10AX090N3F40E2LG vs 10AX090R2F40E2LG Comparación
Comparación detallada lado a lado de 10AX090N3F40E2LG por Intel y 10AX090R2F40E2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX090N3F40E2LG | 10AX090R2F40E2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2.280,00 | $2.920,00 |
| Family | Arria 10 GX | 10AX090 |
| Logic Elements | 900,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 59,234,304 bits | 25 Mbits (MLAB + block RAM, total) |
| DSP Blocks | 1,518 | 18x19 multipliers |
| User I/O Pins | 600 | — |
| Transceivers | Up to 24 full-duplex channels | 66 channels |
| Transceiver Data Rate | Up to 14.4 Gbps | Up to 12.5 Gbps (GX) |
| Hard Memory Controllers | Yes (DDR4, DDR3, QDR IV, RLDRAM 3) | — |
| Maximum DDR4 Rate | 2666 Mbps | — |
| PCIe Hard IP | PCIe Gen3 x8 (root port or endpoint) | — |
| Encapsulado | 1517-ball FCBGA, 40 mm | 1517-ball FCBGA |
| Process Technology | TSMC 20nm | 20 nm |
| Temperatura de funcionamiento | -40C to +100C (extended industrial) | — |
| Core Voltage | 0.9 V typical | 0.9 V |
| Configuration Encryption | AES-256 bitstream encryption | — |
| Partial Reconfiguration | Supported | — |
| Estado RoHS | Compliant | Compliant |
| Series | — | Arria 10 GX |
| Logic Elements (LE) | — | 900,000 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| User I/O Count | — | 342 |
| Tipo de montaje | — | Surface Mount (flip-chip BGA) |
| Speed Grade | — | -E2 (Extended, mid-tier) |
| Operating Temperature Grade | — | Extended (-E) |
| Nivel MSL | — | 3 |
| Lead-Free | — | Yes |