DSPIC33EP64GS502T-E/2N - 16-bit 60 MIPS DSC 64KB Flash | Microchip
N.º de pieza: DSPIC33EP64GS502T-E/2N ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $5.8 | $5,80 |
| 10 | $5.22 | $52,20 |
| 100 | $4.64 | $464,00 |
| 500 | $4.18 | $2.090,00 |
| 1.000 | $3.73 | $3.730,00 |
DSPIC33EP64GS502T-E/2N Descripción general
A digital signal controller combines the compute architecture of a microcontroller with the math acceleration of a DSP. In the power-management hierarchy, the dsPIC33EP GS family sits at the intersection of MCU control flow and DSP-intensive control-loop execution, making it a single-chip alternative to MCU-plus-DSP two-chip solutions in switch-mode power supplies.
Key features include the interconnected high-Speed PWM module purpose-built for multi-loop SMPS topologies, a high-speed analog-to-digital converter, programmable gain amplifiers (PGA), and analog comparators that close control loops without external components. The -E temperature grade covers -40C to +125C ambient, and the AEC-Q100 qualification plus FuSa support allows use in safety-relevant automotive power stages.
Architecturally, the dsPIC33EP core uses a modified Harvard pipeline with DSP instruction extensions (MAC, multiply-divide) and hardware division, enabling deterministic execution of proportional-integral control loops at switching frequencies well into the hundreds of kilohertz. The interconnected PWM, ADC and comparators can trigger each other autonomously, offloading cycle-by-cycle current limiting from software.
Typical applications include AC-DC power supplies, interleaved power factor correction (PFC), DC-DC converters, solar micro-inverters, battery chargers, and LED drivers. Microchip reference designs such as the Interleaved PFC (350W, universal input) are built directly on this controller family.
Design consideration: the exposed pad of the UQFN package is the primary thermal and ground path - connect it to a solid ground plane with multiple vias; without it, thermal and EMI performance degrade significantly.
This page synthesizes distributor pricing, drop-in same-family alternatives, pinout/package data, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para DSPIC33EP64GS502T-E/2N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33EP64GS502T-E/2N (mismo factor de forma y huella) — difiere en Core Architecture, Package, Packaging, Functional Safety Support, Maximum CPU Speed.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33EP64GS502-E/2N
✅ Sustitución directa✓ En stock
$3.1 / unidad
Ver hoja de datos →DSPIC33EP64GS502I-E/2N
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33EP32GS502-E/2N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$3.5 / unidad
Ver hoja de datos →DSPIC33EP64GS502T-E/2N Valores máximos y características eléctricas
| Core Architecture | 16-bit dsPIC33EP RISC with DSP extensions |
| Maximum CPU Speed | 60 MIPS |
| Program Memory (Flash) | 64KB (64K x 8) |
| Tensión de alimentación | 3.3 V |
| Encapsulado | 28-UQFN (6x6 mm) with exposed pad |
| Qualification | AEC-Q100 automotive |
| Functional Safety Support | Yes (FuSa) |
| Rango de temperatura de funcionamiento | -40C to +125C (E grade) |
| Specialty Features | Interconnected High-Speed PWM, ADC, PGA, Comparators for SMPS/digital power |
| Application Target | SMPS and digital power conversion |
| Tipo de montaje | Surface Mount |
| Packaging | Tape & Reel (T/R) |
| Estado RoHS | Compliant |
Guía de configuración de pines de DSPIC33EP64GS502T-E/2N 28-uqfn (6x6 mm) with exposed pad
Configuración de pines para DSPIC33EP64GS502T-E/2N (encapsulado 28-uqfn (6x6 mm) with exposed pad). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33EP64GS502T-E/2N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33EP64GS502T-E/2N es adecuado para 6 aplicacións: AC-DC Power Supplies, Interleaved Power Factor Correction (PFC), DC-DC Converters, Solar Micro-Inverters, Battery Chargers, LED Drivers.
AC-DC Power Supplies
The DSPIC33EP64GS502T-E/2N is a natural fit for digitally controlled AC-DC power supplies because its interconnected high-Speed PWM, high-speed ADC, programmable gain amplifiers, and analog comparators allow voltage-mode, current-mode, and multi-loop control to be executed by a single 60 MIPS core. The hardware interconnects handle cycle-by-cycle current limiting and fast fault shutdown without software latency, which is essential for meeting hold-up and transient-response requirements. Placed as the sole controller, it replaces an analog PWM controller plus a supervisory MCU, reducing BOM count. The -40C to +125C E grade and AEC-Q100 qualification extend its use into automotive and industrial PSU environments where consumer-grade controllers cannot be qualified.
Recomendado
Interleaved Power Factor Correction (PFC)
Microchip's 350W universal-input Interleaved PFC reference design is built directly on the dsPIC33EP64GS502, demonstrating the part's suitability for two-phase interleaved boost PFC stages. The interconnected high-Speed PWM module generates phase-shifted interleaved drive with programmable phase relationship, while the high-speed ADC samples inductor currents synchronized to each PWM cycle so both phases can share current equally. The analog comparators implement cycle-by-cycle overcurrent protection in hardware. Running at 60 MIPS leaves ample headroom for the outer voltage loop plus power-metering math. The 3.3V supply, 64KB Flash, and AEC-Q100 qualification make it viable from consumer PSU front-ends through automotive on-board charger PFC stages without changing controllers.
Recomendado
DC-DC Converters
For synchronous buck, boost, and buck-boost converters, the DSPIC33EP64GS502T-E/2N offers deterministic loop closure at high switching frequency. The 60 MIPS core executes proportional-integral compensation math in a few microseconds, while the ADC with programmable gain amplifiers digitizes feedback signals directly, eliminating external signal-conditioning op-amps in 3.3V-referenced systems. Hardware comparators trip the PWM outputs within nanoseconds of an overcurrent event - a level of protection speed software alone cannot achieve. Designers typically run the power stage at 100-500 kHz with the ADC triggered by the PWM module for jitter-free sampling. The 28-UQFN (6x6 mm) exposed pad keeps the controller footprint minimal on dense converter boards.
Recomendado
Solar Micro-Inverters
Solar micro-inverters demand simultaneous MPPT (maximum power point tracking), grid-synchronization, and DC-AC inversion control from one low-cost, high-reliability controller. The DSPIC33EP64GS502T-E/2N handles this with its interconnected high-Speed PWM generating the inverter switching pattern, the high-speed ADC sampling panel voltage/current for MPPT algorithms, and the DSP MAC instructions accelerating the control-loop and waveform math at 60 MIPS. The -40C to +125C temperature grade suits rooftop enclosures that see extreme ambient swings, and AEC-Q100 robustness translates into field reliability. The 64KB Flash accommodates MPPT, grid monitoring, and anti-islanding code concurrently, and the FuSa support assists with grid-code compliance documentation.
Recomendado
Battery Chargers
Multi-chemistry battery chargers require staged charging (pre-charge, constant current, constant voltage, termination) with precise current and voltage regulation plus safety supervision. The DSPIC33EP64GS502T-E/2N implements the CC/CV loops in firmware using its 60 MIPS core and high-speed ADC, while the comparators provide independent hardware overcurrent and overvoltage cutoffs that operate even if firmware misbehaves - a valuable defense-in-depth for lithium charging safety. The interconnected PWM drives synchronous buck charging stages at high frequency for small magnetics. AEC-Q100 qualification supports automotive on-board charger sub-modules, and Functional Safety support simplifies safety analyses. The 28-UQFN 6x6 package fits compact charger PCBs in vehicle and portable applications.
Recomendado
LED Drivers
High-power and automotive LED drivers benefit from the DSPIC33EP64GS502T-E/2N's precise, fast current control. The high-Speed PWM supports both fixed-frequency current regulation and burst-dimmable architectures, while the high-speed ADC with PGA reads current-sense signals at low voltage for accurate constant-current loops. Hardware comparators enable cycle-by-cycle LED string overcurrent protection, critical because LED failures are often short-circuit events. Its 60 MIPS core simultaneously runs dimming curves, temperature derating (using on-chip or external temperature sensing), and fault logging. The -40C to +125C grade and AEC-Q100 qualification make it suitable for automotive exterior lighting where thermal cycling and qualification requirements exclude consumer controllers.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33EP64GS502T-E/2N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33EP64GS502-E/2N | DSPIC33EP64GS502I-E/2N | DSPIC33EP32GS502-E/2N |
|---|---|---|---|---|
| Package | 28-UQFN (6x6 mm), exposed pad | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Flash Memory | 64KB | 64KB | 64KB | 32KB (-50%) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) |
| Packaging Format | Tape & Reel (T) | Tube/Tray | Tape & Reel (T) | Tape & Reel (T) |
Diferenciadores clave
- Full 64KB Flash headroom in the same footprint (frente a DSPIC33EP32GS502-E/2N)
- Extended -40C to +125C temperature grade (frente a DSPIC33EP64GS502I-E/2N)
- Identical drop-in supply flexibility between reel and tube (frente a DSPIC33EP64GS502-E/2N)
Notas de diseño
The exposed pad on the underside of the 28-UQFN (6x6 mm) package is the primary ground and thermal path. Connect it to a solid ground plane through an array of at least 4-9 thermal vias (0.3 mm drill, filled or tented). Omitting this connection is the single most common layout error with UQFN dsPIC parts - it degrades thermal performance, ground integrity for the ADC, and EMI behavior simultaneously. Follow the Microchip UQFN landing-pattern recommendation in the datasheet mechanical drawing exactly; the 6x6 UQFN has fine pitch that demands accurate stencil design (reduce stencil aperture ratio on the center pad to ~50-70% to avoid solder voiding).
Decouple VDD with a 0.1 uF ceramic capacitor placed within 2 mm of each VDD pin, plus one bulk 4.7-10 uF capacitor per supply rail. dsPIC33EP cores at 60 MIPS draw transient current on every clock edge; long, inductive traces cause VDD droop that manifests as spurious resets or ADC noise. If using the internal voltage regulator, follow the datasheet recommendation for the VCAP regulator output capacitor precisely - the wrong capacitance or ESR causes brown-out during Flash writes. Estimated: core transient currents are sub-100 mA, so a single solid ground plane is sufficient for most digital power converter layouts.
Peripheral Pin Select (PPS) on dsPIC33EP devices means default pin functions differ from generic PIC conventions - always map UART, SPI, and PWM pins explicitly in code and verify against the datasheet pin table, not against a previous project. Second pitfall: in digital power designs, keep PWM output traces short and away from ADC input nets; switching-node coupling into high-impedance sense lines corrupts the very loops the ADC samples. Third: the MCLR pin needs the datasheet-specified pull-up and capacitor; floating MCLR causes erratic reset behavior under ESD or noisy supply conditions common in SMPS environments.
Información de cumplimiento
AEC-Q100 automotive qualification and Functional Safety (FuSa) support confirmed by DigiKey and Microchip USA listings. RoHS compliance per standard Microchip current-production status; REACH and halogen-free status not stated in provided data.
