DSPIC33EP64GP504T-I/ML
DSPIC33EP64GP504T-I/ML - 16-bit 70 MIPS DSC, 64KB Flash | Microchip
The Microchip Technology DSPIC33EP64GP504T-I/ML is a 16-bit dsPIC33EP general-purpose digital signal controller (DSC) delivering 70 MIPS performance with 64KB (22K x 24) FLASH program memory and 8KB (4K x 16) RAM, housed in a 44-pin QFN (8x8 mm) exposed-pad surface-mount package operating from a 3.0V to 3.6V supply.
A digital signal controller combines the control peripherals of a microcontroller with the computational throughput of a DSP core. In the power-management hierarchy, the dsPIC33EP family sits between general-purpose MCUs (such as PIC24) and dedicated DSPs, offering deterministic single-cycle multiply-accumulate (MAC) execution for control loops, filtering, and signal processing while retaining familiar microcontroller peripherals, interrupt structure, and development tools such as MPLAB X IDE and MPLAB XC16 compiler.
Key differentiating features of the DSPIC33EP64GP504 include the 70 MIPS dsPIC33E core, CAN 2.0B communication module for industrial and automotive networks, three integrated operational amplifiers and four analog comparators that reduce external analog BOM count, and a Charge Time Measurement Unit (CTMU) for capacitive touch and precise time-interval measurement. The Peripheral Trigger Generator (PTG) orchestrates peripheral-to-peripheral triggering autonomously, offloading the CPU in tightly timed applications. The device provides 35 general-purpose I/O pins.
Architecturally, the dsPIC33E core executes an enhanced 16-bit instruction set with DSP-engine support (17-bit x 17-bit multiplier, 40-bit accumulators, dual addressing), programmed from 64KB of FLASH (22K x 24 instruction words). Operating frequency scales to 70 MIPS (70 MHz nominal internal clock, 60 MHz-class clock terminology used by some distributors) via an on-chip PLL from a primary oscillator or internal FRC, supporting deterministic interrupt latency for closed-loop control.
Typical applications include digital power supplies and PFC stages, BLDC/PMSM motor control drives, automotive body and convenience modules (the E-temperature AEC-Q100-qualified variant supports this market), industrial sensors and CAN nodes, and touch-sensing interfaces leveraging CTMU.
When designing with this part, respect the 3.0V to 3.6V operating window, decouple all VDD/VDDCORE pins with 0.1uF ceramics placed at the pins, and solder the exposed thermal pad to a grounded copper pour for ground integrity and heat dissipation. Program FLASH via ICSP using tools such as PICkit 4, ICD 4, or REAL ICE.
This page synthesizes verified distributor data (DigiKey, Mouser), drop-in alternative analysis, and practical design notes not found in the manufacturer datasheet.
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