10AX090S2F45E1SG vs 10AX090N3F45E2LG Comparación
Comparación detallada lado a lado de 10AX090S2F45E1SG por Intel y 10AX090N3F45E2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX090S2F45E1SG | 10AX090N3F45E2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4.890,00 | $2.285,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Device | 10AX090 | — |
| Logic Elements (LE) | 900,000 | — |
| Embedded Memory | 59,234,304 bits | — |
| DSP Blocks | 1,518 (variable-precision, hard floating-point) | 768 (variable-precision, with hardened FP) |
| Transceivers | 24 channels | Multi-protocol, up to 12.5 Gbps (24 Gbps backplane on selected channels) |
| Max Transceiver Data Rate | 12.5 Gbps | — |
| Encapsulado | 1932-ball FCBGA | 1932-ball FCBGA, F45 (29 mm x 29 mm) |
| Package Code | F45 | — |
| Speed Grade | -E1 (fastest) | 3 (mid) |
| Device Variant | -S2 (lower-power core) | — |
| Operating Temperature Grade | Extended | — |
| Process Node | 20 nm TSMC | — |
| Hard PCIe Gen3 Blocks | Yes, up to 96 lanes | — |
| Configuration Method | Active serial (AS), Passive serial (PS), JTAG | — |
| Estado RoHS | Compliant | Compliant |
| Logic Elements | — | 900,000 |
| Embedded Memory Bits | — | 59,234,304 (about 59.2 Mbit) |
| Process Technology | — | 20 nm TSMC |
| Core Voltage (VCC) | — | 0.9 V |
| Hard PCIe IP | — | PCIe Gen3 x8 controller (hard IP) |
| External Memory Interface | — | DDR4 up to 1600 MHz |
| Temperature Grade | — | Extended (E2) |
| Configuration Memory | — | SRAM-based (requires external flash) |
| Toolchain | — | Intel Quartus Prime Pro Edition |