10AS032E4F27I3SG vs 10AS048E1F29I1HG Comparación
Comparación detallada lado a lado de 10AS032E4F27I3SG por Intel y 10AS048E1F29I1HG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AS032E4F27I3SG | 10AS048E1F29I1HG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.465,00 | $1.920,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Arria 10 SX | — |
| Device Family | Arria 10 SX SoC FPGA | — |
| Logic Elements | 320,000 | 480,000 |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | Up to 1.5 GHz | Up to 1.5 GHz |
| Process Technology | 20 nm | — |
| Core Voltage (typ.) | 0.9 V | — |
| Encapsulado | 672-pin FCBGA (Flip-Chip BGA), 27 x 27 mm | 780-ball FCBGA, 29x29 mm |
| Terminal Form | Ball | Ball |
| Number of Terminals | 672 | 780 |
| Operating Temperature Grade | Industrial (-40C to +100C junction) | — |
| Tipo de montaje | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Compliance / Lead-Free | RoHS compliant, lead-free | — |
| Estado del ciclo de vida | Active | — |
| FPGA Architecture | SRAM-based, volatile configuration | — |
| Family | — | Arria 10 SX SoC FPGA |
| Process Node | — | 20 nm |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Package Code | — | BGA |
| Package Shape | — | Square |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Transceivers | — | [DATA_NEEDED: transceiver count and data rate] |
| Embedded Memory | — | [DATA_NEEDED: embedded RAM bits] |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |
| Estado RoHS | — | Compliant |