10AX090N2F45E2LG vs 10AX090N2F45I1SG Comparación
Comparación detallada lado a lado de 10AX090N2F45E2LG por Intel y 10AX090N2F45I1SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX090N2F45E2LG | 10AX090N2F45I1SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6.095,25 | $6.450,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Embedded Memory (bits) | 59,234,304 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | [DATA_NEEDED: ALM count] |
| User I/O Pins | 768 | — |
| Core Voltage | 0.9 V | 0.9 V (nominal) |
| Transceivers | [DATA_NEEDED: transceiver count and data rate] | 24 channels, up to 17.4 Gbps |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 3,456 |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Process Technology | 20 nm | TSMC 20nm |
| Encapsulado | 1932-ball FCBGA (FBGA) | 1932-ball FCBGA (F45) |
| Package Type | Flip-Chip BGA, surface mount | — |
| Operating Temperature Grade | Enhanced (E2) | — |
| Lead-Free / RoHS | Yes (per part suffix LG) | — |
| Configuration Memory | SRAM-based, volatile (external flash required) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Estado del ciclo de vida | Active | — |
| Embedded Memory | — | 59,234,304 bits |
| Maximum User I/Os | — | 768 |
| Transceiver Protocols | — | PCIe Gen3 x8, 10GbE, CPRI, JESD204B, SATA 3.0 |
| Hard Memory Controllers | — | DDR3/DDR4 with ECC |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Estado RoHS | — | Compliant |
| Configuration Scheme | — | JTAG, Active Serial, Passive Serial |