10AX090R3F40I2LG vs 10AX090R3F40E2SG Comparación
Comparación detallada lado a lado de 10AX090R3F40I2LG por Intel y 10AX090R3F40E2SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX090R3F40I2LG | 10AX090R3F40E2SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.640,00 | $5.400,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 900,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | 339,620 |
| Embedded Block RAM (M20K) | 24.33 Mbit | — |
| MLAB Memory | [DATA_NEEDED: MLAB Kbit] | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | 2,713 (18x19 multipliers) |
| Transceivers | 24 channels | — |
| Max Transceiver Data Rate | 17.4 Gbps | — |
| Hard Processor System | Not integrated (FPGA only) | — |
| PCI Express Hard IP | Gen3 hard IP | — |
| External Memory Interface | DDR4 / DDR3 / QDRIV / RLDRAM3 | — |
| Process Technology | 20 nm | 20 nm |
| Encapsulado | 1517-BBGA, FCBGA (F40) | 1517-ball FCBGA, F40 (40x40 mm, 1.0 mm pitch) |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Logic Elements | — | 900,000 |
| Logic Array Blocks (LABs) | — | 339,620 |
| Embedded Memory (Bits) | — | 59,234,304 |
| User I/O | — | 342 |
| Core Voltage | — | 0.85 V |
| Auxiliary Voltage | — | 0.9 V |
| Speed Grade | — | -E2 (extended, mid-tier) |
| Temperature Grade | — | Extended (-40C to +100C) |
| Nivel MSL | — | 3 (168 hours) |