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Productos (2)
MAX22028AWA+ - 3.5kVRMS Isolated RS-485/RS-422 Transceiver | Analog Devices
The Analog Devices (formerly Maxim Integrated) MAX22028AWA+ is a fully integrated, 3.5 kVRMS digitally isolated half-duplex RS-485/RS-422 transceiver housed in a compact 8-pin wide-body SOIC package with 5.5 mm of creepage. It combines a UART-side interface, an isolated cable-side driver/receiver, and on-chip galvanic isolation in a single IC, eliminating the need for a separate digital isolator plus discrete transceiver. The device supports data rates up to 16 Mbps and operates over the -40C to +85C industrial temperature range. What is an isolated RS-485 transceiver? An RS-485/RS-422 transceiver is a differential line driver/receiver used for robust, long-distance serial communication in noisy industrial environments. Galvanic isolation adds a high-voltage barrier (typically several kVRMS) between the UART/microcontroller side and the bus side, breaking ground loops, protecting low-voltage logic from surge events, and allowing large common-mode voltages between nodes. Isolated transceivers sit at the intersection of interface ICs and power management, and are essential building blocks in industrial fieldbus, motor control, and renewable energy systems. The MAX22028AWA+ integrates the transformer driver, low-dropout LDO, and isolation barrier on-chip, so only a single 3.3 V supply on the UART side is needed - the cable-side power is generated internally. Maxim's AutoDirection feature eliminates the external DE/RE pin control by sensing the driver input and switching direction automatically, which simplifies firmware and reduces GPIO usage on the host MCU. Integrated protection includes +/-25 V bus fault tolerance on the RS-485 pins, hot-swap capability on the cable side, and 5.5 mm creepage for reinforced insulation per IEC 60747-17 (VDE 0884-17). Typical applications include isolated RS-485 nodes in industrial PLCs, solar inverter monitoring, building-automation RS-485 trunks, isolated sensor interfaces, and HVAC controllers. The wide-body SOIC-8 footprint makes the part a drop-in replacement for designs previously built with a small isolated DC-DC plus an external transceiver + digital isolator stack. When designing with the MAX22028AWA+, place 100 nF X7R bypass capacitors on both VDD pins within 2 mm of the package and observe the 5.5 mm clearance requirement for end-to-end primary/secondary PCB copper. This page synthesizes distributor pricing, same-family alternatives (MAX22025-MAX22028), and design notes beyond the manufacturer datasheet.
MC33689DWBR2 - SPI System Basis Chip with LIN Transceiver | NXP
The NXP MC33689DWBR2 is a SPI-controlled System Basis Chip (SBC) integrating a 5V/60mA linear regulator, a Local Interconnect Network (LIN) transceiver, a watchdog timer, a SPI interface for MCU communication, and multiple high-side/low-side drivers in a 32-SOIC wide-body package. It targets automotive 12V body and chassis applications including power window, mirror, seat, and sunroof control modules. What is a System Basis Chip (SBC)? An SBC is an automotive-grade mixed-signal IC that consolidates the housekeeping functions normally handled by discrete power, communication, and monitoring components. It sits between the 12V automotive battery, the microcontroller, and the LIN bus, providing a regulated MCU supply, watchdog supervision, fail-safe output drivers, and physical-layer connectivity in a single package. Hierarchically, the MC33689 belongs to the power management IC family > analog/mixed-signal IC > system basis chip > SBC with LIN. Key features of the MC33689DWBR2 include a wide 5.5V to 18V supply range (with 27V load-dump transient tolerance), an integrated SPI interface for diagnostic and configuration access, dedicated LIN 2.0/2.1/SAE J2602 physical layer compliant transceiver, configurable watchdog window, and reset generation with selectable timing. The wide-body 32-SOIC package provides generous creepage distance and is suitable for automotive PCB assemblies using through-hole or SOIC sockets. The device is built on NXP's SMARTMOS BCD process technology, integrating analog and digital circuitry on a single die for reliability under harsh automotive environments. Built-in protection includes thermal shutdown, load-dump transient survival, short-circuit limiting on regulated outputs, and reverse-battery protection via external resistor. Typical applications include automotive mirror control, power window modules, seat position controllers, sunroof control units, and other body-electronics LIN slave nodes communicating with body control modules. It is particularly attractive for cost-sensitive LIN slave ECUs where PCB area is constrained. When designing with this device, verify that the LIN master implements proper bus timeout and that the SBC's watchdog timing matches the MCU's firmware timeout window. Decouple the 12V input (VSUP) with a 100nF ceramic close to the pin and reserve board area for load-dump filtering. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, enabling faster procurement and second-source decisions for automotive LIN SBC designs.