10AX115H3F34E2LG vs 10AX115H1F34I1SG Comparación
Comparación detallada lado a lado de 10AX115H3F34E2LG por Intel y 10AX115H1F34I1SG por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | 10AX115H3F34E2LG | 10AX115H1F34I1SG |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6.550,00 | $6.500,00 |
| Family | Arria 10 GX | Arria 10 |
| Series | 10AX115 | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Embedded Memory | 68,857,856 bits (67.7 Mbit) | — |
| User I/O Count | 504 | — |
| Transceivers | Up to 17.4 Gbps (per Arria 10 datasheet) | — |
| Hard IP | PCIe Gen3 x8, 10/25/100G Ethernet MAC, DDR4 controller | — |
| DSP Blocks | Variable-precision DSP (per Arria 10 datasheet) | — |
| Process Technology | 20 nm TSMC | — |
| Core Voltage | 0.9 V | — |
| Speed Grade | E2 (commercial, mid-speed) | — |
| Encapsulado | 1152-ball FCBGA (F34), 1.0 mm pitch | — |
| Temperatura de funcionamiento | 0C to +100C (commercial) | -40C to +100C (Industrial) |
| Tipo de montaje | Surface Mount (BGA, reflow) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | MSL3 (per JEDEC J-STD-020) | — |
| Embedded Memory Bits | — | 68,857,856 |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| Number of Logic Elements / Cells | — | 1,150,000 |
| Total RAM Bits | — | 68,857,856 |
| Number of I/O | — | 504 |
| Voltage Supply | — | 0.87 V to 0.93 V core |
| Encapsulado / Carcasa | — | 1152-BBGA, FCBGA |
| Supplier Device Package | — | 1152-FCBGA (F34) |
| Process Node | — | 20 nm TSMC |
| Transceiver Data Rate | — | Up to 14.1 Gbps |
| Nivel de sensibilidad a la humedad (MSL) | — | 3 (168 hours) |
| Grade | — | Industrial |