10AX090S2F45E1SG vs 10AX090S3F45E2LG Comparación
Comparación detallada lado a lado de 10AX090S2F45E1SG por Intel y 10AX090S3F45E2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX090S2F45E1SG | 10AX090S3F45E2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4.890,00 | $12.480,00 |
| Family | Arria 10 GX | — |
| Device | 10AX090 | — |
| Logic Elements (LE) | 900,000 | — |
| Embedded Memory | 59,234,304 bits | — |
| DSP Blocks | 1,518 (variable-precision, hard floating-point) | 1,518 |
| Transceivers | 24 channels | 624 (per package aggregate channels) |
| Max Transceiver Data Rate | 12.5 Gbps | — |
| Encapsulado | 1932-ball FCBGA | 1932-ball FCBGA (F45, 45mm flip-chip BGA) |
| Package Code | F45 | — |
| Speed Grade | -E1 (fastest) | S3 (-2 speed grade equivalent) |
| Device Variant | -S2 (lower-power core) | — |
| Operating Temperature Grade | Extended | — |
| Process Node | 20 nm TSMC | TSMC 20nm |
| Hard PCIe Gen3 Blocks | Yes, up to 96 lanes | — |
| Configuration Method | Active serial (AS), Passive serial (PS), JTAG | — |
| Estado RoHS | Compliant | Compliant |
| Series | — | Arria 10 GX |
| Logic Elements | — | 900,000 |
| Adaptive Logic Modules (ALMs) | — | 339,620 |
| Embedded Memory (bits) | — | 59,234,304 |
| Maximum Transceiver Data Rate | — | 17.4 Gbps (GX variant, datasheet ceiling up to 25.78 Gbps on GT) |
| Core Voltage (nominal) | — | 0.9 V |
| User I/O Banks | — | 12 |
| Maximum User I/O | — | 624 |
| Rango de temperatura de funcionamiento | — | 0C to 100C (E2 commercial) |
| Tipo de montaje | — | Surface Mount (BGA) |
| Memory Interfaces | — | DDR4 up to 2666 MT/s, DDR3, QDR IV, RLDRAM 3 |