PIC18F27K40T-I/MLVAO
PIC18F27K40T-I/MLVAO - 128KB Flash 8-bit MCU | Microchip
The Microchip Technology PIC18F27K40T-I/MLVAO is an 8-bit PIC microcontroller delivering 128KB Flash, 4KB SRAM, and 1KB EEPROM in a 28-pin VQFN (6x6 mm) package with exposed thermal pad, engineered around the eXtreme Low Power (XLP) architecture for general-purpose 5V applications. The device runs at 64MHz (16 MIPS) and integrates a 10-bit ADC with Computation (ADC2), a 5-bit DAC, two comparators, PWM, CWG (Complementary Waveform Generator), HLT (Hardware Limit Timer), WWDT (Windowed Watchdog Timer), CRC/Memory Scan, Hardware CVD, Zero-Cross Detect, and Peripheral Pin Select.
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, working RAM, data EEPROM, and a configurable peripheral set. PIC18F-series MCUs are 8-bit Harvard-architecture devices from Microchip with an enhanced instruction set, RISC-like pipeline, and a rich core-independent peripheral (CIP) ecosystem that lets analog and timing functions run without CPU intervention. Within Microchip's product hierarchy, the PIC18F27K40 sits between PIC16F baseline parts and PIC24F/dSPIC 16-bit devices, offering higher code density and stronger analog integration than PIC16F at lower cost and lower power than PIC24.
Key features include four 16-bit timers, four CCP/ECCP modules, two I2C, two SPI, one UART with LIN support, DMA-like interrupt structure, and a wide 2.3V to 5.5V operating range. The device supports up to 25mA source/sink per I/O, an internal 32kHz and 16MHz oscillator with PLL, and a vectored interrupt controller. Core-independent peripherals such as CWG and HLT let designers offload waveform generation and timing-critical events from the core.
The "MLVAO" suffix designates the automotive AEC-Q100 qualified variant in VQFN-28 packaging, the "T" denotes Tape and Reel, "I" denotes -40C to +85C industrial temperature, and the QFN (Quad Flat No-leads) exposed pad enhances thermal dissipation for high-pin-count or higher-speed designs. This combination makes it ideal for noise-sensitive or thermally constrained designs where SSOP/QFP packages are unsuitable.
Typical applications include automotive body electronics, sensor conditioning nodes, motor control (BLDC, stepper, fan), LED lighting controllers, IoT edge nodes, industrial sensor hubs, and low-power battery-powered instruments. The integrated 10-bit ADC2 with computation and Hardware CVD support enables capacitive touch sensing and signal conditioning without external analog front ends.
When designing with this part, route the exposed pad (EP) to a continuous ground plane with multiple thermal vias to maximize heat transfer. For automotive deployments, validate the AEC-Q100 qualification status against the specific revision under PPAP, and respect the MSL3 moisture sensitivity for the QFN-28 package during reflow profile programming.
This page synthesizes distributor pricing, AEC-Q100 qualified drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
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