10AX115H2F34E2SG vs 10AX115H2F34E2LG Comparación
Comparación detallada lado a lado de 10AX115H2F34E2SG por Intel y 10AX115H2F34E2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
10AX115H2F34E2LG - Arria 10 GX FPGA 1.15M LE 1152-FCBGA | Intel / Altera
10AX115H2F34E2LG ✓ ActivoComparación de especificaciones
| Parámetro | 10AX115H2F34E2SG | 10AX115H2F34E2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $5.500,00 | $5.950,00 |
| Series | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 | — |
| Embedded Memory (M20K blocks) | 2,713 blocks / 68,857,600 bits | — |
| User I/O Pins | 504 | — |
| Transceivers | 24 channels up to 14.1 Gbps | — |
| PCIe Hard IP | Gen3 x4 / Gen2 x8 | — |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore | — |
| DSP Blocks | Hardened IEEE 754 single/double-precision floating-point | — |
| 18x19 Multipliers | 2,150 | — |
| PLLs | Fractional, up to 24 | — |
| Memory Interfaces | DDR4 up to 1,600 Mbps, DDR3, QDRII+, RLDRAM3 | — |
| Encapsulado | 1152-ball FCBGA (F34) 35x35 mm | 1152-BBGA, FCBGA |
| Speed/Operating Temperature Grade | -2 / 0 C to 100 C (E2 = industrial, enhanced) | — |
| Process Node | 20 nm Tri-Gate (Intel) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Family | — | Arria 10 |
| Embedded Memory | — | 68,857,856 bits |
| User I/O Count | — | 504 |
| Core Voltage | — | 0.9 V |
| Process Technology | — | 20 nm |
| Number of Terminals | — | 1152 |
| Package Code | — | BGA |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Operating Temperature Grade | — | Industrial (E2 = -40C to +100C) |