MC9S08AW60CFUE
MC9S08AW60CFUE - 40MHz 60KB Flash 8-Bit MCU | NXP
The NXP Semiconductors MC9S08AW60CFUE is an 8-bit HCS08 microcontroller with a 40 MHz CPU, 60 KB of Flash program memory, 4 KB of RAM, and a 64-pin QFP package measuring 14 mm by 14 mm. It is designed for embedded control applications that require a compact, low-cost microcontroller with integrated communication and timing peripherals. The verified product information identifies the device as part of the MC9S08AW family, using the enhanced HCS08 core and supporting industrial and automotive applications.
A microcontroller is a compact embedded-computing device that integrates a processor core, nonvolatile program memory, working memory, input/output ports, and peripherals into one package. The MC9S08AW60CFUE belongs to the HCS08 8-bit MCU hierarchy, where the CPU executes firmware from Flash while RAM supports variables, stack operations, and intermediate data. Its 40 MHz clock provides faster instruction execution than lower-frequency 8-bit designs, making it suitable for real-time control, communication, and mixed signal systems.
Key verified features include 60 KB of Flash memory, 4 KB of RAM, 38 I/O ports according to one product specification source, and connectivity including I2C, SCI, and SPI. The device also includes listed peripherals such as low-voltage detection, power-on reset, pulse-width modulation, and a watchdog timer. The 64-QFP package provides a higher pin count than small-outline packages and supports external peripheral connections, debug access, and system integration.
The MC9S08AW60CFUE uses the HCS08 instruction set with an added BGND instruction, and the verified datasheet description identifies a minimum instruction cycle time of 50 ns under the stated 2.7 V and 20 MHz bus condition. Because the device is an 8-bit MCU, its architecture is generally intended for control logic, sensor interfaces, actuator control, communications, and embedded products rather than high-end application processing.
Typical applications include industrial control panels, automotive body and accessory electronics, instrumentation, motor or relay control, sensor acquisition, serial communication gateways, and compact consumer devices. Designers should select the correct package variant, power range, peripheral configuration, and temperature grade for the target assembly.
For PCB design, preserve the manufacturer-recommended decoupling and exposed programming or debug connections, and verify signal levels against the selected HCS08AW variant. When replacing another MCU, confirm pin assignment, clock requirements, Flash/RAM sizing, peripheral mapping, and software toolchain compatibility rather than relying only on the family name.
This page consolidates verified manufacturer and distributor information, package details, lifecycle status, pricing context, and engineering selection guidance. It is intended to help engineers identify the correct MCU and plan a hardware and firmware migration without assuming that a similarly named part is automatically drop-in compatible.
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