10AS048H3F34I2SG vs 10AS048E4F29I3SG Comparación
Comparación detallada lado a lado de 10AS048H3F34I2SG por Intel y 10AS048E4F29I3SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AS048H3F34I2SG | 10AS048E4F29I3SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.450,00 | $1.150,00 |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 | 480,000 |
| Process Technology | 20 nm TSMC | 20 nm TSMC |
| Core Voltage | 0.9 V | 0.9 V |
| HPS Processor | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum Processor Clock | 1.5 GHz | — |
| Encapsulado | 1152-ball FC-FBGA (35x35 mm), F34 speed grade | 780-ball FC-FBGA, F29 (29x29 mm) |
| Embedded Memory | [DATA_NEEDED: embedded SRAM Mbits] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceivers | Up to 24 GXS channels | — |
| Transceiver Data Rate | Up to 17.4 Gbps | — |
| Memory Controller | Hard DDR4/DDR3 with ECC | — |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (FC-FBGA flip-chip) |
| Nivel MSL | 3 | [DATA_NEEDED: MSL level] |
| HPS Cores | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | — | 1.5 GHz |
| Temperatura de funcionamiento | — | Industrial -40C to +100C junction |
| Transceivers Maximum Data Rate | — | 17.4 Gbps |
| Memory Interface | — | DDR3 / DDR4 with ECC via hard memory controller |
| Speed Grade | — | 3 |
| Device Grade Suffix | — | -I3SG (Industrial, Speed 3, Lead-free) |