory resources for cost-sensitive embedded and high-volume logic designs. The XC6SLX75T-3FG484I provides 74,637 logic cells and 268 user I/O in the LXT Spartan-6 family. Its 45 nm CMOS construction supports integration of programmable logic with dedicated DSP resources, while the -3 designation identifies the device's performance grade. The 484-ball FBGA package provides a high-pin-count connection option for designs requiring substantial external interface resources. The LXT family supports communications-oriented designs that combine programmable logic with dedicated hardware suitable for DSP, interface, and embedded processing workloads. A maximum internal frequency of 667 MHz is listed for this device, although achievable system performance depends on the selected clocking architecture, routing, I/O standards, memory interface configuration, and timing constraints implemented in the FPGA design. Typical uses include industrial control, communications infrastructure, consumer-oriented signal processing, embedded systems, video and image processing, and test equipment. The XC6SLX75T-3FG484I is appropriate when a design requires more logic and I/O than a smaller FPGA while retaining the same 484-pin package used by compatible Spartan-6 options. The -3 grade is suited to designs prioritizing higher performance over lower-speed alternatives. Board design must account for the large 484-ball FBGA footprint, multilayer PCB construction, controlled-impedance routing, clean power and ground distribution, and adequate thermal management. Designers should use the AMD Spartan-6 package pinout files and device-specific pin constraints when assigning package balls. Configuration storage, clocking, decoupling, and bank-specific voltage requirements also require careful implementation before schematic and PCB signoff. This product page combines package, density, speed-grade, temperature, and sourcing information with application guidance, engineering design notes, and same-package replacement analysis. It is intended to help engineers assess Spartan-6 LXT design fit, identify pin-compatible options, and prepare a robust 484-FBGA implementation.

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XC6SLX75T-3FG676I - Spartan-6 LXT FPGA | Xilinx
XC6SLX75T-3FG676I

XC6SLX75T-3FG676I - Spartan-6 LXT FPGA | Xilinx

The Xilinx XC6SLX75T-3FG676I is a Spartan-6 LXT field-programmable gate array built on 45 nm CMOS technology, with 74,637 logic cells, 5,831 configurable logic blocks, and a 667 MHz internal frequency. The device provides 348 I/Os in a 676-pin FCBGA package measuring 27 x 27 mm with a 1 mm pitch, and it is intended for industrial-temperature operation from 0°C to 85°C. An FPGA is a semiconductor whose digital logic, I/O paths, memory blocks, and embedded processing elements are configured after manufacture. The Spartan-6 LXT family combines programmable logic with dedicated DSP blocks, block RAM, clock management, and high-speed serial transceivers. This hierarchy places the XC6SLX75T within FPGA and CPLD devices, programmable-logic semiconductors, and the broader embedded-computing market. The -3 speed grade provides the highest performance among the Spartan-6 LXT speed grades identified for this family. Its 74,637 logic cells and 348 I/Os make it suitable for interfaces, control logic, image processing, industrial automation, communications bridging, and embedded signal-processing systems. The 5,831 CLBs provide substantial parallel-processing capacity, while the 667 MHz internal frequency supports demanding synchronous designs and clocked interfaces. The 676-pin FCBGA construction provides a high pin count for external memory, parallel buses, high-speed I/O, and dedicated transceiver connections. The 45 nm CMOS process combines relatively high programmable-logic density with low-cost implementation. Spartan-6 devices are also recognized for integrated system connectivity, including high-speed serial transceivers, memory controllers, DSP processing, and Ethernet-related interface capabilities. Typical applications include industrial control systems, automotive infotainment interfaces, network-bridge designs, video-processing pipelines, test equipment, and embedded communications equipment. The 348 I/Os are especially useful when a design needs multiple parallel buses, control signals, external memory interfaces, or several differential links in one device. Design work should begin with the 676-ball package pinout, power rails, decoupling requirements, configuration interface, clocking plan, and pin-speed constraints. Signal-integrity checks are particularly important for high-speed transceiver links, while power sequencing and thermal analysis should be completed before layout release. Validate the selected bitstream, I/O standards, and timing constraints on hardware representative of the production design. This product page combines package, logic-density, speed-grade, and I/O information with practical configuration guidance and drop-in comparison options. It is intended to help engineers shorten device selection, footprint review, migration, and design-planning time before consulting the complete AMD/Xilinx Spartan-6 device documentation.

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XC6SLX9-2CPG196I - Spartan-6 LX FPGA, 9152 Cells, 196-CSBGA | AMD
XC6SLX9-2CPG196I

XC6SLX9-2CPG196I - Spartan-6 LX FPGA, 9152 Cells, 196-CSBGA | AMD

The AMD (Xilinx) XC6SLX9-2CPG196I is a Spartan-6 LX family Field Programmable Gate Array (FPGA) built on a 45 nm CMOS process, integrating 9,152 logic cells across 715 configurable logic blocks (CLBs) in a 196-ball Chip-Scale BGA (CSBGA) package. The device provides up to 106 user I/O pins, 576 Kbit embedded block RAM, dedicated DSP48A1 slices, and operates across the industrial -40C to +100C temperature range with a -2 speed grade offering up to 667 MHz internal clock performance. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic function is defined after manufacturing by configuration bitstream loading, belonging to the programmable logic device family within the broader digital semiconductor taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit). Unlike fixed-function ASICs, FPGAs use an array of configurable logic blocks (CLBs), programmable routing, and dedicated hard IP blocks (Block RAM, DSP slices, transceivers, clock management tiles) to implement arbitrary digital logic. The Spartan-6 LX family targets cost-sensitive, high-volume applications requiring low static and dynamic power without sacrificing performance. Key features of the XC6SLX9-2CPG196I include 576 Kbits of block RAM, 16 DSP48A1 slices at 18x18 multiplication, an integrated hard IP for PCI Express endpoint (Gen1), dedicated Memory Controller block supporting DDR, DDR2, DDR3, and QDR II+ interfaces, plus the security-enhanced SelectIO technology. The 196-ball CSBGA package supports up to 106 user I/Os with 1.2V core operation and 2.5V/3.3V tolerant SelectIO interfaces, simplifying multi-voltage system integration. Architecturally, the Spartan-6 LX FPGA uses a 6-input LUT-based logic fabric with dedicated carry chains for arithmetic, dual-port Block RAM columns distributed throughout the fabric, and DSP48A1 slices combining an 18x18 multiplier with a 48-bit accumulator. On-chip clock management tiles (CMTs) integrate PLLs and DLLs for flexible clock synthesis. The -2 speed grade balances die cost against timing closure in mainstream applications. Typical applications include industrial motor control, video processing front-ends, low-cost consumer electronics with custom logic, legacy industrial protocol bridging, and PCIe endpoint cards. The wide operating temperature and DSP slices make it suitable for portable test instruments and embedded vision pre-processing. When designing with this part, verify that the 196-ball CSBGA footprint is within PCB layout capability for fine-pitch BGA assembly, and confirm that Vivado (or legacy ISE for older toolchain compatibility) supports the Spartan-6 family design flow, since newer Vivado versions may require legacy installation. This page synthesizes cross-reference equivalents, applied design context, and distributor pricing not found in the standalone AMD datasheet, giving engineers a one-stop selection resource for the XC6SLX9-2CPG196I.

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XC6SLX9-2CSG225C - Spartan-6 LX FPGA, 9152 Cells, 160 I/O | AMD
XC6SLX9-2CSG225C

XC6SLX9-2CSG225C - Spartan-6 LX FPGA, 9152 Cells, 160 I/O | AMD

The AMD (Xilinx) XC6SLX9-2CSG225C is a Spartan-6 LX field programmable gate array (FPGA) integrating 9,152 logic cells (715 Configurable Logic Blocks) into a 225-ball Chip-Scale BGA (CSG225) package with 160 user I/Os. Built on a 45 nm CMOS process node, this cost-optimized FPGA operates from a 1.14 V to 1.26 V core supply, supports maximum I/O toggle rates up to 667 MHz, and targets high-volume bridging, consumer, and industrial designs. An FPGA (Field Programmable Gate Array) is a programmable logic device that lets engineers implement any digital circuit in hardware via LUTs (Look-Up Tables) and programmable interconnects. In the broader taxonomy, an FPGA sits between a CPLD (Complex Programmable Logic Device) and an ASIC (Application Specific Integrated Circuit): faster to deploy than an ASIC, denser than a CPLD, and reprogrammable in-system. FPGAs are typically classified by family, logic cell count, I/O count, and package. Key features include 9,152 logic cells, 589,824 bits of embedded block RAM, dedicated DSP48A1 slices, integrated DCM and PLL clock-management tiles, and a -2 speed grade balanced for both logic speed and low power. Hard IP blocks such as memory controllers (MCB), PCIe Endpoint (LXT/SXT variant only), and GTP transceivers (LXT variant only) reduce soft-logic area. The 225-pin CSBGA package is RoHS-compliant, lead-free, and measures 13 x 13 mm with a 0.8 mm ball pitch. Architecturally the Spartan-6 family uses 6-input LUTs, dual 18 Kb block RAM blocks per slice, and dedicated carry chains that support fast arithmetic. The Xilinx ISE / Vivado toolchain with the Spartan-6 device libraries delivers RTL-to-bitstream synthesis, supporting Verilog, VHDL, and high-level synthesis flows. Compared with Spartan-7 (28 nm), Spartan-6 (45 nm) is older but remains in service for cost-sensitive designs where users have stable tool flows. Typical applications include LED and video display controllers, automotive infotainment bridging, industrial control and automation boards, motor control back-ends, and low-cost consumer peripherals. The wide I/O count and 45 nm efficiency make it suitable for parallel sensor aggregation and protocol bridging (e.g. UART/SPI/I2C to high-speed LVDS). Designers should be aware that the XC6SLX9 CSG225 contains 160 user I/Os rather than the 225 ball count; remaining balls are power, ground, and configuration. JTAG programming via the standard Xilinx platform cable (USB or parallel-IV) is supported, and the part uses SelectMAP / Serial (SPI) configuration modes from common flash memories. The ISE 14.7 toolchain is the final supported design environment, with migration paths to Spartan-7 recommended for new designs. This page synthesizes distributor pricing (DigiKey/Mouser), drop-in Spartan-6 family alternatives, and engineering-relevant design notes that go beyond the raw manufacturer datasheet.

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XC6SLX9-2CSG225I - 9152-Cell Spartan-6 FPGA | AMD
XC6SLX9-2CSG225I

XC6SLX9-2CSG225I - 9152-Cell Spartan-6 FPGA | AMD

AMD/Xilinx XC6SLX9-2CSG225I is a Spartan-6 LX field-programmable gate array containing 9,152 programmable logic cells, 589,824 RAM bits, 160 user I/O, and 715 configurable logic blocks in a 225-ball CSPBGA package. The supplied data identifies a 1.14 V to 1.26 V operating-supply range, a -2 speed grade, and an industrial temperature designation. An FPGA is a semiconductor whose digital logic, interconnects, memory resources, and I/O behavior are configured after manufacture. The Spartan-6 family belongs to the FPGA and CPLD hierarchy and is commonly used where parallel logic, embedded block RAM, programmable interfaces, and deterministic control must be consolidated into one configurable device. Unlike a fixed-function microcontroller, this device does not execute software as its primary operating model; it implements a hardware circuit defined by a bitstream. Verified listings report 160 I/O, 589,824 total RAM bits, 9,152 logic cells, and 715 CLBs. This resource mix makes the part suitable for control logic, protocol bridging, data acquisition, preprocessing, industrial automation, and embedded signal-processing systems. The -2 suffix denotes the device speed grade, while the I suffix identifies the industrial-grade ordering variant. Its CSPBGA-225 package measures 13 mm by 13 mm according to the supplied comparison data. The XC6SLX9 device combines programmable logic with dedicated block RAM and user I/O in one package. Exact I/O standards, supported interfaces, pin functions, clocking limits, configuration requirements, and AC timing values are not provided in the verified excerpts and must therefore be confirmed against AMD documentation before schematic capture or PCB release. The package is a complex BGA device requiring careful escape routing and controlled assembly. Typical installations include industrial controllers, sensor and measurement interfaces, communications equipment, video or imaging control, and compact embedded systems requiring deterministic parallel behavior. Designers should select I/O standards and voltage domains supported by the selected bank, preserve configuration access, validate pin assignments, and confirm timing against the design’s clock and interface requirements. A critical integration concern is BGA layout quality: layer count, via strategy, solder-mask definition, pad-to-mask ratios, and assembly capability should be reviewed early because the CSPBGA-225 footprint is difficult to inspect visually after assembly. Use AMD’s package and pinout resources rather than inferring ball assignments from the commercial suffix. This page consolidates verified distributor specifications, source availability, cross-reference findings, and engineering-oriented cautions that are not presented as one unified block in the original product snippets. It distinguishes confirmed values from missing technical data rather than estimating pinout, timing, or performance parameters.

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XC6SLX9-2FT256C - 9K-LUT Spartan-6 FPGA | AMD
XC6SLX9-2FT256C

XC6SLX9-2FT256C - 9K-LUT Spartan-6 FPGA | AMD

The AMD/Xilinx XC6SLX9-2FT256C is a Spartan-6 LX field-programmable gate array with 9,152 logic cells, 186 I/O, and a -2 speed grade in a 256-ball FTBGA package. The commercial-temperature device is identified as the FTBGA-256 option and is specified for 0°C to 85°C operation. Its verified internal-frequency listing reaches 667 MHz, although implemented system performance depends on the selected clocking resources, design constraints, I/O standards, and timing closure. This device is a programmable-logic semiconductor: configurable LUTs, registers, block RAM, and dedicated resources implement digital control, datapath, interface, and signal-processing functions. It belongs to the hierarchy FPGA → programmable logic device → digital semiconductor. A Spartan-6 LX FPGA is a reprogrammable integrated circuit used when fixed-function logic is insufficient or when one programmable device can consolidate multiple functions onto a compact board. The XC6SLX9 combines 9,152 logic cells and 186 I/O in the FTBGA-256 package, making it relevant to industrial control, communications, embedded instrumentation, and compact digital subsystems. Designers select pin constraints, I/O standards, clocking, memory interfaces, and timing constraints in the associated FPGA development environment before programming the device. Verified feature data establishes the device type as an FPGA, the logic-cell count as 9,152, the I/O count as 186, and the maximum listed internal frequency as 667 MHz. The -2 suffix denotes the device speed grade, while the trailing C denotes the commercial temperature option. The package is specified as 17 mm × 17 mm, 1 mm pitch, MS-034, FTBGA-256. These facts make exact device identification essential: package outline, speed grade, temperature grade, bitstream, voltage configuration, and pin constraints must all be checked before substitution. The target is suitable for parallel digital logic, embedded control logic, bus bridging, and application-specific signal processing where 9,152 LUT-based logic cells are sufficient. It can consolidate control and datapath logic while reducing discrete-component count, although final utility depends on memory, clock, and I/O requirements. The supplied sources do not verify RAM capacity, block-RAM count, DSP resources, supported I/O standards, power rails, or complete electrical timing tables; those specifications must be obtained from the manufacturer documentation before schematic or timing sign-off. A critical procurement consideration is traceability. Distributor and aggregation listings identify the XC6SLX9-2FT256C, while LCSC reports an in-stock listing and a starting price of $9.5017. The Mouser and Octopart pages provide purchasing and aggregation paths, but no complete quantity-price table is present in the supplied data. Engineers should compare authorized sourcing, lot traceability, date codes, and documented lifecycle status before committing an industrial or long-lived design. This page consolidates verified distributor specifications, package details, pricing references, and replacement screening into a design-focused record. It also distinguishes exact package-compatible family variants from unsupported assumptions, reducing the risk of treating a different Spartan-6 grade as an unconditional drop-in replacement.

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XC6SLX9-2FT256I - Spartan-6 LX FPGA, 9K Cells, 186 I/O | AMD
XC6SLX9-2FT256I

XC6SLX9-2FT256I - Spartan-6 LX FPGA, 9K Cells, 186 I/O | AMD

The AMD (formerly Xilinx) XC6SLX9-2FT256I is a Spartan-6 LX family Field Programmable Gate Array (FPGA) IC integrating 9,152 logic cells, 589,824 bits of block RAM, and 186 user I/Os into a 256-ball FTBGA package with 1.0 mm pitch and 17 x 17 mm body. Built on a 45 nm CMOS process with a 1.2 V core supply, the device operates in the industrial temperature range of -40C to +100C and is offered in the -2 speed grade for balanced performance and power. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric, complemented by hardened peripherals such as block RAM, DSP slices, PLLs, and transceivers. FPGAs sit between standard logic ICs and ASICs in the programmable logic hierarchy: unlike ASICs they require no mask set and can be reconfigured in-circuit, while offering far higher density and performance than discrete CPLDs. The Spartan-6 LX family targets cost-sensitive, high-volume applications by integrating common system functions (memory controllers, PCIe, Ethernet MAC) into the silicon. Key features of the XC6SLX9-2FT256I include 16 DSP48A1 slices for fixed- and floating-point arithmetic, 16 Logic Slices per CLB with carry-chain support, dedicated block RAM supporting dual-port operation, and SelectIO technology supporting LVCMOS, LVDS, SSTL, and HSTL I/O standards. The device includes 2 PLL clock managers and supports up to 667 MHz internal operation, making it suitable for digital signal processing, motor control, video bridging, and embedded control planes. The -2 speed grade balances the highest performance with the lowest power consumption across the Spartan-6 LX family. Power management is enabled through a 1.2 V core supply, a separate auxiliary supply, and an I/O supply that can be set independently from 1.2 V to 3.3 V, allowing direct interface to legacy 5 V-tolerant buses through external clamping. Configuration is supported via JTAG (IEEE 1149.1 / IEEE 1532), SPI, BPI, and the dedicated Xilinx multi-boot modes. Typical applications include industrial motor drives, factory automation controllers, medical imaging pre-processing, broadcast video processing, low-density telecommunications line cards, and embedded control planes in avionics and defense systems. The 256-FTBGA package suits designs that need high I/O count (186 user I/Os) on a moderate PCB area while keeping JTAG-driven configuration simple. When designing with this FPGA, ensure decoupling follows the Spartan-6 PCB Design Guide (UG393), with a 1.0 uF + 0.01 uF pair per supply pin placed within 5 mm of the BGA ball. JTAG chain integrity must be checked at low temperature to avoid boundary-scan failures at industrial cold-start. For long-life programs requiring multi-decade supply continuity, plan a migration path now because Spartan-6 is in long-term support but not recommended for new designs. This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not found in the AMD datasheet alone, helping procurement and hardware engineers verify availability and select a pin-compatible alternative for long-life designs.

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XC6SLX9-2FTG256C - 9K LE Spartan-6 LX FPGA 256-BGA | AMD/Xilinx
XC6SLX9-2FTG256C

XC6SLX9-2FTG256C - 9K LE Spartan-6 LX FPGA 256-BGA | AMD/Xilinx

The AMD/Xilinx XC6SLX9-2FTG256C is a Spartan-6 LX field-programmable gate array (FPGA) built on a mature 45 nm low-power copper CMOS process, delivering 9,152 logic cells, 1,430 adaptive logic modules (ALMs), and 576 Kbits of embedded block RAM in a 256-ball fine-pitch thin BGA (FTG256) package measuring 17 x 17 mm with 1.0 mm ball pitch. It targets the -2 commercial speed grade with internal performance up to 667 MHz and is specified for commercial 0 C to 85 C operation. The part provides 186 user I/Os through the FTG256 footprint and integrates dual-register 6-input LUT logic alongside a rich set of built-in system-level blocks. A Field-Programmable Gate Array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP slices, and clock management tiles. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and occupy the high-density end of that family. Spartan-6 LX parts are specifically optimized for logic-intensive, cost-sensitive applications rather than the transceiver-rich Spartan-6 LXT family, delivering half the power consumption of previous Spartan generations while expanding densities from 3,840 up to 147,443 logic cells across the family. Key features include 15 dedicated 18 x 18 multiplier/DSP slices, 32 Kbits of distributed RAM, integrated DCM and PLL clock tiles, hard PCIe endpoint support in higher-density family members, and SelectIO technology supporting a wide range of I/O standards including LVCMOS, LVDS, and HSTL. The 45 nm process enables lower static and dynamic power compared with the prior Spartan-3A generation, and the -2 speed grade offers a balanced trade-off between performance, power, and cost. The XC6SLX9-2FTG256C uses a 6-input LUT architecture with two flip-flops per LUT for efficient pipelining, plus dedicated carry logic for arithmetic and dedicated multiplier blocks for DSP. Configuration is supported through SPI, JTAG, and BPI flash modes, and the silicon includes built-in bitstream encryption and CRC checking for production designs. Typical applications include industrial motor control and machine vision, low-cost display controllers, consumer video processing, USB/Ethernet bridging, SPI-to-parallel glue logic replacement, LED video walls, and low-volume ASIC prototyping. The wide I/O count and DSP blocks also make it suitable for software-defined radio front-ends and small-form-factor industrial IoT controllers that require deterministic parallel processing. When designing with this part, ensure the FTG256 PCB land pattern follows JEDEC MS-034 with 1.0 mm pitch and that decoupling uses at least 100 nF + 4.7 uF per power rail within 5 mm of the balls. Multi-rail sequencing, JTAG chain ordering, and configuration mode pin strapping should be reviewed against UG380 before layout commitment. This page synthesizes distributor stock and pricing, drop-in FPGA alternatives with verified package compatibility, and practical design notes that complement the Xilinx Spartan-6 family documentation set (DS160 and UG380).

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XC6SLX9-2FTG256I - Spartan-6 LX 9K LUTs FPGA 256-FTBGA | AMD
XC6SLX9-2FTG256I

XC6SLX9-2FTG256I - Spartan-6 LX 9K LUTs FPGA 256-FTBGA | AMD

The AMD (Xilinx) XC6SLX9-2FTG256I is a Spartan-6 LX family Field Programmable Gate Array (FPGA) delivering 9,152 logic cells, 186 user I/Os, and 9152 LUTs in a 256-ball FTBGA package with 1.0 mm ball pitch. It integrates 32 DSP48A1 slices, 2.7 Mb of block RAM across 90 hardware blocks, a 667 MHz internal clock, and a 1.2 V core supply built on a mature 45 nm low-power copper CMOS process. An FPGA (Field Programmable Gate Array) is a programmable logic device whose logic fabric, interconnect, and I/O behavior are configured by the user after manufacture. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) alongside CPLDs, and they are used to implement custom digital logic, glue logic, DSP pipelines, and high-speed serial interfaces. The Spartan-6 family is positioned for low-cost, high-volume applications such as consumer, industrial, and automotive driver-assistance systems. Key features of this -2 industrial-grade device include a 6-input LUT architecture, dedicated 18 Kb Block RAM with dual-port capability, integrated DSP slices for fixed- and floating-point math, and built-in memory controllers supporting DDR, DDR2, DDR3, and LPDDR. The -2 speed grade balances logic performance and power for most cost-sensitive designs, while the 'I' suffix denotes the industrial temperature range of -40C to +100C. The architecture combines a Programmable Logic Array of slices, a Programmable Interconnect Matrix, mixed-signal SERDES-capable GTP transceivers (on LXT variants), and Configuration Logic accessed through JTAG, SPI, or SelectMap interfaces. The 256-FTBGA package delivers a 17 x 17 mm footprint with 1.0 mm pitch suitable for high-density multi-layer PCB designs. Typical applications include consumer video processing, automotive driver assistance, industrial motor and motion control, flat-panel display controllers, and high-volume wireline communication bridges. The wide integration of logic, memory, and DSP allows a single device to replace multiple discrete components, reducing BOM cost and PCB area. When designing with this FPGA, pay attention to decoupling (multiple 100 nF capacitors plus bulk capacitance near each power pin), configuration mode selection via M[2:0] pins, and I/O bank voltage planning because the device supports 1.2 V to 3.3 V I/O standards. JTAG chain integrity must be verified before production programming to avoid field failure due to configuration corruption.

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XC6SLX9-2TQG144C - Spartan-6 LX FPGA, 9152 Cells, 102 I/O | AMD
XC6SLX9-2TQG144C

XC6SLX9-2TQG144C - Spartan-6 LX FPGA, 9152 Cells, 102 I/O | AMD

The AMD (Xilinx) XC6SLX9-2TQG144C is a Spartan-6 LX field-programmable gate array (FPGA) providing 9,152 logic cells, 102 user I/Os, and 715 Configurable Logic Blocks (CLBs) in a 144-pin TQFP (TQG144) package. Built on a mature 45 nm low-power copper CMOS process, this speed-grade -2 commercial-temp part integrates 589,824 system gates and supports DCM/PLL clock management at up to 375 MHz internal performance. A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that engineers can reprogram after PCB assembly to implement arbitrary digital logic, state machines, glue logic, soft processors, or high-speed serial interfaces. Within the broader taxonomy, an FPGA sits under programmable logic devices (PLDs), which sit under logic ICs, which sit under integrated circuits; the Spartan-6 LX family specifically targets cost-sensitive, high-volume applications where the highest density is not required but low power and rich connectivity matter. Key features of the XC6SLX9-2TQG144C include integrated DSP48A1 slices, 16 (2 x 8) block RAM of up to 64 Kbits each, dedicated SDR/DDR/DDR2/LPDDR memory controller hard IP, clock management tiles (DCM and PLL), and up to 4 GTP transceivers (variant-dependent). The TQFP-144 plastic thin quad flat pack offers 0.5 mm pitch and 20 x 20 mm body, enabling low-cost two-layer PCB assembly. Internally the device uses 1.14 V to 1.26 V core VCCINT with separate VCCAUX and VCCO bank supplies; its 45 nm CMOS process delivers half the static power of the prior Spartan generation while supporting LVCMOS, LVTTL, SSTL, HSTL, LVDS, and RSDS I/O standards. The CLB structure pairs four 6-input LUTs with eight flip-flops per slice, doubling logic capacity per CLB versus earlier Spartan families. Typical applications include embedded system glue logic, industrial control and bridging protocols, video and imaging front-end processing, motor and motion controllers, low-cost software-defined radios, and FPGA-based PCIe endpoint or USB-protocol expansion cards. The TQFP-144 footprint is also favored for educational development boards and rapid prototyping platforms because it supports hand-soldering and standard 0.5 mm-pitch PCB manufacturing. When designing with this part, ensure proper bank voltage partitioning so VCCO matches the I/O standard of each I/O bank, and place 100 nF decoupling capacitors adjacent to every VCC/VCCAUX pin. ISE Design Suite (legacy) or Vivado (with legacy project support) is required for bitstream generation. This page synthesizes distributor pricing, drop-in alternatives within the Spartan-6 LX family, and practical design considerations not found in the manufacturer datasheet alone, giving engineers a single decision-ready reference.

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XC6SLX9-2TQG144I - Spartan-6 LX FPGA, 9,152 Cells, 144-LQFP | AMD
XC6SLX9-2TQG144I

XC6SLX9-2TQG144I - Spartan-6 LX FPGA, 9,152 Cells, 144-LQFP | AMD

The AMD (Xilinx) XC6SLX9-2TQG144I is a logic-optimized Spartan-6 LX Field-Programmable Gate Array (FPGA) IC delivering 9,152 logic cells, 102 user I/O pins, and 576 Kbits of block RAM in a 144-pin TQFP (TQG144) package with 0.5 mm pitch. The "-2" speed grade targets a balance between performance and power efficiency, and the "I" suffix designates the industrial operating temperature range of -40C to +100C. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon blocks (BRAM, DSP, transceivers) that engineers can reconfigure post-manufacturing. FPGAs sit above microcontrollers and ASICs in the programmable logic hierarchy: microcontrollers execute software sequentially, ASICs are hard-wired for one function, while FPGAs deliver hardware-level parallelism with full design flexibility. The Spartan-6 family specifically targets cost-sensitive, high-volume logic, embedded, and DSP applications. Key features of the XC6SLX9-2TQG144I include 9,152 logic cells (1,430 ALMs / 715 CLBs), 576 Kbits of block RAM, 16 DSP48A1 slices, 102 user I/O, and integrated configuration options supporting SPI, BPI, and JTAG modes. The device includes on-chip clock management (DCMs and PLLs) and supports DDR, DDR2, DDR3, and LPDDR external memory interfaces, enabling it to bridge to modern system memory. Built on a mature 45 nm low-power copper CMOS process, the XC6SLX9-2TQG144I is engineered for low static and dynamic power dissipation. The 1.2V core voltage with separate I/O bank voltages (1.2V-3.3V) lets designers mix logic levels on a single chip. The TQG144 package is the high-volume cost-optimized footprint, suitable for cost-sensitive designs that don't need the transceivers of the LXT family. Typical applications span industrial control and motor drive, automotive infotainment and driver assistance (non-safety), consumer video processing, software-defined radio, low-cost ASIC replacement, and bridge/IO expansion. Compared with a microcontroller, the FPGA delivers true parallel processing and deterministic latency, critical for video pipelines and DSP. When designing, plan for a multi-rail power supply (1.2V VCCINT + per-bank VCCO) and respect the JTAG programming and configuration sequencing requirements documented in the Spartan-6 configuration user guide. For new designs, evaluate whether a Spartan-7 XC7S6/XC7S15 or Artix-7 XC7A15T would deliver better cost-per-logic and updated silicon. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

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XC6SLX9-3FT256I - 9,152-Cell 667 MHz FPGA | AMD / Xilinx
XC6SLX9-3FT256I

XC6SLX9-3FT256I - 9,152-Cell 667 MHz FPGA | AMD / Xilinx

The AMD / Xilinx XC6SLX9-3FT256I is a Spartan-6 LX field-programmable gate array with 9,152 configurable logic cells, 715 configurable logic blocks, 667 MHz internal frequency, and 186 I/O sites in a 256-ball FTBGA package. It is manufactured on a 45 nm CMOS process and is identified by the supplied data as an industrial-temperature device operating from 0°C to 85°C. An FPGA is a semiconductor whose digital logic, interconnect, and I/O behavior are defined after manufacture. A field-programmable gate array belongs to the programmable-logic hierarchy, alongside CPLDs and ASICs. Unlike a fixed-function ASIC, an FPGA can accommodate multiple digital interfaces and control functions, but timing, resource allocation, pin constraints, and power behavior must be validated in the selected design tools. The XC6SLX9 combines 9,152 logic cells, 715 CLBs, and 186 I/O sites. The -3 suffix identifies the highest-performance Spartan-6 LX speed grade cited in the supplied results. The FT256 package is a 17 mm by 17 mm FTBGA with 1 mm pitch, while the trailing I denotes the industrial temperature grade. One supplied source reports a 862 MHz figure, while another reports 667 MHz; this record uses the explicitly indexed 667 MHz value and does not treat the conflicting figure as an additional verified rating. Typical uses include industrial control, data acquisition, communications gateways, embedded instrumentation, sensor processing, and general-purpose digital signal conditioning. The 186-I/O count can support parallel control buses, counters, status inputs, communications interfaces, and external memory connections when pin multiplexing and timing permit. Resource utilization must be checked in ISE Design Suite or the approved AMD FPGA tool flow rather than inferred from logic-cell count alone. This 256-ball BGA package requires a multilayer PCB with controlled escape routing and package-specific ball assignment. Pinout details, configuration requirements, bank voltage limits, decoupling, and differential-pair rules must come from the official Spartan-6 documentation and package files. The available web results do not provide a genuine manufacturer PDF URL, a complete verified ball map, lifecycle notice, or qualified pricing table, so those fields remain unverified. This page consolidates the supplied distributor specifications, comparison candidates, sourcing observations, and design cautions. It adds engineering context around package migration, speed-grade differences, timing validation, and BGA layout while clearly separating verified facts from data that still requires manufacturer-document confirmation.

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XC6SLX9-3TQG144C - 9,152-LC Spartan-6 LX FPGA | AMD
XC6SLX9-3TQG144C

XC6SLX9-3TQG144C - 9,152-LC Spartan-6 LX FPGA | AMD

The AMD XC6SLX9-3TQG144C is a Spartan-6 LX field-programmable gate array with 9,152 logic cells, 102 user I/O, a -3 speed grade, and a 144-LQFP package. It is designed for cost-sensitive, high-volume embedded systems that require programmable logic, parallel interfaces, control, and modest signal-processing capability without the resource count of a larger FPGA. An FPGA is a programmable semiconductor in the broader logic and semiconductor hierarchy. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA combines configurable logic blocks, programmable interconnect, block RAM, and dedicated input/output resources on one device. The Spartan-6 LX family targets low-cost designs while retaining the flexibility to implement control logic, protocol handling, data acquisition, and hardware acceleration. The verified listing identifies 102 I/O, 589824 embedded-memory bits, 9152 logic cells, and a 144-LQFP package. The -3 suffix denotes the highest-performance speed grade in the supplied Spartan-6 comparison information. A separate search result reports a 667 MHz internal frequency and a 0 to 85 C operating-temperature range, but those values require confirmation against the appropriate official device data before final design release. Typical uses include industrial automation, motor control, machine-vision interfaces, sensor acquisition, protocol conversion, communication infrastructure, and embedded control systems. The package exposes 144 pins for power, ground, configuration, clock, and user-I/O connections. Exact pin names, bank voltage limits, configuration pins, and package dimensions were not supplied in the verified excerpts and must be taken from the official AMD Spartan-6 package pinout files. For a new design, use the AMD package pinout file and the device-specific Spartan-6 documentation before assigning pins. Confirm that every powered bank, configuration signal, clock source, and I/O standard satisfies the design's voltage and timing requirements. The mature 45 nm Spartan-6 architecture is also supported by established FPGA tool flows, although tool-version and device-support details should be verified separately.

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XC6SLX9-3TQG144I - Spartan-6 LX FPGA | AMD
XC6SLX9-3TQG144I

XC6SLX9-3TQG144I - Spartan-6 LX FPGA | AMD

The AMD XC6SLX9-3TQG144I is a Spartan-6 LX field-programmable gate array (FPGA) with 9,152 logic cells, 102 I/O, 144 pins, and a TQG144 surface-mount package. The verified distributor data identifies the device as an FPGA IC and lists 9,152 logic cells, 102 I/O, and a 144-LQFP package. It is positioned for cost-sensitive embedded designs requiring configurable logic, parallel interfaces, control functions, and moderate digital processing. An FPGA is a programmable semiconductor containing configurable logic blocks, programmable interconnect, and input/output resources. Within the device hierarchy, the XC6SLX9 belongs to Spartan-6 LX, which combines FPGA fabric with application-specific resources for embedded control, communications, signal conditioning, and system integration. The -3 suffix identifies the performance grade, while TQG144 identifies the package configuration; the final I suffix identifies the supplied temperature-grade variant. Verified data identifies the part as a Spartan-6 LX FPGA suitable for industrial automation and control systems, including motor control, machine vision, and sensor data processing. The 9,152 logic-cell count provides a useful indication of the programmable fabric density, while 102 I/O supports systems requiring numerous external connections. The -3 speed grade is also identified in the comparison search result as the highest-performance grade among the referenced Spartan-6 LX speed options, but timing and power details require the manufacturer datasheet for exact design use. The TQG144 package is a 144-pin surface-mount LQFP/TQFP-class package suitable for conventional PCB assembly. Unlike a BGA package, its perimeter leads are visually inspectable after assembly and compatible with accessible routing and inspection processes. Exact package dimensions, pin names, voltage ratings, supported I/O standards, clock resources, and configuration requirements are marked as needed when absent from the supplied verified data. Typical design considerations include confirming the required Spartan-6 configuration bitstream, validating every pin against the package pinout, decoupling each supply rail according to the manufacturer guidance, and checking timing closure for the selected clock and interface paths. Because the supplied snippets do not provide a complete manufacturer pin table, this record does not infer individual pin functions. This page combines verified distributor specifications, an official package-pinout source reference, commercial availability data, and drop-in replacement analysis. It distinguishes confirmed facts from parameters that require the complete AMD Spartan-6 datasheet, helping engineers evaluate XC6SLX9-3TQG144I without treating incomplete distributor snippets as complete electrical documentation.

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XC6SLX9-L1FT256I - Spartan-6 LX FPGA, 186 I/O | Xilinx
XC6SLX9-L1FT256I

XC6SLX9-L1FT256I - Spartan-6 LX FPGA, 186 I/O | Xilinx

The Xilinx XC6SLX9-L1FT256I is a Spartan-6 LX field-programmable gate array with 9,152 logic cells, 589,824 equivalent logic gates, and 186 user I/O, supplied in a 256-ball LBGA package. This industrial-temperature -1L device combines programmable logic, block RAM, and digital signal processing resources in one reconfigurable semiconductor. Its six-input lookup-table architecture supports efficient implementation of control logic, communication interfaces, arithmetic pipelines, and mixed sequential-combinational designs. A field-programmable gate array is a programmable digital semiconductor whose logic and interconnect resources are configured after manufacture. The Spartan-6 LX family belongs to the broader FPGA hierarchy, where FPGAs sit between fixed-function logic ICs and larger programmable systems. This device therefore combines the flexibility of software-programmable logic with the parallel processing performance and deterministic I/O behavior required by embedded control systems. The XC6SLX9-L1FT256I provides 9,152 logic cells, 186 user I/O, and 589,824 equivalent logic gates. Its -1L speed and temperature designations distinguish it from faster Spartan-6 grades and commercial-temperature variants. The 256-ball package supports dense board-level integration without relying on a leaded package. Because FPGA utilization depends on the implemented architecture, timing closure, pin constraints, and I/O standards, not only the nominal cell count, designers should evaluate each design against its actual resource map. Spartan-6 devices use configurable logic blocks connected by programmable routing and include dedicated resources for memories, multipliers, clock management, and signal processing. This architecture allows parallel datapaths to execute multiple operations per clock cycle and makes the device suitable for deterministic control and high-throughput digital signal processing. The supplied verified data confirms the device family and resources but does not provide detailed block-RAM, DSP-slice, PLL, or maximum I/O-frequency figures for this exact ordering code. Typical uses include industrial control, embedded instrumentation, communications gateways, data acquisition, digital signal processing, and general-purpose programmable logic. The 186 available user I/O allow external memory, sensors, converters, transceivers, and status or control signals to be integrated close to the FPGA fabric. The compact 256-ball package is especially useful when board area is constrained but a large pin count is required. Designers should preserve the package-specific pinout and power architecture, assign pins through the supported Xilinx toolchain, and validate all I/O standards against the device constraints. They should also confirm timing, supply requirements, temperature limits, and tool support for the production design before committing the obsolete-capable package to a new platform. This page combines verified distributor data, same-family drop-in alternatives, application guidance, and practical migration considerations. It highlights where engineers can preserve an existing PCB and where speed-grade, temperature, resource, or toolchain differences still require qualification.

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XC6SLX9-N3CSG225I - Spartan-6 LX FPGA, 225-BGA | AMD
XC6SLX9-N3CSG225I

XC6SLX9-N3CSG225I - Spartan-6 LX FPGA, 225-BGA | AMD

AMD XC6SLX9-N3CSG225I is a Spartan-6 LX field-programmable gate array (FPGA) in a 225-ball chip-scale BGA package with 160 user I/O. It combines programmable logic, configurable I/O, embedded memory resources, and dedicated configuration capabilities in a single surface-mount device. The -3 designation identifies the device speed grade, while the CSG225 package identifies the 225-ball configuration used by this part. A field-programmable gate array is a semiconductor whose digital logic, interconnect, and I/O behavior are configured after manufacture. FPGA technology sits between fixed-function logic and software-programmable processors. The Spartan-6 LX family is intended for cost-sensitive embedded systems that require programmable hardware, parallel interfaces, control logic, and moderate signal-processing capability without the resources of a larger FPGA. The primary catalog characteristics identify 160 user I/O in a 225-LFBGA, CSPBGA package. This combination is useful when a design requires many external connections but must fit a compact, high-density board layout. The -3 speed grade is intended for designs where higher logic timing performance is useful within the Spartan-6 LX family. Configuration data stored in the device's nonvolatile configuration memory allows the programmed circuit to operate without a separate configuration controller after power-up. The Spartan-6 architecture supports a combination of configurable logic, block RAM, digital signal-processing resources, and programmable I/O blocks. These resources can be assembled into parallel data paths, control logic, communication interfaces, industrial automation functions, and embedded signal-processing blocks. Because the device is nonvolatile and reprogrammable, one board design can also support multiple hardware configurations or engineering revisions without changing the PCB footprint. Typical applications include industrial control systems, test and measurement equipment, embedded instrumentation, communications equipment, video-processing modules, and compact embedded platforms that need many parallel I/O in a high-density package. The 160-I/O count can simplify connections to external converters, memory devices, transceivers, and human-interface circuitry. Designers should still verify each I/O standard, bank voltage, and pin assignment against the AMD Spartan-6 package pinout and design guides before PCB release. A key design consideration is that the -3 speed grade and 225-ball package do not by themselves guarantee timing closure. The board must satisfy the applicable AMD pinout, package, configuration, decoupling, and PCB-design requirements. Differential pairs, high-speed memory interfaces, and sensitive analog-facing digital inputs also require trace-length and return-path planning. Use the AMD package pinout files and the device datasheet as the authoritative sources for ball assignments and electrical constraints. This page combines the exact device identification, package information, sourcing data, same-package drop-in candidates, and practical selection guidance for engineers maintaining Spartan-6 LX FPGA systems. It highlights the engineering differences that matter during replacement, board reuse, lifecycle planning, and new-design selection.

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XC6SLX9-N3CSG324C - 200 I/O Spartan-6 FPGA | AMD
XC6SLX9-N3CSG324C

XC6SLX9-N3CSG324C - 200 I/O Spartan-6 FPGA | AMD

The AMD XC6SLX9-N3CSG324C is a Spartan-6 LX field-programmable gate array with 200 user I/Os, 9,152 programmable logic cells, a maximum frequency of 806 MHz, and a 324-ball chip-scale BGA package. The device operates from a 1.14 V to 1.26 V core supply and is specified over a 0°C to 85°C temperature range. It is packaged in a 15 mm × 15 mm surface-mount body with a 0.8 mm ball pitch. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interconnects, and configurable I/O blocks are programmed after manufacture. FPGAs occupy the programmable-logic and FPGA-and-CPLD branches of the broader semiconductor hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA can implement parallel processing, interface adaptation, protocol conversion, control logic, and signal-processing functions in one reconfigurable device. The Spartan-6 LX architecture provides 715 configurable logic blocks, 9,152 logic cells, and 200 user I/Os in this CSG324 package. Its -3 speed designation identifies a performance grade, while the commercial-temperature option supports systems operating from 0°C to 85°C. The 1.14 V to 1.26 V core-voltage range is suitable for designs requiring a compact, energy-efficient programmable logic platform with abundant parallel I/O. The CSG324 package uses a dense 324-ball chip-scale BGA arrangement to provide more than 200 user I/Os in a compact 15 mm × 15 mm footprint. This pin density makes the device appropriate for board-level systems that require numerous differential, high-speed, control, or external-memory connections. Designers must follow the AMD Spartan-6 package pinout files when assigning BGA balls and must provide suitable decoupling, power sequencing, clocking, and signal-integrity routing. Typical applications include industrial automation, communications infrastructure, instrumentation, video and image processing, embedded control, storage interfaces, and network equipment. The large I/O count is particularly useful when the FPGA must bridge multiple buses, capture parallel data, control external converters, or implement high-speed serial transceivers alongside user logic. A companion clock generator may be required when the design depends on a precise external reference clock. A critical implementation consideration is the BGA assembly process. The 0.8 mm pitch requires a qualified PCB stack-up, laser or mechanical vias as permitted by the fabrication process, and inspection appropriate to the package density. Power rails should follow the AMD datasheet decoupling guidance, while high-speed clocks and differential pairs should use controlled impedance and short return paths. This product page combines the exact device identity, package characteristics, search-focused technical guidance, drop-in alternatives, and practical BGA implementation notes. It is designed to help engineers evaluate the XC6SLX9-N3CSG324C for new Spartan-6 designs, controlled migrations within the family, and legacy product maintenance.

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XC6SLX9-N3FT256C - Spartan-6 LX FPGA, 9152 LUTs | AMD
XC6SLX9-N3FT256C

XC6SLX9-N3FT256C - Spartan-6 LX FPGA, 9152 LUTs | AMD

The AMD Xilinx XC6SLX9-N3FT256C is a Spartan-6 LX field-programmable gate array (FPGA) built on 45 nm technology, with 9,152 configurable logic cells, 589,824 RAM bits, 186 I/O, and a 256-FTBGA package. Its 1.2 V supply operation and 256-ball surface-mount package make it a compact programmable-logic platform for embedded control, communications, signal processing, and industrial systems. The verified distributor listing identifies the part as a Spartan-6 LX FPGA with 9152 cells and a 256-LBGA package, while the comparison source specifies 186 I/O. A field-programmable gate array is a semiconductor device whose digital logic and interconnect resources are configured after manufacture. An FPGA belongs to the broader category of programmable logic devices, alongside complex programmable logic devices and application-specific integrated circuits. Its architecture combines configurable logic blocks, block RAM, programmable I/O, dedicated clocking resources, and digital signal processing blocks. This allows hardware functions to be adapted to different protocols, control algorithms, or product revisions without changing the underlying PCB in the same way a fixed-function ASIC would require. The Spartan-6 LX family is positioned for cost-sensitive, high-volume embedded applications. The XC6SLX9-N3FT256C combines 9,152 logic cells with 589,824 RAM bits and 186 I/O in a 17 x 17 mm-class 256-FTBGA package, according to the provided component data. The N3 speed-grade designation is reported by the distributor search, but timing, power, temperature, and absolute maximum ratings are not supplied in the verified excerpt; those values must be confirmed in the manufacturer documentation before design release. Typical implementation paths include parallel data acquisition, sensor conditioning, motor and motion control, industrial communication bridges, embedded display control, and low-cost instrumentation. The 256-FTBGA package favors designs with dense routing and high I/O counts, but it requires careful ball-grid layout, via-in-pad or escape-routing planning, and assembly-process control. The 186 I/O count is particularly relevant when a system needs substantial parallel connectivity without adding a separate large package. For a new design, first verify the exact pinout, bank voltages, supported I/O standards, configuration interface, clock requirements, and decoupling recommendations in the official AMD Spartan-6 documentation. Do not infer pin function or board-level electrical limits from distributor listings alone. If an existing XC6SLX9 design is being replicated, compare the exact device speed grade and package variant before substitution, because FTG and FT package suffix differences can affect sourcing or ordering interpretation. This page consolidates verified distributor specifications, package identity, sourcing links, and practical FPGA integration guidance. It deliberately separates confirmed facts from parameters that remain unavailable in the supplied search evidence, helping engineers identify procurement and design-validation tasks before committing a Spartan-6 LX board to production.

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XC6SLX9-N3FT256I - 9K Logic FPGA, 186 I/O | AMD
XC6SLX9-N3FT256I

XC6SLX9-N3FT256I - 9K Logic FPGA, 186 I/O | AMD

AMD XC6SLX9-N3FT256I is a Spartan-6 LX field-programmable gate array with 9,152 logic elements, 186 I/O, 589,824 RAM bits, and 256-ball BGA packaging. The verified product listing identifies 186 I/O, 9,152 logic elements, 589,824 RAM bits, and a 256-LBGA package. A Spartan-6 FPGA is a programmable-logic semiconductor used to implement parallel data paths, control logic, state machines, interfaces, and signal processing. It belongs to the FPGA and CPLD hierarchy, combines configurable logic with programmable I/O, and is programmed through a configuration chain or memory interface. This makes the device suitable for embedded control, communications, instrumentation, industrial automation, and test equipment. The part identifier identifies an XC6SLX9 device in the N3 speed and FT256 package variant. The verified listing reports 186 I/O, 9,152 logic elements, and 589,824 RAM bits. The package is identified as 256-LBGA, while one cross-reference result describes it as a 256-FTBGA surface-mount package measuring 17 mm by 17 mm. Pin-level placement and all 256 ball assignments require the official package pinout data before board layout is approved. The -N3 portion is associated with the device’s specified speed and temperature grade in the manufacturer ordering information, but the supplied web data does not provide a complete timing table, operating-temperature range, power table, or lifecycle statement. Those parameters should be taken from the relevant Spartan-6 device datasheet and package files rather than inferred from the distributor listings. The cross-reference data identifies the same XC6SLX9-N3FT256I part in a 256-FTBGA package with 1.14 V to 1.26 V supply voltage and a -40°C to 100°C operating junction-temperature description. Typical design use includes industrial control systems, communication interfaces, data acquisition, test-and-measurement equipment, and embedded instrumentation. Configuration storage, clocking, bank voltage, I/O standards, and decoupling must be planned together because incorrect bank voltage or signal-integrity assumptions can prevent reliable operation. For replacements, the exact package, pinout, speed grade, temperature grade, memory resources, and configuration compatibility are decisive. This page consolidates verified distributor listings, package information, cross-reference results, and engineering guidance. It does not invent missing electrical, timing, lifecycle, or pinout values; unavailable specifications remain marked for validation against AMD documentation.

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XC6SLX9-N3FTG256C - 9152-Cell Spartan-6 LX FPGA | AMD
XC6SLX9-N3FTG256C

XC6SLX9-N3FTG256C - 9152-Cell Spartan-6 LX FPGA | AMD

The AMD XC6SLX9-N3FTG256C is a Spartan-6 LX field-programmable gate array with 9,152 logic cells, 186 user I/O, and a 256-LBGA FTG256 package. It uses 45 nm CMOS fabrication technology with a 1.2 V core supply, supports an operating junction-temperature range of 0°C to 85°C, and is organized around 715 configurable logic blocks. A field-programmable gate array, or FPGA, is a programmable digital semiconductor whose look-up tables, routing networks, and configurable I/O blocks implement custom logic, interface, control, and signal-processing circuits. In the product hierarchy, an FPGA belongs to programmable logic devices, alongside CPLDs, and provides substantially greater parallelism than a conventional sequential microcontroller. Key features include 9,152 logic cells, 186 I/O, and a reported 806 MHz performance figure. The 256-ball package uses a 1 mm ball pitch and occupies a 17 mm by 17 mm footprint. Surface-mount assembly makes the device suitable for compact embedded, communications, industrial-control, and test-equipment systems, provided that the PCB supports BGA inspection, assembly, and appropriate thermal management. The Spartan-6 LX architecture combines programmable logic with dedicated block RAM and digital signal-processing resources. This allows designers to parallelize data movement and arithmetic rather than relying on instruction-by-instruction execution. The XC6SLX9 position provides a moderate logic capacity for control planes, protocol bridges, instrumentation front ends, and multi-channel data-acquisition systems where a larger FPGA would add unnecessary cost or board area. Typical applications include industrial automation, embedded communications, peripheral controllers, instrumentation, and signal-processing front ends. The 186 available I/O support board-level connections among processors, transceivers, memories, analog converters, and communication transceivers. Engineers must still validate every high-speed interface against the Spartan-6 speed grade and the selected PCB stack-up. A critical design consideration is that an FPGA configuration is not automatically portable between every suffix in the Spartan-6 LX family. Confirm the package files, speed grade, temperature grade, supported I/O standards, and configuration interface before committing a board layout. Use the AMD Spartan-6 package device pinout files when assigning every BGA ball and validating power, ground, configuration, and general-purpose I/O connections. This product page consolidates the verified device characteristics, package considerations, compatible same-family alternatives, interface-oriented applications, and practical selection guidance. It is designed to help engineers identify the correct suffix and evaluate whether the XC6SLX9-N3FTG256C provides the required logic density without changing the intended 256-ball footprint.

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XC7A100T - Artix-7 FPGA 101K Logic Cells | AMD
XC7A100T

XC7A100T - Artix-7 FPGA 101K Logic Cells | AMD

The AMD (Xilinx) XC7A100T is a mid-range member of the Artix-7 family of Field Programmable Gate Arrays (FPGAs) fabricated on TSMC 28nm HPL process, delivering the lowest power and cost per logic cell in the 7-series lineup. The base MPN covers speed grades -1, -2, -3 and commercial/industrial temperature ranges in packages CSG324, FTG256, FGG484, and FGG676. An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks and reconfigurable interconnects that customers configure after manufacturing, enabling custom digital hardware without ASIC development cost. FPGAs sit above CPLDs in capacity and below ASSPs in specificity; the Artix-7 family is positioned as a low-cost, low-power FPGA for high-volume, cost-sensitive systems. Key features of the XC7A100T include 101,440 logic cells (15,850 slices with 6-input LUTs), 4,860 Kb of block RAM, 240 DSP48E1 slices supporting 25x18 multipliers with 48-bit accumulators, 6 clock management tiles (CMTs), and up to 210 user I/O in the CSG324 package. The T suffix denotes transceiver-capable devices supporting serial line rates up to 6.6 Gbps (GTP) in select packages. Integrated hard IP includes PCIe blocks, an XADC 12-bit analog-to-digital converter, and hardened DDR3 memory controller support, reducing external component count. Architecture highlights: CLBs combine two slices with fast carry chains; the block RAM is cascadable as dual-port RAM, ROM, or FIFO; and the DSP48E1 pipeline supports FIR filters and FFTs for software-defined radio and video processing. Mixed-voltage I/O banks support LVCMOS, LVDS, HSTL, and SSTL standards, with 3.3V compatibility for legacy interfaces. Typical applications include software-defined radio, motor control, industrial networking, medical imaging, video and image processing, aerospace and defense prototyping, and education platforms such as the popular Basys/Nexys boards. Its performance-per-watt also suits edge computing and IoT gateways. Design consideration: the device requires multiple rails (VCCINT 1.0V, VCCAUX 1.8V, VCCO per bank) with defined power sequencing and thorough decoupling. Use the AMD Vivado design suite for synthesis and refer to DS181 (Artix-7 DC and AC Switching Characteristics) for timing data. Pricing as of 2026-08-29 from DigiKey and LCSC.

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XC7A100T-1CS324I - 101440-Logic-Cell FPGA | AMD
XC7A100T-1CS324I

XC7A100T-1CS324I - 101440-Logic-Cell FPGA | AMD

The AMD XC7A100T-1CS324I is an Artix-7 field-programmable gate array with 101,440 logic cells, 210 I/O, and a 1 V operating voltage, housed in a 324-pin FC-BGA package. The device uses 28 nm FPGA technology and combines programmable logic, block RAM, DSP resources, and programmable I/O in a single surface-mount device. Its -1 speed grade supports designs requiring deterministic performance in industrial-temperature applications. An FPGA is a semiconductor device whose digital logic, memory, and signal-processing blocks are configured after manufacture. An Artix-7 FPGA belongs to the broader programmable-logic hierarchy: FPGA → Artix-7 FPGA → programmable logic device → digital semiconductor. This device provides substantially more configurable logic than small CPLDs while retaining a focused package and I/O structure for embedded control, communications, instrumentation, and embedded processing systems. The verified device listing identifies 101,440 logic cells, 210 I/O, a 1 V supply requirement, 28 nm process technology, and a 324-pin FC-BGA package. The 210 available I/O positions allow external interfaces to be assigned according to the selected device, board, and design constraints. The -1 portion of the ordering code denotes a specific speed grade, while the I suffix identifies the industrial-temperature option. Architecturally, the XC7A100T combines general-purpose programmable logic with dedicated block RAM and digital signal processing resources. This mixed-resource arrangement allows control logic, packet buffering, digital filtering, and data movement to be consolidated in one device instead of being divided among several discrete components. Actual logic utilization, RAM availability, DSP count, and achievable performance depend on the selected Artix-7 device resources and the completed design. Typical applications include industrial automation, industrial Ethernet, instrumentation, embedded control, communications infrastructure, and high-speed signal-processing subsystems. The 324-pin package is appropriate when a design needs more I/O than a smaller FPGA package can offer. It can also support systems requiring a dedicated FPGA for protocol conversion, real-time control, data acquisition, or accelerator logic adjacent to a host processor. The principal design consideration is package and resource validation. Engineers should verify the AMD Artix-7 package pinout and device migration information against the exact ordering code before release, especially when changing speed grade or temperature grade. Power, decoupling, configuration-memory access, clocking, and high-speed I/O layout must also be checked against the manufacturer data sheet and applicable reference designs. This page combines verified device characteristics, package information, price and availability gaps, same-family drop-in candidates, and practical selection guidance. It distinguishes verified facts from unresolved commercial and package-specific data so engineers can assess replacement suitability without treating a different speed grade or temperature grade as an identical substitute.

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