10AX115H2F34I2LG vs 10AX115H3F34I2LG Comparación
Comparación detallada lado a lado de 10AX115H2F34I2LG por Intel y 10AX115H3F34I2LG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115H2F34I2LG | 10AX115H3F34I2LG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4.995,00 | $6.800,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Embedded Memory Bits | 68,857,560 | — |
| Maximum User I/O | 504 | — |
| Transceivers | 24 channels, up to 14.4 Gbps | — |
| Encapsulado | 1152-ball FCBGA (BBGA) | 1152-ball FCBGA |
| Process Technology | 20 nm TSMC | — |
| Core Voltage | 0.9 V (nominal) | 0.9 V |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C junction) |
| Speed Grade | -2 | H3 |
| DSP Blocks | Hard floating-point DSP | Variable-precision, floating-point capable |
| Memory Controller | Hardened external memory interface (DDR4/QDR-IV) | — |
| PCIe Hard IP | PCI Express Gen3 x8 | — |
| Configuration | FPGA (SRAM-based, volatile) | — |
| Estado RoHS | Compliant (per distributor listing) | Compliant |
| Tipo de montaje | Surface Mount (BGA) | — |
| Logic Elements (LEs) | — | 1,150,000 |
| Embedded Memory | — | 68,857,856 bits |
| User I/O Count | — | 504 |
| Transceiver Count | — | 24 |
| Maximum Transceiver Data Rate | — | 17.4 Gbps |
| DSP Performance | — | Up to 1.5 TFLOP/s (FP) |
| Hardened Memory Controllers | — | DDR4/DDR3/LPDDR3 |
| Hardened PCIe | — | PCIe Gen3 x8 |
| Hardened Ethernet MAC | — | 10G/40G/100G capable |
| Process Node | — | 20 nm |