10AX090R3F40E2SG vs 10AX090R2F40E2LG Comparación
Comparación detallada lado a lado de 10AX090R3F40E2SG por Intel y 10AX090R2F40E2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX090R3F40E2SG | 10AX090R2F40E2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $5.400,00 | $2.920,00 |
| Family | Arria 10 GX | 10AX090 |
| Logic Elements | 900,000 | — |
| Adaptive Logic Modules (ALMs) | 339,620 | — |
| Logic Array Blocks (LABs) | 339,620 | — |
| Embedded Memory (Bits) | 59,234,304 | — |
| DSP Blocks | 2,713 (18x19 multipliers) | 18x19 multipliers |
| User I/O | 342 | — |
| Process Technology | 20 nm | 20 nm |
| Core Voltage | 0.85 V | 0.9 V |
| Auxiliary Voltage | 0.9 V | — |
| Speed Grade | -E2 (extended, mid-tier) | -E2 (Extended, mid-tier) |
| Temperature Grade | Extended (-40C to +100C) | — |
| Encapsulado | 1517-ball FCBGA, F40 (40x40 mm, 1.0 mm pitch) | 1517-ball FCBGA |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Nivel MSL | 3 (168 hours) | 3 |
| Estado RoHS | Compliant | Compliant |
| Series | — | Arria 10 GX |
| Logic Elements (LE) | — | 900,000 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| User I/O Count | — | 342 |
| Transceivers | — | 66 channels |
| Transceiver Data Rate | — | Up to 12.5 Gbps (GX) |
| Embedded Memory | — | 25 Mbits (MLAB + block RAM, total) |
| Operating Temperature Grade | — | Extended (-E) |
| Lead-Free | — | Yes |